Wireless IC device and manufacturing method thereof

• US 7,871,008 B2
• Filed: 04/30/2009
• Issued: 01/18/2011
• Est. Priority Date: 06/25/2008
• Status: Active Grant

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: Murata Manufacturing Co Limited
• Inventors: Ozawa, Masahiro, Sasaki, Yutaka, Kato, Noboru
• Primary Examiner(s): Lee; Michael G
• Assistant Examiner(s): GUDORF, LAURA A
• Application Number:
  US12/432,854
• Publication Number:
  US 20090321527A1
• Time in Patent Office: 628 Days
• Field of Search: 235/486, 235/487, 235/492
• US Class Current: 235/486
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: H01L 2224/13139 Silver [Ag] as principal constituent
• CPC Class Codes: H01L 2224/13144 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 23/13 characterised by the shape
• CPC Class Codes: H01L 23/49822 Multilayer substrates multilayer metallisation on monolayer substrate H01L23/498
• CPC Class Codes: H01L 23/49827 Via connections through the substrates, e.g. pins going through the substrate, coaxial cables H01L23/49822, H01L23/49833, H01L23/4985, H01L23/49861 take precedence
• CPC Class Codes: H01L 23/49855 for flat-cards, e.g. credit cards cards per se G06K19/00
• CPC Class Codes: H01L 24/16 of an individual bump connector
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/07802 not being an ohmic electrical conductor
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H05K 1/112 directly combined with via connections
• CPC Class Codes: H05K 1/183 Components mounted in and supported by recessed areas of the printed circuit board
• CPC Class Codes: H05K 2201/10674 Flip chip
• CPC Class Codes: H05K 2203/0278 Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
• CPC Class Codes: H05K 3/0061 onto a metallic substrate, e.g. a heat sink heat sinks for electric apparatus H05K7/20
• CPC Class Codes: Y10T 29/49124 : On flat or curved insulated base, e.g., printed circuit, etc.

Abstract

A wireless IC device includes a radiation plate, a wireless IC chip, and a substrate provided with a feed circuit that includes a resonant circuit and/or the matching circuit including an inductance element and that is electromagnetically coupled to the radiation plate. The substrate is made of a resin material. A recess is provided in a first main surface of the substrate. The substrate is provided with a wiring electrode arranged along a bottom surface and an inner circumferential surface of the recess and the first main surface of the substrate and electrically connected to the feed circuit, and a wedge member made of a different material from the resin material and extending between the bottom surface of the recess and a second main surface of the substrate spaced apart from the wiring electrode. The wireless IC chip is mounted in the recess and coupled to the wiring electrode.

Claims

1. A wireless IC device comprising:

a radiation plate;

a wireless IC chip; and

a substrate on which the wireless IC chip is mounted, the substrate being provided with a feed circuit, the feed circuit including at least one of a resonant circuit or a matching circuit, the at least one of the resonant circuit or the matching circuit including an inductance element, the feed circuit being electromagnetically coupled to the radiation plate;

wherein

the substrate is made of a resin material and includes a recess in a first main surface thereof;

the substrate is provided with a wiring electrode arranged along a bottom surface and an inner circumferential surface of the recess and on the first main surface of the substrate, the wiring electrode being electrically connected to the feed circuit;

the substrate is provided with a wedge member made of a different material from that of the resin material, the wedge member extending between the bottom surface of the recess and a second main surface of the substrate so as to be spaced apart from the wiring electrode;

the wireless IC chip is mounted in the recess and coupled to the wiring electrode; and

the wedge member is arranged to prevent return-deformation of portions of the substrate close to the recess.

2. The wireless IC device according to claim 1, wherein the wedge member is defined by a through hole passing through the substrate that is filled with a conductive material.

3. The wireless IC device according to claim 1, wherein the feed circuit is provided on at least one of the first main surface of the substrate or the second main surface thereof.

4. The wireless IC device according to claim 1, wherein the wireless IC chip is arranged such that the entire wireless IC chip is closer to the bottom surface of the recess than to an opening of the recess, the opening being provided in the first main surface of the substrate.

5. The wireless IC device according to claim 1, wherein

a plurality of the wedge members are provided and have different sizes;

and

a size of a first wedge member of the plurality of wedge members that is disposed close to a center of the bottom surface of the recess is larger than a size of a second wedge member of the plurality of wedge members that is disposed farther from the center of the bottom surface of the recess.

6. The wireless IC device according to claim 1, further comprising a protection film arranged to cover the wireless IC chip mounted in the recess.

7. A method for manufacturing a wireless IC device including a radiation plate, a wireless IC chip, and a substrate on which the wireless IC chip is mounted, the substrate being provided with a feed circuit, the feed circuit including at least one of a resonant circuit or a matching circuit, the at least one of the resonant circuit or the matching circuit including an inductance element, the feed circuit being electromagnetically coupled to the radiation plate, the method comprising the steps of:

forming a recess in the substrate made of a resin material by pressing a portion of a first main surface of the substrate and a portion of a wiring electrode, so that the wiring electrode extends along a bottom surface and an inner circumferential surface of the recess, the wiring electrode being formed in advance on the first main surface of the substrate and connected to the feed circuit;

forming a wedge member using a different material from the resin material such that the wedge member extends between the bottom surface of the recess and a second main surface of the substrate spaced apart from the wiring electrode; and

mounting the wireless IC chip in the recess so as to couple the wireless IC chip to the wiring electrode;

wherein

the wedge member is arranged to prevent return-deformation of portions of the substrate close to the recess.

8. A method for manufacturing a wireless IC device including a radiation plate, a wireless IC chip, and a substrate on which the wireless IC chip is mounted, the substrate being provided with a feed circuit, the feed circuit including at least one of a resonant circuit or a matching circuit, the at least one of the resonant circuit or the matching circuit including an inductance element, the feed circuit being electromagnetically coupled to the radiation plate, the method comprising the steps of:

forming a wedge member such that the wedge member extends between a first main surface of the substrate made of a resin material and a second main surface thereof spaced apart from a wiring electrode, the wiring electrode being formed in advance on the first main surface of the substrate and connected to the feed circuit, using a different material from the resin material;

forming a recess in the substrate by pressing a portion of the first main surface of the substrate, a portion of the wiring electrode, and the wedge member, so that the wiring electrode extends along a bottom surface and an inner circumferential surface of the recess and so that the wedge member extends between the bottom surface of the recess and the second main surface of the substrate; and

mounting the wireless IC chip in the recess so as to couple the wireless IC chip to the wiring electrode;

wherein

the wedge member is arranged to prevent return-deformation of portions of the substrate close to the recess.

9. A method for manufacturing a wireless IC device including a radiation plate, a wireless IC chip, and a substrate on which the wireless IC chip is mounted, the substrate being provided with a feed circuit, the feed circuit including at least one of a resonant circuit or a matching circuit, the at least one of the resonant circuit or the matching circuit including an inductance element, the feed circuit being electromagnetically coupled to the radiation plate, the method comprising the steps of:

forming a wedge member such that the wedge member extends between a first main surface of the substrate made of a resin material and a second main surface thereof spaced apart from a wiring electrode, using a different material different from the resin material, the wiring electrode being formed in advance on the first main surface of the substrate and connected to the feed circuit; and

forming a recess, in which the wireless IC chip is to be embedded, on the substrate by pressing the wireless IC chip against the first main surface of the substrate in a state in which the wireless IC chip is mounted on the first main surface of the substrate such that the wireless IC chip is opposed to the wiring electrode on the substrate, so that the wiring electrode extends along a bottom surface and an inner circumferential surface of the recess, and so that the wedge member extends between the bottom surface of the recess and the second main surface of the substrate;

wherein

the wedge member is arranged to prevent return-deformation of portions of the substrate close to the recess.

10. A wireless IC device comprising:

a radiation plate;

a wireless IC chip; and

a substrate on which the wireless IC chip is mounted, the substrate being provided with a feed circuit, the feed circuit including at least one of a resonant circuit or a matching circuit, the at least one of the resonant circuit or the matching circuit including an inductance element, the feed circuit being electromagnetically coupled to the radiation plate;

wherein

the substrate is made of a resin material and includes a recess in a first main surface thereof;

the substrate is provided with a wiring electrode arranged along a bottom surface of the recess and on the first main surface of the substrate, the wiring electrode being electrically connected to the feed circuit;

the substrate is provided with a wedge member made of a different material from that of the resin material, the wedge member extending between the bottom surface of the recess and a second main surface of the substrate so as to be spaced apart from the wiring electrode;

the wireless IC chip is mounted in the recess and coupled to the wiring electrode; and

the wedge member is arranged to prevent return-deformation of portions of the substrate close to the recess.

11. The wireless IC device according to claim 10, wherein the wedge member is defined by a through hole passing through the substrate that is filled with a conductive material.

12. The wireless IC device according to claim 10, wherein the feed circuit is provided on at least one of the first main surface of the substrate or the second main surface thereof.

13. The wireless IC device according to claim 10, wherein the wireless IC chip is arranged such that the entire wireless IC chip is closer to the bottom surface of the recess than to an opening of the recess, the opening being provided in the first main surface of the substrate.

14. The wireless IC device according to claim 10, wherein

a plurality of the wedge members are provided and have different sizes;

and

a size of a first wedge member of the plurality of wedge members that is disposed close to a center of the bottom surface of the recess is larger than a size of a second wedge member of the plurality of wedge members that is disposed farther from the center of the bottom surface of the recess.

15. The wireless IC device according to claim 10, further comprising a protection film arranged to cover the wireless IC chip mounted in the recess.

16. A method for manufacturing a wireless IC device including a radiation plate, a wireless IC chip, and a substrate on which the wireless IC chip is mounted, the substrate being provided with a feed circuit, the feed circuit including at least one of a resonant circuit or a matching circuit, the at least one of the resonant circuit or the matching circuit including an inductance element, the feed circuit being electromagnetically coupled to the radiation plate, the method comprising the steps of:

forming a recess in the substrate made of a resin material by pressing a portion of a first main surface of the substrate and a portion of a wiring electrode, so that the wiring electrode extends along a bottom surface of the recess, the wiring electrode being formed in advance on the first main surface of the substrate and connected to the feed circuit;

forming a wedge member using a different material from the resin material such that the wedge member extends between the bottom surface of the recess and a second main surface of the substrate spaced apart from the wiring electrode; and

mounting the wireless IC chip in the recess so as to couple the wireless IC chip to the wiring electrode;

wherein

the wedge member is arranged to prevent return-deformation of portions of the substrate close to the recess.

17. A method for manufacturing a wireless IC device including a radiation plate, a wireless IC chip, and a substrate on which the wireless IC chip is mounted, the substrate being provided with a feed circuit, the feed circuit including at least one of a resonant circuit or a matching circuit, the at least one of the resonant circuit or the matching circuit including an inductance element, the feed circuit being electromagnetically coupled to the radiation plate, the method comprising the steps of:

forming a wedge member such that the wedge member extends between a first main surface of the substrate made of a resin material and a second main surface thereof spaced apart from a wiring electrode, the wiring electrode being formed in advance on the first main surface of the substrate and connected to the feed circuit, using a different material from the resin material;

forming a recess in the substrate by pressing a portion of the first main surface of the substrate, a portion of the wiring electrode, and the wedge member, so that the wiring electrode extends along a bottom surface of the recess and so that the wedge member extends between the bottom surface of the recess and the second main surface of the substrate; and

mounting the wireless IC chip in the recess so as to couple the wireless IC chip to the wiring electrode;

wherein

the wedge member is arranged to prevent return-deformation of portions of the substrate close to the recess.

18. A method for manufacturing a wireless IC device including a radiation plate, a wireless IC chip, and a substrate on which the wireless IC chip is mounted, the substrate being provided with a feed circuit, the feed circuit including at least one of a resonant circuit or a matching circuit, the at least one of the resonant circuit or the matching circuit including an inductance element, the feed circuit being electromagnetically coupled to the radiation plate, the method comprising the steps of:

forming a wedge member such that the wedge member extends between a first main surface of the substrate made of a resin material and a second main surface thereof spaced apart from a wiring electrode, using a different material different from the resin material, the wiring electrode being formed in advance on the first main surface of the substrate and connected to the feed circuit; and

forming a recess, in which the wireless IC chip is to be embedded, on the substrate by pressing the wireless IC chip against the first main surface of the substrate in a state in which the wireless IC chip is mounted on the first main surface of the substrate such that the wireless IC chip is opposed to the wiring electrode on the substrate, so that the wiring electrode extends along a bottom surface of the recess, and so that the wedge member extends between the bottom surface of the recess and the second main surface of the substrate;

wherein

the wedge member is arranged to prevent return-deformation of portions of the substrate close to the recess.