Method of uniform phosphor chip coating and LED package fabricated using method
First Claim
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1. A method for fabricating an LED package, comprising:
- selecting an amount of a liquid medium;
covering at least part of an LED chip with said liquid medium, said liquid medium directly contacting at least part of said LED chip;
placing an optical element on said liquid medium;
allowing said optical element to settle only on said liquid medium at a desired level; and
curing said liquid medium;
wherein said amount of said liquid medium relates to said desired level.
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Abstract
Methods for fabricating LED packages comprising providing an LED chip and covering at least part of it with a liquid medium. An optical element is provided and placed on the liquid medium. The optical element is allowed to settle to a desired level and the liquid medium is cured. LED packages are also disclosed that are fabricated using the disclosed methods.
164 Citations
28 Claims
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1. A method for fabricating an LED package, comprising:
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selecting an amount of a liquid medium; covering at least part of an LED chip with said liquid medium, said liquid medium directly contacting at least part of said LED chip; placing an optical element on said liquid medium; allowing said optical element to settle only on said liquid medium at a desired level; and curing said liquid medium; wherein said amount of said liquid medium relates to said desired level. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 23, 24)
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10. A light emitting diode (LED) package, comprising:
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a substrate; an LED chip mounted to said substrate; cured medium over said LED chip and directly adjacent to said substrate; and an optical element having a bottom surface optically coupled to and in direct contact only with said medium, said optical element held in place at a certain height above said LED chip by said medium, wherein said height relates only to the amount of said cured medium, and wherein said cured medium and said optical element have different coefficients of thermal expansion. - View Dependent Claims (11, 12, 13, 14, 15, 16, 25, 26)
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17. A light emitting diode (LED) package, comprising:
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a substrate; an LED chip mounted to said substrate; cured encapsulant over said LED chip and directly contacting said substrate; and an optical element having a bottom surface optically coupled to and in direct contact only with said encapsulant, said optical element held in place at a certain height above said LED chip by said encapsulant, wherein said height is directly related to the amount of said encapsulant. - View Dependent Claims (18, 19, 20, 21, 22, 27, 28)
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Specification