Thin film integrated circuit device, IC label, container comprising the thin film integrated circuit, manufacturing method of the thin film integrated circuit device, manufacturing method of the container, and management method of product having the container

• US 7,973,313 B2
• Filed: 02/20/2004
• Issued: 07/05/2011
• Est. Priority Date: 02/24/2003
• Status: Expired due to Fees

• Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Original Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Inventors: Tachimura, Yuko, Ishikawa, Akira, Goto, Yuugo, Ohno, Yumiko, Takayama, Toru, Arai, Yasuyuki, Maruyama, Junya
• Primary Examiner(s): MATTHEWS, COLLEEN ANN
• Application Number:
  US10/781,795
• Publication Number:
  US 20040164302A1
• Time in Patent Office: 2,692 Days
• Field of Search: 257/66, 257/59, 257/347, 257/E49.004, 257/6, 174/250, 174/260
• US Class Current: 257/66
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: H01L 27/12 the substrate being other than a semiconductor body, e.g. an insulating body
• CPC Class Codes: H01L 27/1214 comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
• CPC Class Codes: H01L 27/1218 with a particular composition or structure of the substrate
• CPC Class Codes: H01L 27/1266 the substrate on which the devices are formed not being the final device substrate, e.g. using a temporary substrate
• CPC Class Codes: H01L 29/78603 characterised by the insulating substrate or support H01L29/78657 takes precedence

Abstract

The present invention provides an ultrathin thin film integrated circuit and a thin film integrated circuit device including the thin film integrated circuit device. Accordingly, the design of a product is not spoilt while an integrated circuit formed from a silicon wafer, which is thick and produces irregularities on the surface of the product container. The thin film integrated circuit according to the present invention includes a semiconductor film as an active region (for example a channel region in a thin film transistor), unlike an integrated circuit formed from a conventional silicon wafer. The thin film integrated circuit according to the present invention is thin enough that the design is not spoilt even when a product such as a card or a container is equipped with the thin film integrated circuit.

Claims

1. A flexible integrated circuit capable of performing data transmission wirelessly, comprising:

a substrate;

an adhesive over the substrate;

a metal oxide over the adhesive;

an insulating film over the metal oxide;

a transistor comprising a semiconductor film, a gate insulating film, and a gate electrode which are provided over the insulating film;

an interlayer insulating film over the transistor;

a wiring formed on the interlayer insulating film, wherein the wiring is directly connected to an impurity region of the semiconductor film; and

an antenna formed on the interlayer insulating film, wherein the antenna is formed from a same layer as the wiring.

2. A flexible integrated circuit according to claim 1, wherein the antenna comprises a same material as the wiring.

3. A flexible integrated circuit according to claim 1, wherein the antenna comprises a conductive paste.

4. A flexible integrated circuit according to claim 1, wherein the interlayer insulating film comprises an organic material.

5. A flexible integrated circuit according to claim 1, wherein the antenna is formed in a depressed portion formed in the interlayer insulating film.

6. A container comprising a flexible integrated circuit capable of performing data transmission wirelessly,

wherein the flexible integrated circuit comprises:

a substrate;

an adhesive over the substrate;

a metal oxide over the adhesive;

an insulating film over the metal oxide;

a transistor comprising a semiconductor film, a gate insulating film, and a gate electrode which are provided over the insulating film;

an interlayer insulating film over the transistor;

a wiring provided on the interlayer insulating film, wherein the wiring is directly connected to an impurity region of the semiconductor film; and

an antenna provided on the interlayer insulating film, wherein the antenna is formed from a same layer as the wiring.

7. A container according to claim 6, wherein the flexible integrated circuit is covered by a label.

8. A container according to claim 7, wherein a protective film having a DLC film or a CN film is provided between the flexible integrated circuit and the label.

9. A container according to claim 6, wherein the interlayer insulating film comprises an organic material.

10. A container according to claim 6, wherein the antenna is formed in a depressed portion formed in the interlayer insulating film.

11. A flexible integrated circuit capable of performing data transmission wirelessly, comprising:

an integrated circuit disposed over a substrate, the integrated circuit comprising a thin film transistor including an impurity region;

an interlayer insulating film over the thin film transistor; and

an antenna provided on the interlayer insulating film, wherein the antenna is formed from a same layer as a wiring directly connected to the impurity region,

wherein the substrate has a flexibility.

12. A flexible integrated circuit according to claim 11 wherein the substrate is a plastic substrate.

13. A flexible integrated circuit according to claim 11 wherein the thin film transistor includes a semiconductor film comprising silicon.

14. A flexible integrated circuit according to claim 11 wherein the antenna is electrically connected to the integrated circuit.

15. A flexible integrated circuit according to claim 11, wherein the interlayer insulating film comprises an organic material.

16. A flexible integrated circuit according to claim 11, wherein the antenna is formed in a depressed portion formed in the interlayer insulating film.

17. A flexible integrated circuit capable of performing data transmission wirelessly, comprising:

an integrated circuit attached to a substrate with an adhesive interposed therebetween, the integrated circuit comprising a thin film transistor including an impurity region;

an interlayer insulating film over the thin film transistor; and

an antenna provided on the interlayer insulating film, wherein the antenna is formed from a same layer as a wiring directly connected to the impurity region,

wherein the substrate has a flexibility.

18. A flexible integrated circuit according to claim 17 wherein the substrate is a plastic substrate.

19. A flexible integrated circuit according to claim 17 wherein the thin film transistor includes a semiconductor film comprising silicon.

20. A flexible integrated circuit according to claim 17 wherein the antenna is electrically connected to the integrated circuit.

21. A flexible integrated circuit according to claim 17, wherein the interlayer insulating film comprises an organic material.

22. A flexible integrated circuit according to claim 17, wherein the antenna is formed in a depressed portion formed in the interlayer insulating film.

23. A flexible integrated circuit capable of performing data transmission wirelessly, comprising:

an integrated circuit disposed over a substrate, the integrated circuit comprising a thin film transistor including an impurity region;

an interlayer insulating film over the thin film transistor;

an antenna provided on the interlayer insulating film, wherein the antenna is formed from a same layer as a wiring directly connected to the impurity region; and

a protective film covering the antenna,

wherein the substrate has a flexibility.

24. A flexible integrated circuit according to claim 23 wherein the substrate is a plastic substrate.

25. A flexible integrated circuit according to claim 23 wherein the thin film transistor includes a semiconductor film comprising silicon.

26. A flexible integrated circuit according to claim 23 further comprising a wiring electrically connected to the integrated circuit wherein the wiring and the antenna are formed on a same surface.

27. A flexible integrated circuit according to claim 23, wherein the interlayer insulating film comprises an organic material.

28. A flexible integrated circuit according to claim 23, wherein the antenna is formed in a depressed portion formed in the interlayer insulating film.

29. A flexible integrated circuit capable of performing data transmission wirelessly, comprising:

an integrated circuit attached to a substrate with an adhesive interposed therebetween, the integrated circuit comprising a thin film transistor including an impurity region;

an interlayer insulating film over the thin film transistor;

an antenna provided on the interlayer insulating film, wherein the antenna is formed from a same layer as a wiring directly connected to the impurity region; and

a protective film covering the antenna,

wherein the substrate has a flexibility.

30. A flexible integrated circuit according to claim 29 wherein the substrate is a plastic substrate.

31. A flexible integrated circuit according to claim 29 wherein the thin film transistor includes a semiconductor film comprising silicon.

32. A flexible integrated circuit according to claim 29 further comprising a wiring electrically connected to the integrated circuit wherein the wiring and the antenna are formed on a same surface.

33. A flexible integrated circuit according to claim 29, wherein the interlayer insulating film comprises an organic material.

34. A flexible integrated circuit according to claim 29, wherein the antenna is formed in a depressed portion formed in the interlayer insulating film.

35. A flexible integrated circuit capable of performing data transmission wirelessly, comprising:

an integrated circuit including a memory disposed over a substrate, the integrated circuit comprising a thin film transistor including an impurity region;

an interlayer insulating film over the thin film transistor; and

an antenna provided on the interlayer insulating film, wherein the antenna is formed from a same layer as a wiring directly connected to the impurity region,

wherein the substrate has a flexibility.

36. A flexible integrated circuit according to claim 35 wherein the substrate is a plastic substrate.

37. A flexible integrated circuit according to claim 35 wherein the thin film transistor includes a semiconductor film comprising silicon.

38. A flexible integrated circuit according to claim 35 wherein the antenna is electrically connected to the integrated circuit.

39. A flexible integrated circuit according to claim 35 wherein the memory is a rewritable memory.

40. A flexible integrated circuit according to claim 35 wherein the integrated circuit is attached to the substrate with an adhesive interposed therebetween.

41. A flexible integrated circuit according to claim 35, wherein the interlayer insulating film comprises an organic material.

42. A flexible integrated circuit according to claim 35, wherein the antenna is formed in a depressed portion formed in the interlayer insulating film.

43. A flexible integrated circuit capable of performing data transmission wirelessly, comprising:

a substrate;

an adhesive over the substrate;

an insulating film over the substrate with the adhesive therebetween;

a transistor comprising a semiconductor film, a gate insulating film, and a gate electrode which are provided over the insulating film;

an interlayer insulating film over the transistor;

a wiring formed on the interlayer insulating film, wherein the wiring is directly connected to an impurity region of the semiconductor film; and

an antenna formed on the interlayer insulating film, wherein the antenna is formed from a same layer as the wiring.

44. A flexible integrated circuit according to claim 43, wherein the antenna comprises a same material as the wiring.

45. A flexible integrated circuit according to claim 43, wherein the antenna comprises a conductive paste.

46. A flexible integrated circuit according to claim 43, wherein the interlayer insulating film comprises an organic material.

47. A flexible integrated circuit according to claim 43, wherein the antenna is formed in a depressed portion formed in the interlayer insulating film.

48. A container comprising a flexible integrated circuit capable of performing data transmission wirelessly,

wherein the flexible integrated circuit comprises:

a substrate;

an adhesive over the substrate;

an insulating film over the substrate with the adhesive therebetween;

a transistor comprising a semiconductor film, a gate insulating film, and a gate electrode which are provided over the insulating film;

an interlayer insulating film over the transistor;

a wiring provided on the interlayer insulating film, wherein the wiring is directly connected to an impurity region of the semiconductor film; and

an antenna provided on the interlayer insulating film, wherein the antenna is formed from a same layer as the wiring.

49. A container according to claim 48, wherein the flexible integrated circuit is covered by a label.

50. A container according to claim 49, wherein a protective film having a DLC film or a CN film is provided between the flexible integrated circuit and the label.

51. A container according to claim 48, wherein the interlayer insulating film comprises an organic material.

52. A container according to claim 48, wherein the antenna is formed in a depressed portion formed in the interlayer insulating film.