Methods of packaging valve chips and related valve assemblies

• US 7,946,308 B2
• Filed: 10/07/2008
• Issued: 05/24/2011
• Est. Priority Date: 07/23/2004
• Status: Expired due to Fees

• Current Assignee: AFA Controls LLC (IMI PLC)
• Original Assignee: AFA Controls LLC (IMI PLC)
• Inventors: Laski, James C., Douglas, Kevin R., Gibson, Paul W., Harris, Donald C., Teach, William O.
• Primary Examiner(s): Schneider; Craig M
• Application Number:
  US12/247,081
• Publication Number:
  US 20090032112A1
• Time in Patent Office: 959 Days
• Field of Search: 137/829, 137/831, 137/833, 137/596.17, 137/15.18, 251/129.06
• US Class Current: 137/15.18
• CPC Class Codes: F15C 5/00 Manufacture of fluid circuit elements; Manufacture of assemblages of such elements integrated circuits
• CPC Class Codes: F16K 2099/0074 using photolithography, e.g. etching
• CPC Class Codes: F16K 2099/008 Multi-layer fabrications
• CPC Class Codes: F16K 99/0001 Microvalves microdevices B81B1/00; manufacture or treatment of devices or systems in or on a substrate B81C1/00; microfluidic structures B01L3/5027; micropumps F04B19/006
• CPC Class Codes: F16K 99/0007 of cantilever type
• CPC Class Codes: F16K 99/0028 Valves having multiple inlets or outlets
• CPC Class Codes: F16K 99/0051 using electrostatic means
• CPC Class Codes: G05D 7/0694 by action on throttling means or flow sources of very small size, e.g. microfluidics microvalves F16K99/0001; microstructural devices per se B81B
• CPC Class Codes: Y10T 137/0491 Valve or valve element assembling, disassembling, or replacing
• CPC Class Codes: Y10T 137/0497 Fluid actuated or retarded
• CPC Class Codes: Y10T 137/2213 Electrically-actuated element [e.g., electro-mechanical transducer]
• CPC Class Codes: Y10T 137/2224 Structure of body of device
• CPC Class Codes: Y10T 137/7761 Electrically actuated valve
• CPC Class Codes: Y10T 137/86558 Plural noncommunicating flow paths
• CPC Class Codes: Y10T 137/87169 Supply and exhaust
• CPC Class Codes: Y10T 137/87217 Motor
• CPC Class Codes: Y10T 137/87225 Fluid motor

Abstract

A valve chip may include a substrate having first and second faces and openings between the first and second faces, and a plurality of flexible valve flaps on one of the faces of the substrate with each flexible valve flap being associated with at least one of the openings. The valve chip may be packaged by forming a frame having an opening therein, and securing the valve chip in the opening of the frame. More particularly, the valve chip may be secured in the opening so that central portions of the first and second faces of the substrate are exposed through the opening in the frame and so that a fluid seal is provided between the frame and edges of the substrate. Related valves, valve assemblies, and methods are also discussed.

Claims

1. A method of packaging a valve chip including a substrate having first and second faces and a hole through the substrate between the first and second faces, a moveable valve member on one of the faces of the substrate with the moveable valve member being associated with the hole, the method comprising:

forming a frame having an opening therein;

securing the valve chip in the opening of the frame so that central portions of the first and second faces of the substrate are exposed through the opening in the frame and so that a fluid seal is provided between the frame and edges of the substrate; and

providing a baffle on the frame wherein the baffle is spaced apart from the substrate and wherein the baffle has at least one opening there through.

2. A method according to claim 1 wherein the moveable valve member comprises a flexible valve flap.

3. A method according to claim 1 wherein forming the frame comprises molding the frame separate from the valve chip, and wherein securing the valve chip comprises securing the valve chip in the opening of the frame after completion of molding.

4. A method according to claim 1 wherein the baffle provides a restriction to fluid flow in series with the plurality of holes through the substrate.

5. A method according to claim 1 wherein the baffle, the frame, and the substrate define an enclosure with the moveable valve member being included in the enclosure.

6. A method according to claim 1 further comprising:

forming a flexible gasket on the frame such that the frame is between the flexible gasket and the baffle.

7. A method according to claim 1 wherein the frame comprises a rigid polymer material.

8. A method according to claim 1 wherein the frame has a thickness greater than a thickness of the substrate and wherein the frame includes a recessed ledge along the opening therein with the edges of the substrate being supported by the recessed ledge.

9. A method according to claim 8 wherein securing the valve chip includes providing an adhesive between the edges of the substrate and the recessed ledge.

10. A method according to claim 1 wherein the baffle has a wedge shape.

11. A method according to claim 10 wherein the frame includes first and second conductive leads on a first edge of the frame, the first and second conductive leads being electrically coupled to the respective input pads on the substrate, wherein a thin portion of the baffle is adjacent the first edge of the frame and wherein a wide portion of the baffle is adjacent a second edge of the frame opposite the first edge.

12. A method according to claim 1 wherein the valve chip includes a pair of input pads on the substrate, and wherein providing the frame includes providing first and second conductive leads in the frame, the method further comprising:

after securing the valve chip in the opening, electrically coupling the first and second conductive leads to the respective input pads on the substrate.

13. A method according to claim 12 wherein electrically coupling the first and second conductive leads comprises wire bonding the first and second conductive leads to the respective input pads.

14. A method according to claim 12 wherein portions of the first and second conductive leads are exposed along an outside edge of the frame.

15. A method according to claim 14 wherein the exposed portions of the first and second conductive leads are oriented in a direction substantially perpendicular with respect to the substrate.

16. A method according to claim 14 wherein the exposed portions of the first and second conductive leads are exposed through slots in the frame.

17. A method of packaging a valve chip including a substrate having first and second faces and a hole through the substrate between the first and second faces, a moveable valve member on one of the faces of the substrate with the moveable valve member being associated with the hole, the method comprising:

forming a frame having an opening therein wherein the frame has a thickness greater than a thickness of the substrate and wherein the frame includes a recessed ledge along the opening therein;

forming a flexible gasket on the recessed ledge; and

after forming the flexible gasket, securing the valve chip in the opening of the frame so that central portions of the first and second faces of the substrate are exposed through the opening in the frame and so that a fluid seal is provided between the frame and edges of the substrate with the edges of the substrate being supported by the recessed ledge, wherein securing the valve chip comprises securing edges of the substrate on the flexible gasket.

18. A method according to claim 17 wherein forming the frame and forming the flexible gasket comprise molding the frame and the gasket using a first shot of a first material for the frame and a second shot of a second material for the gasket.

19. A method of packaging a valve chip including a substrate having first and second faces and a hole through the substrate between the first and second faces, a moveable valve member on one of the faces of the substrate with the moveable valve member being associated with the hole, the method comprising:

forming a frame having an opening therein wherein the frame has a thickness greater than a thickness of the substrate and wherein the frame includes a recessed ledge along the opening therein; and

securing the valve chip in the opening of the frame so that central portions of the first and second faces of the substrate are exposed through the opening in the frame and so that a fluid seal is provided between the frame and edges of the substrate with the edges of the substrate being supported by the recessed ledge, wherein securing the valve chip includes placing the valve chip on the recessed ledge and then deforming portions of the frame to overlap edges of the substrate opposite the recessed ledge so that edges of the substrate are secured between the recessed ledge and the deformed portions of the frame.

20. A method according to claim 19 further comprising:

providing a baffle on the frame wherein the baffle is spaced apart from the substrate and wherein the baffle has at least one opening there through.

21. A method of packaging a valve chip including a substrate having first and second faces and a hole through the substrate between the first and second faces, a moveable valve member on one of the faces of the substrate with the moveable valve member being associated with the hole, the method comprising:

forming a frame having an opening therein;

forming a flexible gasket on the frame, the flexible gasket defining an opening therein having dimensions greater than dimensions defined by a perimeter of the substrate; and

after forming the flexible gasket, securing the valve chip in the opening of the frame so that central portions of the first and second faces of the substrate are exposed through the opening in the frame and so that a fluid seal is provided between the frame and edges of the substrate.

22. A method according to claim 21 wherein forming the frame and forming the flexible gasket comprise molding the frame and the gasket using a first shot of a first material for the frame and a second shot of a second material for the gasket.

23. A method of packaging a valve chip including a substrate having first and second faces and a hole through the substrate between the first and second faces, a moveable valve member on one of the faces of the substrate with the moveable valve member being associated with the hole, the method comprising:

forming a frame having an opening therein;

securing the valve chip in the opening of the frame so that central portions of the first and second faces of the substrate are exposed through the opening in the frame and so that a fluid seal is provided between the frame and edges of the substrate;

providing a housing defining first and second chambers and a valve chip enclosure between the first and second chambers, wherein the first and second chambers and the valve chip enclosure are open at one end;

after securing the valve chip in the opening of the frame, inserting the frame in the valve chip enclosure; and

after inserting the frame in the valve chip enclosure, securing a base on the open end of the housing so that the first and second chambers are separated by the valve chip.

24. A method according to claim 23 wherein the housing includes a first port providing fluid communication into and/or out of the first chamber and wherein the base includes a second port providing fluid communication into and/or out of the second chamber.