Method of manufacturing an ultrasound probe transducer assembly

• US 7,908,721 B2
• Filed: 06/11/2007
• Issued: 03/22/2011
• Est. Priority Date: 08/23/2005
• Status: Active Grant

• Current Assignee: W. L. Gore & Associates (W.L. Gore & Associates)
• Original Assignee: Gore Enterprise Holdings Incorporated
• Inventors: Donhowe, Mark Nathaniel, Zipparo, Michael Joseph, Oakley, Clyde Gerald, LaBree, Michael Robert, Dietz, Dennis Raymond, Johnson, Monica Page
• Primary Examiner(s): TUGBANG, ANTHONY D
• Application Number:
  US11/761,248
• Publication Number:
  US 20070226976A1
• Time in Patent Office: 1,380 Days
• Field of Search: 29/253.5, 295/94, 298/46, 298/47, 294/12, 294/17, 310/334, 310/348
• US Class Current: 29/25.35
• CPC Class Codes: A61B 8/4483 characterised by features of the ultrasound transducer
• CPC Class Codes: A61B 8/4494 characterised by the arrangement of the transducer elements devices for short-range imaging using particular transducer elements arrangements under G01S15/8909; arrangements of transducers in generation of mechanical vibrations of infrasonic, sonic or ultrasonic frequency B06B1/0607
• CPC Class Codes: B06B 1/0629 Square array
• CPC Class Codes: Y10T 29/42 Piezoelectric device making
• CPC Class Codes: Y10T 29/49005 Acoustic transducer
• CPC Class Codes: Y10T 29/49007 Indicating transducer
• CPC Class Codes: Y10T 29/49156 with selective destruction of conductive paths
• CPC Class Codes: Y10T 29/49789 Obtaining plural product pieces from unitary workpiece
• CPC Class Codes: Y10T 29/49798 Dividing sequentially from leading end, e.g., by cutting or breaking

Abstract

An improved ultrasound transducer assembly, e.g. a thickness-mode transducer assembly includes a plurality of elements comprising piezoelectric material, and a backing material disposed adjacent to a back surface of the plurality of elements. The piezoelectric material and backing material define at least a portion of a side surface, wherein an electrically conductive material is disposed upon and in contact with at least a portion of the side surface. The elements may comprise one or a plurality of front electrodes, and one or a plurality of back electrodes, wherein the front electrode(s) is electrically interconnected to the electrically conductive material disposed on the side surface portion. In a mass processing method, a plurality of thickness-mode ultrasound probe transducer assemblies may be produced, wherein a plurality of interconnected transducer subassemblies comprising a mass backing are processed in tandem.

Claims

1. A method for producing a transducer assembly for an ultrasound probe, comprising:

providing piezoelectric material on a front side of backing material, wherein said piezoelectric material and said backing material define at least a portion of a side surface;

disposing electrically conductive material on at least said portion of said side surface, wherein said disposing step includes at least one of;

depositing said electrically conductive material on said piezoelectric material and said backing material by a metallization process; and

applying a curable conductive material on said piezoelectric material and said backing material, and curing said curable conductive material;

disposing electrically conductive material on at least a portion of a front side of said piezoelectric material; and

separating said piezoelectric material together with said electrically conductive material disposed on said at least said portion of the front side thereof to define a plurality of elements, wherein each of said plurality of elements includes a first electrode defined by the separated electrically conductive material disposed on the front side of the piezoelectric material.

2. A method as recited in claim 1, further comprising:

disposing electrically conductive material on one of a front surface of said backing material and a back surface of said piezoelectric material.

3. A method as recited in claim 2, wherein said disposing said electrically conductive material on one of said front surface of said backing material and said back surface of said piezoelectric material further comprises:

depositing said electrically conductive material on said one of said front surface of said backing material and said back surface of said piezoelectric material by a metallization process; and

removing a portion of said electrically conductive material on said one of said front surface of said backing material and said back surface of said piezoelectric material to electrically isolate said deposited electrically conductive material on said one of said front surface of said backing material and said back surface of said piezoelectric material from the disposed electrically conductive material on at least said portion of said side surface.

4. A method as recited in claim 2, wherein said separating step further includes:

separating said electrically conductive material disposed on said one of said front surface of said backing material and said back surface of said piezoelectric material together with said piezoelectric material and said electrically conductive material disposed on the front side of said piezoelectric material, wherein each of said plurality of elements further includes a second electrode defined by said separated electrically conductive material disposed on said one of said front surface of said backing material and said back surface of said piezoelectric material.

5. A method as recited in claim 4, further comprising:

embedding a plurality of electrically conductive pathways within the backing material, wherein said plurality of electrically conductive pathways extend from a back surface of the backing material to the second electrode of different ones of said plurality of elements.

6. A method as recited in claim 5, wherein said backing material includes at least a first backing member and a second backing member, and wherein said embedding step further comprises:

disposing electrically conductive material on at least a portion of a side surface of at least one of said first backing member and said second backing member to define said plurality of electrically conductive pathways; and

interconnecting said first backing member and said second backing member.

7. A method as recited in claim 6, wherein said embedding said plurality of said electrically conductive paths further comprises:

depositing said electrically conductive material on said at least a said portion of said side surface of at least one of the first backing member and the second backing member by a metallization process; and

removing portions of said electrically conductive material on said at least said portion of said side surface of at least one of the first backing member and the second backing member to define said plurality of electrically conductive pathways.

8. A method as recited in claim 6, wherein at least one of:

said disposing electrically conductive material on at least said portion of said side surface of at least one of said first backing member and second backing member; and

disposing said electrically conductive material on one of said front surface of said backing material and said back surface of said piezoelectric material, comprises;

depositing electrically conductive material by at least one metallization process selected from the group consisting of sputtering, vapor deposition, electroplating and electrolysis.

9. A method as recited in claim 8, wherein at least one of:

said disposing electrically conductive material on at least said portion of said side surface of at least one of said first backing member and second backing member; and

disposing said electrically conductive material on one of said front surface of said backing material and said back surface of said piezoelectric material, comprises;

applying a curable conductive material on said piezoelectric material and said backing material; and

curing said curable conductive material.

10. A method as recited in claim 4, further comprising:

applying acoustic matching material to a front surface of said electrically conductive material disposed on said front side of said piezoelectric material.

11. A method as recited in claim 10, wherein said separating step further includes:

separating said acoustic matching material together with said electrically conductive material disposed on said portion of said front side of the piezoelectric material, said piezoelectric material, and said electrically conductive material disposed on said one of said front surface of said backing material and said back surface of said piezoelectric material, wherein each of said plurality of elements further includes an acoustic matching layer defined by said separated acoustic matching material.

12. A method as recited in claim 1, wherein said disposing said electrically conductive material on at least said portion of said side surface includes:

completing both of said steps of depositing said electrically conductive material and applying said curable conductive material.

13. A method as recited in claim 1, wherein said electrically conductive material disposed on at least said portion of said side surface includes a plurality of electrically conductive layers that are at least one of directly adjacent to one another and at least partially overlaid.

14. A method as recited in claim 1, wherein said electrically conductive material disposed on at least said portion of said side surface includes:

depositing a first metal layer by a metallization process.

15. A method as recited in claim 14, wherein said electrically conductive material disposed on at least said portion of said surface further comprises:

depositing a second metal layer by a metallization process.

16. A method as recited in claim 14, wherein said electrically conductive material disposed on at least said portion of said side surface further comprises:

applying a curable conductive material; and

curing said curable conductive material.