System for inspecting electromagnetic coupling modules and radio IC devices and method for manufacturing electromagnetic coupling modules and radio IC devices using the system

• US 7,932,730 B2
• Filed: 11/20/2008
• Issued: 04/26/2011
• Est. Priority Date: 06/12/2006
• Status: Active Grant

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: Murata Manufacturing Co Limited
• Inventors: Dokai, Yuya, Kato, Noboru
• Primary Examiner(s): Nguyen; Vincent Q
• Application Number:
  US12/274,400
• Publication Number:
  US 20090066592A1
• Time in Patent Office: 887 Days
• Field of Search: 324/537, 324/76.11, 324/512, 343/703
• US Class Current: 324/537
• CPC Class Codes: G01R 1/07 Non contact-making probes
• CPC Class Codes: G01R 31/315 by inductive methods
• CPC Class Codes: G06K 7/0008 General problems related to the reading of electronic memory record carriers, independent of its reading method, e.g. power transfer
• CPC Class Codes: G06K 7/10316 using at least one antenna particularly designed for interrogating the wireless record carriers antennas in general H01Q1/22
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: Y10T 29/49002 Electrical device making

Abstract

A system for inspecting an electromagnetic coupling module includes a radio IC chip and a feeder circuit board on which the radio IC chip is mounted, the feeder circuit board includes a feeder circuit including an inductance element. This inspecting system measures the electromagnetic coupling module by electromagnetically coupling a probe of a measuring device to the electromagnetic coupling module by at least one of electrostatic coupling and electromagnetic coupling. In addition, the electromagnetic coupling modules are manufactured using this inspecting system.

Claims

1. A system for inspecting an electromagnetic coupling module including a radio IC chip and a feeder circuit board on which the radio IC chip is mounted, the feeder circuit board having a feeder circuit including an inductance element disposed thereon, the system comprising:

a measuring device including a probe;

wherein

the electromagnetic coupling module is measured by electromagnetically coupling the probe of the measuring device to the electromagnetic coupling module by at least one of electrostatic coupling and electromagnetic coupling; and

a metallic film is disposed between the probe of the measuring device and the electromagnetic coupling module, and the probe of the measuring device is electrically connected to the metallic film.

2. The system for inspecting electromagnetic coupling modules according to claim 1, wherein a top portion of the probe of the measuring device is a substantially flat plate.

3. The system for inspecting electromagnetic coupling modules according to claim 1, wherein a top portion of the probe of the measuring device is substantially coil shaped.

4. The system for inspecting electromagnetic coupling modules according to claim 1, wherein the metallic film is disposed on an insulating film.

5. The system for inspecting electromagnetic coupling modules according to claim 1, wherein a coil conductor is disposed between the probe of the measuring device and the electromagnetic coupling module and the probe of the measuring device is electrically connected to the coil conductor.

6. The system for inspecting electromagnetic coupling modules according to claim 5, wherein the coil conductor is disposed on an insulating film.

7. A method for manufacturing electromagnetic coupling modules, the method comprising the steps of:

providing the system for inspecting an electronic coupling module according to claim 1;

forming a plurality of electromagnetic coupling modules on a mother board by providing a plurality of feeder circuits including an inductance element in the mother board and mounting a radio IC chip on each of the plurality of feeder circuits provided in the mother board;

individually inspecting the plurality of electromagnetic coupling modules on the mother board using the system for inspecting an electromagnetic coupling module; and

separating the plurality of electromagnetic coupling modules on the mother board from each other.

8. A method for manufacturing electromagnetic coupling modules, the method comprising the steps of:

providing the system for inspecting an electronic coupling module according to claim 1;

forming a plurality of electromagnetic coupling modules on a mother board by providing a plurality of feeder circuits including an inductance element in the mother board and mounting a radio IC chip on each of the plurality of feeder circuits provided in the mother board;

attaching the mother board onto an adhesive sheet and separating the electromagnetic coupling modules from each other; and

individually inspecting the plurality of electromagnetic coupling modules using the system for inspecting an electromagnetic coupling module.

9. A method for manufacturing electromagnetic coupling modules, the method comprising the steps of:

providing the system for inspecting an electronic coupling module according to claim 1;

forming a plurality of electromagnetic coupling modules on a mother board by providing a plurality of feeder circuits including an inductance element in the mother board and mounting a radio IC chip on each of the plurality of feeder circuits provided in the mother board;

attaching the mother board onto an adhesive sheet, separating the plurality of electromagnetic coupling modules from each other, and then increasing intervals between the plurality of electromagnetic coupling modules adjacent to each other by expanding the adhesive sheet; and

individually inspecting the plurality of electromagnetic coupling modules using the system for inspecting an electromagnetic coupling module.

10. A system for inspecting an electromagnetic coupling module including a radio IC chip and a feeder circuit board on which the radio IC chip is mounted, the feeder circuit board having a feeder circuit including an inductance element disposed thereon, the system comprising:

a measuring device including a probe;

wherein

the electromagnetic coupling module is measured by electromagnetically coupling the probe of the measuring device to the electromagnetic coupling module by at least one of electrostatic coupling and electromagnetic coupling; and

quality of a radio IC device including the electromagnetic coupling module and a radiator arranged to be coupled to the electromagnetic coupling module by at least one of electrical-field coupling and magnetic-field coupling is inspected based on measurement data of the system for inspecting electromagnetic coupling modules.

11. A system for inspecting a radio IC device including a radio IC chip and a radiator, the system comprising:

a measuring device including a probe;

wherein

the radio IC device is measured by electromagnetically coupling the probe of the measuring device to a portion of the radiator by at least one of electrostatic coupling and electromagnetic coupling; and

a metallic film is disposed between the probe of the measuring device and the radio IC device and the probe of the measuring device is electrically connected to the metallic film.

12. The system for inspecting radio IC devices according to claim 11, wherein a top portion of the probe of the measuring device is a substantially flat plate.

13. The system for inspecting radio IC devices according to claim 11, wherein a top portion of the probe of the measuring device is substantially coil shaped.

14. The system for inspecting radio IC devices according to claim 11, wherein the metallic film is disposed on an insulating film.

15. The system for inspecting radio IC devices according to claim 11, wherein a coil conductor is disposed between the probe of the measuring device and the radio IC device and the probe of the measuring device is electrically connected to the coil conductor.

16. The system for inspecting radio IC devices according to claim 15, wherein the coil conductor is disposed on an insulating film.

17. A method for manufacturing radio IC devices, the method comprising:

providing the system for inspecting a radio IC device according to claim 11;

forming a plurality of radio IC devices;

inspecting the plurality of radio IC devices using the system for inspecting a radio IC device; and

separating the plurality of radio IC devices from each other.

18. A system for inspecting a radio IC device including a radio IC chip, a feeder circuit board on which the radio IC chip mounted is mounted, the feeder circuit board includes a feeder circuit including an inductance element, and a radiator that is attached to the feeder circuit board and arranged to radiate a transmission signal supplied from the feeder circuit and receive a reception signal and supply the reception signal to the feeder circuit, the system comprising:

a measuring device including a probe;

wherein

the radio IC device is measured by electromagnetically coupling a probe of a measuring device to a portion of the radiator by at least one of electrostatic coupling and electromagnetic coupling; and

a metallic film is disposed between the probe of the measuring device and the radio IC device and the probe of the measuring device is electrically connected to the metallic film.

19. The system for inspecting radio IC devices according to claim 18, wherein a top portion of the probe of the measuring device is a substantially flat plate.

20. The system for inspecting radio IC devices according to claim 18, wherein a top portion of the probe of the measuring device is substantially coil shaped.

21. The system for inspecting radio IC devices according to claim 18, wherein the metallic film is disposed on an insulating film.

22. The system for inspecting radio IC devices according to claim 18, wherein a coil conductor is disposed between the probe of the measuring device and the radio IC device and the probe of the measuring device is electrically connected to the coil conductor.

23. The system for inspecting radio IC devices according to claim 22, wherein the coil conductor is disposed on an insulating film.

24. A method for manufacturing radio IC devices, the method comprising:

providing the system for inspecting a radio IC device according to claim 18;

forming a plurality of radio IC devices;

inspecting the plurality of radio IC devices using the system for inspecting a radio IC device; and

separating the plurality of radio IC devices from each other.