Sliding type thin fingerprint sensor package

• US 7,953,257 B2
• Filed: 10/23/2007
• Issued: 05/31/2011
• Est. Priority Date: 10/23/2007
• Status: Active Grant

• Current Assignee: Chipbond Technology Corporation
• Original Assignee: Chipbond Technology Corporation
• Inventors: Chen, Hua-Ping, Chen, Lin-Hsin, Chen, Yung-Jen, Liu, Heng-Ting, Chen, Yeh-Shun
• Primary Examiner(s): Mehta; Bhavesh M
• Assistant Examiner(s): DRENNAN, BARRY T
• Application Number:
  US11/976,306
• Publication Number:
  US 20090103787A1
• Time in Patent Office: 1,316 Days
• Field of Search: None
• US Class Current: 382/124
• CPC Class Codes: G06V 40/1329 Protecting the fingerprint sensor against damage caused by the finger
• CPC Class Codes: G06V 40/1335 Combining adjacent partial images (e.g. slices) to create a composite input or reference pattern; Tracking a sweeping finger movement
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

A sliding type thin fingerprint sensor package defined as a sliding region and a conductive portion comprises a substrate, a fingerprint sensor chip and a metal plate. The fingerprint sensor chip is electrically connected with the substrate and a sensing region of the fingerprint sensor chip is exposed by a window of the dielectric layer. The metal plate is electrically connected with the substrate and a sliding surface of the metal plate is close to the sensing region of the fingerprint sensor chip. The sensing region and the sliding surface are exposed by the window of the dielectric layer. The sensing region of the fingerprint sensor chip and the sliding surface of the metal plate are located at the sliding region, and a plurality of external contact pads on a circuit layer of the substrate are located at the conductive portion.

Claims

1. A sliding type thin fingerprint sensor package defined as a sliding region and a conductive portion comprising:

a substrate comprising;

a dielectric layer having an upper surface, a lower surface and a window penetrating the upper surface and the lower surface;

a circuit layer having a first surface, a second surface, a plurality of internal contact pads formed on the lower surface of the dielectric layer, and a plurality of external contact pads; and

a first passivation layer formed on the first surface of the circuit layer and having a plurality of first openings for exposing the internal contact pads;

a fingerprint sensor chip electrically connected with the internal contact pads and having an active surface, a back surface, and a sensing region formed on the active surface and exposed by the window of the dielectric layer; and

a metal plate electrically connected with the substrate and having a sliding surface close to the sensing region of the fingerprint sensor chip and exposed by the window of the dielectric layer;

wherein, the sensing region of the fingerprint sensor chip and the sliding surface of the metal plate are located at the sliding region, the external contact pads of the circuit layer are located at the conductive portion.

2. The sliding type thin fingerprint sensor package in accordance with claim 1, wherein the circuit layer comprises a first circuit layer formed on the lower surface of the dielectric layer and a second circuit layer formed on the upper surface of the dielectric layer, the second circuit layer has the second surface, the first circuit layer has the first surface, at least one electrostatic conductive pad and the internal contact pads, the metal plate is electrically connected with the electrostatic conductive pad.

3. The sliding type thin fingerprint sensor package in accordance with claim 2, wherein the external contact pads are formed on the second circuit layer.

4. The sliding type thin fingerprint sensor package in accordance with claim 3, wherein the substrate further has a second passivation layer formed on the second surface of the second circuit layer and having a plurality of second openings for exposing the external contact pads.

5. The sliding type thin fingerprint sensor package in accordance with claim 2, wherein the external contact pads are formed on the first circuit layer.

6. The sliding type thin fingerprint sensor package in accordance with claim 5, wherein the dielectric layer has a plurality of third openings for exposing the external contact pads.

7. The sliding type thin fingerprint sensor package in accordance with claim 2, wherein the electrostatic conductive pad is close to the window of the dielectric layer.

8. The sliding type thin fingerprint sensor package in accordance with claim 1, wherein the fingerprint sensor chip has at least one bump formed on the active surface and located at the exterior of the sensing region, the bump is electrically connected with the internal contact pads.

9. The sliding type thin fingerprint sensor package in accordance with claim 8, further comprising an underfilling material, which is formed between the substrate and the fingerprint sensor chip and encapsulates the bump.

10. The sliding type thin fingerprint sensor package in accordance with claim 1, wherein the metal plate has a cavity formed on the sliding surface to accommodate the fingerprint sensor chip.

11. The sliding type thin fingerprint sensor package in accordance with claim 10, wherein the cavity penetrates the metal plate and exposes the back surface of the fingerprint sensor chip.

12. The sliding type thin fingerprint sensor package in accordance with claim 1, wherein the active surface of the fingerprint sensor chip is aligned with the sliding surface of the metal plate.

13. The sliding type thin fingerprint sensor package in accordance with claim 1, wherein the window of the dielectric layer has two long sides, there is an interval between the two long sides, and the metal plate has a width less than or equal to the interval.

14. The sliding type thin fingerprint sensor package in accordance with claim 1, further comprising a shell, which caps the metal plate at least.

15. The sliding type thin fingerprint sensor package in accordance with claim 14, wherein the shell caps the back surface of the fingerprint sensor chip.

16. The sliding type thin fingerprint sensor package in accordance with claim 14, wherein the shell is made of polymeric material or metal material.

17. The sliding type thin fingerprint sensor package in accordance with claim 14, wherein the conductive portion is bent to cover the shell and at least one external contact pad is located under the shell.

18. The sliding type thin fingerprint sensor package in accordance with claim 1, wherein the substrate may use a flexible substrate.