Battery-operated wireless-communication apparatus and method

• US 7,877,120 B2
• Filed: 08/21/2008
• Issued: 01/25/2011
• Est. Priority Date: 03/24/2000
• Status: Expired due to Term

• Current Assignee: Cymbet Corporation
• Original Assignee: Cymbet Corporation
• Inventors: Jenson, Mark L., Jacobs, Harlan T., Klaassen, Jody J., Yan, Jenn-Feng
• Primary Examiner(s): Jackson; Blane J
• Application Number:
  US12/196,265
• Publication Number:
  US 20090068556A1
• Time in Patent Office: 887 Days
• Field of Search: 455/90.1, 455/90.3, 455/41.2, 455/127.1, 455/129, 455/269, 455/556.1, 455/575.1, 455/575.8, 455/576.1, 320/101, 320/107, 429/124, 429/127, 429/9, 429/163, 429/185
• US Class Current: 455/575.1
• CPC Class Codes: A61N 1/3787 from an external energy source
• CPC Class Codes: C23C 14/0031 Bombardment of substrates by reactive ion beams
• CPC Class Codes: C23C 14/0676 Oxynitrides
• CPC Class Codes: C23C 14/08 Oxides C23C14/10 takes precedence
• CPC Class Codes: C23C 16/047 using irradiation by energy or particles
• CPC Class Codes: G02F 1/13306 Circuit arrangements or driving methods for the control of single liquid crystal cells G02F1/132, G02F1/133382 take precedence
• CPC Class Codes: G02F 1/13324 Circuits comprising solar cells
• CPC Class Codes: H01G 11/08 Structural combinations, e.g. assembly or connection, of hybrid or EDL capacitors with other electric components, at least one hybrid or EDL capacitor being the main component
• CPC Class Codes: H01G 11/26 characterised by their structure, e.g. multi-layered, porosity or surface features
• CPC Class Codes: H01G 11/56 Solid electrolytes, e.g. gels; Additives therein
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/49109 outside the semiconductor or solid-state body
• CPC Class Codes: H01L 23/58 Structural electrical arrangements for semiconductor devices not otherwise provided for , e.g. in combination with batteries H01L23/49593, H01L23/49596 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/10253 Silicon [Si]
• CPC Class Codes: H01L 2924/12044 OLED
• CPC Class Codes: H01L 31/073 comprising only AIIBVI compound semiconductors, e.g. CdS/CdTe solar cells
• CPC Class Codes: H01L 31/1828 : the active layers comprising only AIIBVI compounds, e.g. CdS, ZnS, CdTe
• CPC Class Codes: H01M 10/0436 : Small-sized flat cells or batteries for portable equipment
• CPC Class Codes: H01M 10/0472 : Vertically superposed cells with vertically disposed plates
• CPC Class Codes: H01M 10/052 : Li-accumulators
• CPC Class Codes: H01M 10/0525 : Rocking-chair batteries, i.e. batteries with lithium insertion or intercalation in both electrodes; Lithium-ion batteries
• CPC Class Codes: H01M 10/0562 : Solid materials
• CPC Class Codes: H01M 10/058 : Construction or manufacture
• CPC Class Codes: H01M 10/0585 : of accumulators having only flat construction elements, i.e. flat positive electrodes, flat negative electrodes and flat separators
• CPC Class Codes: H01M 10/42 : Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells H01M10/60 takes precedence
• CPC Class Codes: H01M 10/425 : Structural combination with electronic components, e.g. electronic circuits integrated to the outside of the casing printed circuits H05K1/00
• CPC Class Codes: H01M 10/4257 : Smart batteries, e.g. electronic circuits inside the housing of the cells or batteries
• CPC Class Codes: H01M 10/4264 : with capacitors
• CPC Class Codes: H01M 10/44 : Methods for charging or discharging circuits for charging H02J7/00
• CPC Class Codes: H01M 10/46 : Accumulators structurally combined with charging apparatus circuits for charging H02J7/00
• CPC Class Codes: H01M 10/465 : with solar battery as charging system
• CPC Class Codes: H01M 14/00 : Electrochemical current or voltage generators not provided for in groups H01M6/00 - H01M12/00; Manufacture thereof
• CPC Class Codes: H01M 14/005 : Photoelectrochemical storage cells light sensitive devices H01G9/20, semiconductors sensitive to light H01L31/00
• CPC Class Codes: H01M 2004/021 : Physical characteristics, e.g. porosity, surface area
• CPC Class Codes: H01M 2008/1293 : Fuel cells with solid oxide electrolytes
• CPC Class Codes: H01M 4/0421 : involving vapour deposition
• CPC Class Codes: H01M 4/0423 : Physical vapour deposition
• CPC Class Codes: H01M 4/0426 : Sputtering
• CPC Class Codes: H01M 4/1391 : of electrodes based on mixed oxides or hydroxides, or on mixtures of oxides or hydroxides, e.g. LiCoOx
• CPC Class Codes: H01M 4/1393 : of electrodes based on carbonaceous material, e.g. graphite-intercalation compounds or CFx
• CPC Class Codes: H01M 4/1397 : of electrodes based on inorganic compounds other than oxides or hydroxides, e.g. sulfides, selenides, tellurides, halogenides or LiCoFy
• CPC Class Codes: H01M 4/382 : Lithium H01M4/405 takes precedence
• CPC Class Codes: H01M 4/405 : Alloys based on lithium
• CPC Class Codes: H01M 4/483 : for non-aqueous cells H01M4/485 takes precedence
• CPC Class Codes: H01M 4/581 : Chalcogenides or intercalation compounds thereof
• CPC Class Codes: H01M 4/5825 : Oxygenated metallic salts or polyanionic structures, e.g. borates, phosphates, silicates, olivines
• CPC Class Codes: H01M 4/587 : for inserting or intercalating light metals
• CPC Class Codes: H01M 4/8885 : Sintering or firing
• CPC Class Codes: H01M 4/9016 : Oxides, hydroxides or oxygenated metallic salts
• CPC Class Codes: H01M 50/103 : prismatic or rectangular H01M50/109, H01M50/11 take precedence
• CPC Class Codes: H01M 50/209 : adapted for prismatic or rectangular cells H01M50/216 takes precedence
• CPC Class Codes: H01M 50/403 : Manufacturing processes of separators, membranes or diaphragms
• CPC Class Codes: H01M 6/185 : with oxides, hydroxides or oxysalts as solid electrolytes
• CPC Class Codes: H01M 6/186 : Only oxysalts-containing solid electrolytes
• CPC Class Codes: H01M 6/188 : Processes of manufacture
• CPC Class Codes: H01M 6/40 : Printed batteries , e.g. thin film batteries
• CPC Class Codes: H01M 6/42 : Grouping of primary cells into batteries H01M6/40 takes precedence
• CPC Class Codes: H01M 8/1007 : with both reactants being gaseous or vaporised H01M8/12 takes precedence
• CPC Class Codes: H01M 8/1286 : Fuel cells applied on a support, e.g. miniature fuel cells deposited on silica supports
• CPC Class Codes: H04M 1/0262 : for a battery compartment
• CPC Class Codes: H05K 1/16 : incorporating printed electric components, e.g. printed resistor, capacitor, inductor
• CPC Class Codes: Y02E 10/543 : Solar cells from Group II-VI materials
• CPC Class Codes: Y02E 60/10 : Energy storage using batteries
• CPC Class Codes: Y02E 60/13 : Energy storage using capacitors
• CPC Class Codes: Y02E 60/50 : Fuel cells
• CPC Class Codes: Y02P 70/50 : Manufacturing or production processes characterised by the final manufactured product
• CPC Class Codes: Y10S 117/902 : Specified orientation, shape, crystallography, or size of seed or substrate
• CPC Class Codes: Y10T 29/49108 : Electric battery cell making
• CPC Class Codes: Y10T 29/49114 : including adhesively bonding
• CPC Class Codes: Y10T 29/49115 : including coating or impregnating
• CPC Class Codes: Y10T 29/4913 : Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/5313 : Means to assemble electrical device
• CPC Class Codes: Y10T 29/53135 : Storage cell or battery

Abstract

A combined battery and wireless-communications apparatus and method. In some embodiments, the apparatus includes a support, a first conductive layer deposited on a first surface area of the support, a thin-film battery including a cathode layer, a solid-state electrolyte layer, and an anode layer deposited such that either the anode layer or the cathode layer is in electrical contact with the first conductive layer, an antenna mounted to the support structure, and an electronic communications circuit mounted to the support and electrically coupled to the battery and the antenna to transceive radio communications. Other embodiments include an energy-receiving device mounted to the support structure, and an electronic communications circuit mounted to the support structure and including a recharging circuit, the recharging circuit electrically coupled to the battery and the energy-receiving device to recharge the battery using energy received by the energy-receiving device.

Claims

1. An apparatus, comprising:

a thin-film battery affixed to at least one surface of a substrate;

a bonding pad located on the substrate and at a position outside of a footprint of the thin-film battery on said at least one surface, the bonding pad being electrically coupled to the thin-film battery;

a protective coating located on the thin-film battery;

a device affixed to said thin-film battery via the protective coating, the protective coating being located between the thin-film battery and the device, said device being electrically coupled to the thin-film battery by a conductor coupled to the bonding pad at said position outside of the footprint of the thin-film battery; and

an encapsulant to encapsulate the device, the thin-film battery, the external conductor, and the bonding pad,

wherein said device has a lower surface affixed to a portion of said protective coating that overlies an upper portion of said thin-film battery, wherein no conductor between said device and said thin-film battery is present between said lower surface of said device and said upper portion of said thin-film battery that is overlied by said portion of said protective coating having affixed thereto said lower surface of said device.

2. The apparatus of claim 1, wherein said thin-film battery affixed to at least one surface comprises:

an anode of said thin-film battery electrically coupled to an anode current collector proximate to the at least one surface.

3. The apparatus of claim 2, wherein said anode current collector of said thin-film battery electrically coupled to the anode current collector proximate to the at least one surface comprises:

said anode of said thin-film battery electrically coupled to a conductive substance of the substrate, which is part of a semiconductor package substrate.

4. The apparatus of claim 1, wherein said thin-film battery affixed to at least one surface comprises:

a cathode of said thin-film battery electrically coupled to a cathode current collector proximate to the at least one surface.

5. The apparatus of claim 4, wherein said cathode of said thin-film battery electrically coupled to the cathode current collector proximate to the at least one surface comprises:

said cathode current collector of said thin-film battery electrically coupled to a conductive substance of the substrate, which is part of a semiconductor package substrate.

6. The apparatus of claim 1, wherein

said thin-film battery affixed to the at least one surface of the substrate is affixed to a conductive trace and at least one dielectric layer present on the surface of the substrate.

7. The apparatus of claim 6, wherein said thin-film battery affixed to the substrate comprises:

said thin-film battery affixed to a ball grid array substrate.

8. The apparatus of claim 1, wherein said thin-film battery affixed to at least one surface comprises:

said thin-film battery having a height of substantially 15 micrometers or less.

9. The apparatus of claim 1, wherein said thin-film battery affixed to at least one surface comprises:

said thin-film battery having a height substantially less than a height of an integrated circuit substrate.

10. The apparatus of claim 1, wherein said thin-film battery affixed to at least one surface comprises:

a lithium ion or lithium-free thin-film battery affixed to the at least one surface.

11. The apparatus of claim 1, wherein said device affixed to said thin-film battery comprises:

part of an integrated circuit card.

12. The apparatus of claim 1, wherein the device comprises a part of:

a computer system of a computer-system group including a handheld computer system, a personal computer system, a workstation computer system, a minicomputer system, and a mainframe computer system.

13. The apparatus of claim 1, wherein the device comprises a part of:

a wireless device of a wireless-device group including a wireless phone, a wireless handheld computer, a wireless modem, a wireless email unit, and a Global Positioning System locator.

14. The apparatus of claim 1, further comprising:

an insulating layer located between the battery and the substrate, the insulating layer having a portion extending over the substrate lateral to and external to the battery; and

a conductive trace located on the substrate between the insulating layer and the substrate, the insulating layer having an opening located in the portion that extends lateral to and external to the battery to expose a region of the conductive trace and to accommodate the bonding pad to allow electrical connection between the conductor coupled to the bonding pad and the region of the conductive trace.

15. An apparatus, comprising:

a thin-film battery affixed to a substrate;

a bonding pad located on the substrate and at a position outside of a footprint of the thin-film battery on said substrate, the bonding pad being electrically coupled to the thin-film battery;

a protective coating located on the thin-film battery;

an integrated circuit affixed to and overlying said thin-film battery via the protective coating, the protective coating being located between the thin-film battery and the integrated circuit, said integrated circuit being electrically coupled to the thin-film battery by a conductor coupled to the bonding pad at said position outside of the footprint of the thin-film battery; and

an encapsulant to encapsulate the integrated circuit, the thin-film battery, the external conductor, and the bonding pad,

wherein said integrated circuit has a lower surface affixed to a portion of said protective coating that overlies at least one upper surface of said thin-film battery, wherein no conductor between said integrated circuit and said thin-film battery is present between said lower surface of said integrated circuit and said upper surface of said thin-film battery that is overlied by said portion of said protective coating having affixed thereto said lower surface of said integrated circuit.

16. The apparatus of claim 15, wherein the substrate includes a surface having a conductive trace and at least one dielectric layer present thereon, the thin-film battery being formed over at least a portion of the conductive trace and the at least one dielectric layer.

17. The apparatus of claim 15 wherein said protective coating is an insulating layer interposed between said thin-film battery and said integrated circuit.

18. The apparatus of claim 15, wherein

said thin-film battery has a height substantially less than a height of an integrated circuit substrate.

19. The apparatus of claim 15, wherein said thin-film battery comprises:

a lithium ion or lithium-free thin-film battery.

20. The apparatus of claim 15, wherein said integrated circuit affixed to and overlying said thin-film battery comprises:

part of an integrated circuit card.

21. The apparatus of claim 15, further comprising:

an insulating layer located between the battery and the substrate, the insulating layer having a portion extending over the substrate lateral to and external to the battery; and

a conductive trace located on the substrate between the insulating layer and the substrate, the insulating layer having an opening located in the portion that extends laternal to and external to the battery to expose a region of the conductive trace and to accommodate the bonding pad to allow electrical connection between the conductor coupled to the bonding pad and the region of the conductive trace.

22. An apparatus, comprising:

a thin-film battery affixed to at least one surface of a substrate;

a protective coating located on the thin-film battery;

a device affixed to the thin-film battery via the protective coating, and electrically coupled to the thin-film battery at a position lateral to said device and to said thin-film battery through a conductor external to the thin-film battery and to the device; and

an encapsulant to encapsulate the device and the external conductor,

wherein said device has a lower surface affixed to a portion of said protective coating that overlies an upper portion of said thin-film battery, wherein no conductor between said device and said thin-film battery is present between said lower surface of said device and said upper portion of said thin-film battery that is overlied by said portion of said protective coating having affixed thereto said lower surface of said device.

23. The apparatus of claim 22, further comprising:

an insulating layer located between the battery and the substrate, the insulating layer having a portion extending over the substrate lateral to and external to the battery; and

a conductive trace located on the substrate between the insulating layer and the substrate, the insulating layer having an opening located in the portion that extends lateral to and external to the battery to receive the conductor and to allow electrical connection between the conductor and conductive trace.

24. The apparatus of claim 22, further comprising a bonding pad located at a position outside of a footprint of the battery on said at least one surface and onto which the external conductor is electrically coupled, the encapsulant further encapsulating the bonding pad.

25. The apparatus of claim 22 wherein the encapsulant further encapsulates at least a portion of the battery and substantially most of the external conductor.

26. The apparatus of claim 22 wherein said device is part of an integrated circuit card.