Semiconductor module

• US 7,902,653 B2
• Filed: 04/28/2008
• Issued: 03/08/2011
• Est. Priority Date: 05/18/2007
• Status: Active Grant

• Current Assignee: Fuji Electric Company Limited (Fuji Electric Systems Company Limited)
• Original Assignee: Fuji Electric Systems Company Limited
• Inventors: Maruyama, Rikihiro, Mochizuki, Eiji, Nishizawa, Tatsuo, Horio, Masafumi
• Primary Examiner(s): Bryant; Kiesha R
• Assistant Examiner(s): Yang; Minchul
• Application Number:
  US12/149,114
• Publication Number:
  US 20080284007A1
• Time in Patent Office: 1,044 Days
• Field of Search: 257/687, 257/700, 257/732, 257/733, 257/E23.116
• US Class Current: 257/687
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 23/3121 a substrate forming part of the encapsulation
• CPC Class Codes: H01L 25/072 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/1305 Bipolar Junction Transistor [BJT]
• CPC Class Codes: H01L 2924/13055 Insulated gate bipolar transistor [IGBT]
• CPC Class Codes: H01L 2924/13091 Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01L 2924/3511 Warping

Abstract

A semiconductor module includes a first metal foil; an insulating sheet mounted on a top surface of the first metal foil; at least one second metal foil mounted on a top surface of the insulating sheet; at least one semiconductor device mounted on the second metal foil; and a resin case for surrounding the first metal foil, insulating sheet, second metal foil, and semiconductor device. A bottom end of a peripheral wall of the resin case is located above a bottom surface of the first metal foil. A resin is provided inside the resin case to fill the inside of the resin case. The bottom surface of the first metal foil and the resin form a flat bottom surface so that the flat bottom surface contacts an external mounting member.

Claims

1. A semiconductor module comprising:

a first metal foil;

an insulating sheet mounted on a top surface of the first metal foil;

at least one second metal foil mounted on a top surface of the insulating sheet;

at least one semiconductor device mounted on the at least one second metal foil;

a resin case for surrounding the first metal foil, at least one second metal foil, the insulating sheet, and the at least one semiconductor device, said resin case having a peripheral wall with a bottom end located above a bottom surface of the first metal foil;

resin filling a space inside the resin case relative to the first metal foil, at least one second metal foil, the insulating sheet and the at least one semiconductor device, wherein the bottom surface of the first metal foil and the resin form a flat bottom surface to contact an external mounting member; and

a fastening portion integrally formed with the resin case at a periphery thereof, said fastening portion being filled with the resin and having a hole penetrating the fastening portion and the resin inside the resin case.

2. A semiconductor module according to claim 1, wherein the resin comprises an epoxy resin as a main component.

3. A semiconductor module according to claim 1, wherein the resin case includes at least one protruding portion on an inner surface thereof.

4. A semiconductor module according to claim 1, wherein said first .and second metal foils have thermal expansion coefficients substantially same as that of the resin inside the resin case.

5. A semiconductor module according to claim 1, further comprising a thermal compound provided on a bottom surface of the first metal foil so that a cooling effect is enhanced.

6. A semiconductor module according to claim 1, wherein the resin case comprises a one-piece case.

7. A semiconductor module according to claim 1, wherein the resin case comprises a resin-inflow opening in an upper face of said resin case.