Implantable medical device with a nonhermetic battery

• US 7,881,796 B2
• Filed: 07/31/2007
• Issued: 02/01/2011
• Est. Priority Date: 05/16/2003
• Status: Expired due to Fees

• Current Assignee: Medtronic Incorporated (Medtronic Plc)
• Original Assignee: Medtronic Incorporated (Medtronic Plc)
• Inventors: Skime, Robert M., Scott, Erik R., Schmidt, Craig L., Wahlstrand, Carl D.
• Primary Examiner(s): Layno; Carl H
• Assistant Examiner(s): PATEL, NATASHA
• Application Number:
  US11/831,333
• Publication Number:
  US 20080021511A1
• Time in Patent Office: 1,281 Days
• Field of Search: 607/36, 607/37, 607/63, 607/116, 607/119, 174/50.5, 257/682, 200/216, 521/40
• US Class Current: 607/36
• CPC Class Codes: A61N 1/37514 Brain implants
• CPC Class Codes: A61N 1/378 Electrical supply

Abstract

An implantable medical device (IMD) including a nonhermetic battery is described. The IMD includes components and a power source module that includes the nonhermetic battery. The IMD also includes a barrier to substantially impede movement of substances from the nonhermetic battery to the components. The barrier may include a hermetic feedthrough, a gel, a polymer, or a solid electrolyte within the nonhermetic battery, and a seal member. The barrier may also be a material that encapsulates the nonhermetic battery and a getter within the IMD. In some embodiments, the IMD comprises a modular IMD including an interconnect member. In that case, the barrier may include a material that fills at least a portion of a void defined by the interconnect member. A length and a cross-sectional area of the interconnect member may also act as a barrier.

Claims

1. A method of manufacturing an implantable medical device, the method comprising:

forming a control module including components;

forming a control module housing to house the components;

forming a power source module including a nonhermetic battery and power management circuitry;

forming a power source module housing to house the nonhermetic battery and the power management circuitry, wherein the nonhermetic battery is not enclosed in a hermetic housing within the power source module; and

forming an interconnect member to couple the control module and the power source module, the interconnect member including an electrical conductor that extends through the interconnect member to deliver power from the nonhermetic battery to the components.

2. The method of claim 1, further comprising housing the nonhermetic battery within a nonhermetic housing included in the power source module housing.

3. The method of claim 1, Further comprising forming a barrier between the components and the nonhermetic battery that substantially impedes movement of substances from the nonhermetic battery to the components.

4. The method of claim 3, wherein the barrier comprises a hermetic fcedthrough.

5. The method of claim 3, wherein the barrier comprises a length and cross-sectional area of the interconnect member.

6. The method of claim 3, wherein the barrier comprises a seal member positioned within the interconnect member.

7. The method of claim 3, wherein forming the interconnect member includes defining a void through which the electrical conductor extends, wherein the barrier comprises a material that tells at least a portion of the interconnect member void.

8. The method of claim 3, wherein the barrier comprises a material that substantially encapsulates at least a portion of the nonhermetic battery within the power source module housing.

9. The method of claim 3, wherein the barrier comprises a getter within at least one of the power source module housing, the interconnect member or the control module housing.

10. The method of claim 3, wherein the barrier comprises one of a gel, a polymer, or a solid electrolyte within the nonhermetic battery.

11. The method of claim 1, further comprising forming a feedthrough, through which the electrical conductor extends, as a part of the power source module housing.

12. The method of claim 11, wherein forming the power source module housing includes forming an interlace area of the power source module housing with the interconnect member that comprises a thickness at least as thick as an outside cross-sectional area of the feedthrough.

13. The method of claim 1, further comprising forming a feedthrough, through which the electrical conductor extends, as a part of the control module housing.

14. The method of claim 13, wherein forming the interconnect member includes forming an interface area of the interconnect member with the control module housing that comprises a thickness at least as thick as an outside cross-sectional area of the feedthrough.

15. The method of claim 1, further comprising forming the power source module housing and the interconnect member to comprise thicknesses less than an outside cross-sectional area of a feedthrough through which the electrical conductor extends.

16. The method of claim 1, wherein the components comprise control electronics.

17. A method of manufacturing an implantable medical device, the method comprising:

forming a control module including components;

forming a control module housing to house the components;

forming a power source module including a nonhermetic battery and power management circuitry;

forming a power source module housing to house the nonhermetic battery and the power management circuitry, the nonhermetic battery is not enclosed in a hermetic housing within the power source module;

forming an interconnect member to couple the control module housing and the power source module housing; and

forming a barrier between the components and the nonhermetic battery that is separate from any housing and that substantially impedes movement of substances from the nonhermetic battery through the interconnect member to the components.

18. The method of claim 17, wherein the interconnect member includes an electrical conductor that delivers power from the nonhermetic battery to the components.

19. The method of claim 17, wherein the barrier comprises a seal member positioned within the interconnect member.

20. The method of claim 17, wherein the barrier comprises a material that substantially encapsulates at least a portion of the nonhermetic battery within the power source module housing.