Transfer tape strap process

• US 7,884,726 B2
• Filed: 11/25/2009
• Issued: 02/08/2011
• Est. Priority Date: 04/10/2006
• Status: Expired due to Fees

• Current Assignee: CHECKPOINT SYSTEMS, INC. (CCL Industries Incorporated)
• Original Assignee: CHECKPOINT SYSTEMS, INC. (CCL Industries Incorporated)
• Inventors: Duschek, Detlef, Cote, Andre
• Primary Examiner(s): Parker; Kenneth A
• Assistant Examiner(s): Diaz; Jose R
• Application Number:
  US12/626,170
• Publication Number:
  US 20100083493A1
• Time in Patent Office: 440 Days
• Field of Search: 340/572.7, 340/572.8
• US Class Current: 340/572.7
• CPC Class Codes: G06K 19/07718 the record carrier being manufactured in a continuous process, e.g. using endless rolls
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/0775 arrangements for connecting the integrated circuit to the antenna
• CPC Class Codes: G08B 13/2414 using inductive tags
• CPC Class Codes: G08B 13/2417 having a radio frequency identification chip
• CPC Class Codes: G08B 13/2437 Tag layered structure, processes for making layered tags
• CPC Class Codes: H01L 21/4853 Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: H01L 2221/68345 used as a support during the manufacture of self supporting substrates
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device antennas per se H01Q
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/838 Bonding techniques
• CPC Class Codes: H01L 23/49855 for flat-cards, e.g. credit cards cards per se G06K19/00
• CPC Class Codes: H01L 24/29 of an individual layer connector
• CPC Class Codes: H01L 24/83 using a layer connector
• CPC Class Codes: H01L 2924/01004 Beryllium [Be]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01027 Cobalt [Co]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01072 : Hafnium [Hf]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/0781 : being an ohmic electrical conductor
• CPC Class Codes: H01L 2924/07811 : Extrinsic, i.e. with electrical conductive fillers
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19042 : being an inductor
• CPC Class Codes: H01L 2924/30105 : Capacitance
• CPC Class Codes: Y10T 29/4913 : Assembling to base an electrical component, e.g., capacitor, etc.

Abstract

A method for efficiently producing a plurality of EAS or RFID tags or inlays that form a label ready for use. The process utilizes a first web of RFID chip straps or capacitor straps that are releasably secured to a liner using only a low tack adhesive and utilizes a second web of coils or antennas which are secured to a second liner. After indexing these two webs, selective heat and pressure are applied to the chips straps or to the capacitor straps to transfer them and electrically couple them to a corresponding coil or antenna. Where both chip straps and capacitor straps are applied to a common antenna, a third web of the additional strap is used in the process.

Claims

1. A method for forming a plurality of security tags, said method comprising:

providing a first web comprising a plurality of capacitor straps on a first liner, each of said capacitor straps comprising a thin, generally planar member comprising a first electrically conductive planar element, a second planar electrically conductive element and a planar dielectric layer disposed between at least portions of said first and second electrically conductive planar elements, whereupon said capacitor strap exhibits a desired capacitance, each of said capacitor straps being secured to a first side of a non-conductive layer via an adhesive positioned on an exposed side of said first or second electrically conductive planar elements and on an exposed side of said planar dielectric layer and wherein a second side of said non-conductive layer is releasably secured to said first liner and wherein each of said capacitor straps is separated from adjacent straps;

providing a second web of a plurality of antennas or coils on a second liner;

indexing said first and second webs so that one of said capacitor straps is aligned with a corresponding one of said plurality of antennas or one of said plurality of coils; and

applying selective heat and pressure to each of said capacitor straps to release said capacitor strap from said first liner while electrically connecting said capacitor strap to said corresponding one of said plurality of antennas or of said plurality of coils to form a security tag.

2. The method of claim 1 wherein each one of said capacitor straps is adhesively secured to said first liner using a low tack adhesive.

3. The method of claim 2 wherein said step of providing a first web comprises applying an adhesive on conductive elements on each of said capacitor straps.

4. The method of claim 3 wherein said step of indexing said first and second webs comprises orienting said webs so that said adhesive on said exposed sides contacts said corresponding one of said plurality of antennas or of said plurality of coils.

5. The method of claim 4 wherein said step of applying selective heat and pressure comprises directly applying heat and pressure against said first liner at a location corresponding to a portion of said conductive elements.

6. The method of claim 5 further comprising the step of taking up a portion of said first liner corresponding to said capacitor strap that is released therefrom.

7. The method of claim 5 wherein said step of directly applying heat and pressure against said first liner comprises crimping said conductive elements of said capacitor strap to said corresponding one of said plurality of antennas or of said plurality of coils.

8. The method of claim 5 wherein said step of directly applying heat and pressure against said first liner comprises using heating elements and a roller.

9. The method of claim 2 wherein said step of providing a second web of a plurality of antennas or coils on a second liner comprises applying a conductive adhesive on each of said plurality of antennas or coils to where each of said capacitor straps are to be connected.

10. A method for forming a plurality of RFID tags or inlays, said method comprising:

providing a first web comprising a plurality of RFID chip straps on a first liner, each of said RFID chip straps comprising a thin, generally planar member comprising a first electrically conductive planar element, a second electrically conductive planar element and an integrated circuit being electrically connected to respective ends of said conductive elements, and each of said chip straps being secured to a first side of a first non-conductive layer via an adhesive positioned on an exposed side of said first and second electrically conductive planar elements and wherein a second side of said first non-conductive layer is releasably secured to said first liner and wherein each of said chip straps is separated from adjacent chip straps;

providing a second web comprising a plurality of capacitor straps on a second liner, each of said capacitor straps comprising a thin, generally planar member comprising a first electrically conductive planar element, a second planar electrically conductive element and a planar dielectric layer disposed between at least portions of said first and second electrically conductive planar elements, whereupon said capacitor strap exhibits a desired capacitance, each of said capacitor straps being secured to a first side of a second non-conductive layer via an adhesive positioned on an exposed side of said first or second electrically conductive planar element and on an exposed side of said planar dielectric layer and wherein a second side of said second non-conductive layer is releasably secured to said second liner and wherein each of said capacitor straps is separated from adjacent capacitor straps;

providing a third web of a plurality of antennas or coils on a third liner;

indexing said first and third webs so that one of said chip straps is aligned with a corresponding one of said plurality of antennas or one of said plurality of coils;

applying selective heat and pressure to each of said chip straps to release said chip strap from said first liner while electrically coupling said chip strap to said corresponding one of said plurality of antennas or of said plurality of coils;

indexing said second and third webs so that one of said capacitor straps is aligned with said corresponding one of said plurality of antennas or one of said plurality of coils; and

applying selective heat and pressure to each of said capacitor straps to release said capacitor strap from said second liner while electrically connecting said capacitor strap to said corresponding one of said plurality of antennas or of said plurality of coils to form an RFID tag or inlay.

11. The method of claim 10 wherein each one of said chip straps and said capacitor straps are adhesively secured to said first and second liners, respectively, using a low tack removable adhesive.

12. The method of claim 11 wherein said steps of providing a first web and a second web comprises applying a conductive adhesive on conductive elements of each of said chip straps and on each of said capacitor straps.

13. The method of claim 12 wherein said step of indexing said first and second webs comprises orienting said webs so that said conductive adhesive on said conductive elements contacts said corresponding one of said plurality of antennas or of said plurality of coils.

14. The method of claim 13 wherein said step of applying selective heat and pressure comprises directly applying heat and pressure against said first liner at a location corresponding to a portion of said conductive elements of said chip strap and against said second liner at a location corresponding to a portion of said conductive elements of said capacitor strap.

15. The method of claim 14 further comprising the step of taking up a portion of said first liner corresponding to said chip strap and a portion of said second liner corresponding to said capacitor strap that are released from their respective liners.

16. The method of claim 14 wherein said step of directly applying heat and pressure against said first liner comprises crimping said conductive elements of said chip strap, and crimping said conductive elements of said capacitor strap, to said corresponding one of said plurality of antennas or of said plurality of coils.

17. The method of claim 14 wherein said step of directly applying heat and pressure against said first liner and against said second liner comprises using heating elements and a roller.

18. The method of claim 10 wherein said step of providing a third web of a plurality of antennas or coils on a third liner comprises applying a conductive adhesive on each of said plurality of antennas or coils to where each of said chip straps and each of said capacitor straps are to be connected.