Method and apparatus for automatically detecting and correcting misalignment of a semiconductor chip
First Claim
1. A method for automatically detecting and correcting a misalignment between a first chip and a second chip during a data communication process, during which the second chip transmits a data signal to the first chip, wherein the data signal is transmitted from a first proximity communication structure on the second chip and is received by a second proximity communication structure on the first chip, and wherein each proximity communication structure includes an array of individual proximity communication elements, the method comprising:
- receiving the data signal at the first chip from the second chip, wherein the transmitted data signal is steered through a subset of the individual proximity communication elements in the first proximity communication structure;
using a position-detection sensor integrated with the first chip to determine a misalignment of the first chip with respect to the second chip based at least on a signal strength of the received data signal, wherein determining the misalignment involves;
detecting the individual proximity communication elements in the second proximity communication structure that receive the transmitted data; and
determining the relative positions of the first and second chips based on the sending and receiving individual proximity communication elements; and
when a misalignment is detected between the first chip and the second chip, using an actuation mechanism integrated with the first chip to automatically correct the misalignment,wherein the automatically detecting and correcting of the misalignment are performed concurrently with the data communication process.
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Accused Products
Abstract
One embodiment of the present invention provides a system that automatically detects and corrects a misalignment of a semiconductor chip. During operation, the system uses a position-detection mechanism integrated with the chip to determine the misalignment of the chip from a desired alignment for the chip. Next, the system uses an actuation mechanism integrated with the chip to automatically correct the misalignment, thereby improving performance and reliability of the chip.
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Citations
19 Claims
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1. A method for automatically detecting and correcting a misalignment between a first chip and a second chip during a data communication process, during which the second chip transmits a data signal to the first chip, wherein the data signal is transmitted from a first proximity communication structure on the second chip and is received by a second proximity communication structure on the first chip, and wherein each proximity communication structure includes an array of individual proximity communication elements, the method comprising:
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receiving the data signal at the first chip from the second chip, wherein the transmitted data signal is steered through a subset of the individual proximity communication elements in the first proximity communication structure; using a position-detection sensor integrated with the first chip to determine a misalignment of the first chip with respect to the second chip based at least on a signal strength of the received data signal, wherein determining the misalignment involves; detecting the individual proximity communication elements in the second proximity communication structure that receive the transmitted data; and determining the relative positions of the first and second chips based on the sending and receiving individual proximity communication elements; and when a misalignment is detected between the first chip and the second chip, using an actuation mechanism integrated with the first chip to automatically correct the misalignment, wherein the automatically detecting and correcting of the misalignment are performed concurrently with the data communication process. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A computer-readable storage medium storing instructions that when executed by a computer cause the computer to perform a method for automatically detecting and correcting a misalignment between a first chip and a second chip during a data communication process, during which the second chip transmits a data signal to the first chip, wherein the data signal is transmitted from a first proximity communication structure on the second chip and is received by a second proximity communication structure on the first chip, and wherein each proximity communication structure includes an array of individual proximity communication elements, the method comprising:
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receiving the data signal at the first chip from the second chip, wherein the transmitted data signal is steered through a subset of the individual proximity communication elements in the first proximity communication structure; using a position-detection sensor integrated with the first chip to determine a misalignment of the first chip with respect to the second chip based at least on a signal strength of the received data signal, wherein determining the misalignment involves; detecting the individual proximity communication elements in the second proximity communication structure that receive the transmitted data; and determining the relative positions of the first and second chips based on the sending and receiving individual proximity communication elements; and when a misalignment is detected between the first chip and the second chip, using an actuation mechanism integrated with the first chip to automatically correct the misalignment, wherein the automatically detecting and correcting of the misalignment are performed concurrently with the data communication process. - View Dependent Claims (9, 10, 11, 12, 13, 14)
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15. An apparatus for automatically detecting and correcting a misalignment between a first chip and a second chip during a data communication process, during which the second chip transmits a data signal to the first chip, wherein the data signal is transmitted from a first proximity communication structure on the second chip and is received by a second proximity communication structure on the first chip, and wherein each proximity communication structure includes an array of individual proximity communication elements, comprising:
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a receiving mechanism on the first chip configured to receive the data signal at the first chip from the second chip, wherein the transmitted data signal is steered through a subset of the individual proximity communication elements in the first proximity communication structure; a position-detection sensor integrated with the first chip and configured to determine a misalignment of the first chip with respective to the second chip based at least on a signal strength of the received data signal, wherein the position-detection sensor is configured to determine the misalignment by; detecting the individual proximity communication elements in the second proximity communication structure that receive the transmitted data; and determining the relative positions of the first and second chips based on the sending and receiving individual proximity communication elements; and an actuation mechanism integrated with the first chip and configured to automatically correct a detected misalignment between the first chip and the second chip, wherein the automatically detecting and correcting of the misalignment are performed concurrently with the data communication process. - View Dependent Claims (16, 17, 18, 19)
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Specification