×

Thermal liquid flow sensor and method of forming same

  • US 7,892,488 B2
  • Filed: 02/10/2006
  • Issued: 02/22/2011
  • Est. Priority Date: 02/10/2006
  • Status: Active Grant
First Claim
Patent Images

1. A thermal liquid flow sensor, comprising:

  • a microsensor die comprising;

    a substrate;

    a heater disposed on said substrate;

    at least one pair of temperature sensing elements disposed on said substrate; and

    a hydrophilic layer comprising a fluorine-containing polymer, said fluorine-containing polymer having a hydrophilic functional group, and said hydrophilic layer being disposed on a surface region of said sensor die, said hydrophilic layer covering said at least one said temperature sensing elements and/or said heater.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×