Printed circuit board coil

• US 7,973,635 B2
• Filed: 09/24/2008
• Issued: 07/05/2011
• Est. Priority Date: 09/28/2007
• Status: Active Grant

• Current Assignee: Philips IP Ventures B.V. (Koninklijke Philips N.V.)
• Original Assignee: Access Business Group International LLC (Alticor Incorporated)
• Inventors: Duckworth, Paul, Wahl, Richard A., Guthrie, Warren E., Schwannecke, Joshua K., Baarman, David W.
• Primary Examiner(s): Mai, Anh T
• Assistant Examiner(s): Lian, Mangtin
• Application Number:
  US12/236,832
• Publication Number:
  US 20090085706A1
• Time in Patent Office: 1,014 Days
• Field of Search: None
• US Class Current: 336/222
• CPC Class Codes: H01F 2027/2809 on stacked layers
• CPC Class Codes: H01F 27/2804 Printed windings
• CPC Class Codes: H01F 27/34 Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields
• CPC Class Codes: H01F 38/14 Inductive couplings for wireless supply or distribution of electric power using inductive coupling H02J50/10
• CPC Class Codes: H01F 5/003 Printed circuit coils
• CPC Class Codes: H05K 1/0228 Compensation of cross-talk by a mutually correlated lay-out of printed circuit traces, e.g. for compensation of cross-talk in mounted connectors balanced signal pairs H05K1/0245
• CPC Class Codes: H05K 1/165 incorporating printed inductors
• CPC Class Codes: H05K 2201/097 Alternating conductors, e.g. alternating different shaped pads, twisted pairs; Alternating components

Abstract

A multilayer printed circuit board (“PCB”) coil that simulates a coil formed from litz wire. The PCB includes a plurality of alternating conductor and insulating layers interconnected to cooperatively form the coil. Each conductor layer includes a trace that follows the desired coil shape and is divided into a plurality of discrete conductor segments. The segments are electrically connected across layers to provide a plurality of current flow paths (or filaments) that undulate between the layers in a regular, repeating pattern. The coil may be configured so that each filament spends a substantially equal amount of time in proximity to the paired coil and therefore contributes substantially equally to the self or mutual inductance of the coil. Each conductor layer may include a plurality of associated traces and intralayer connector that interconnected so that each filament undulates not only upwardly/downwardly, but also inwardly/outwardly in a regular, repeating pattern.

Claims

1. A printed circuit board coil for use with a paired coil comprising:

a substrate;

a plurality of conductor layers, each conductor layer including a plurality of discrete coil segments; and

a plurality of interlayer connectors electrically interconnecting said plurality of discrete coil segments of different layers to define a plurality of discrete filaments, each of said filaments having two filament ends and each of said filaments following substantially identical, but offset, undulations through said plurality of layers.

2. The printed circuit board coil of claim 1 wherein each of said filaments follows substantially identical, but offset, regular, repeating undulations through said plurality of layers.

3. The printed circuit board coil of claim 1 wherein said coil is paired with a second coil;

and

wherein said segments and said interlayer connectors are configured so that each filament spends a substantially equal amount of time in proximity to the paired coil, whereby the printed circuit board coil simulates a coil of litz wire.

4. The printed circuit board coil of claim 1 further including an insulator layer disposed between adjacent pairs of said conductor layers.

5. The printed circuit board coil of claim 1 wherein each of said plurality of conductor layers includes a spiral trace.

6. The printed circuit board coil of claim 5 wherein each of said traces includes an interchange, said interlayer connectors including a plurality of vias selectively routed through said interchanges.

7. The printed circuit board coil of claim 5 wherein each of said spiral traces includes an innermost end and an outermost end, each of said segments including an inner end toward said innermost end of said spiral trace and an outer end toward said outermost end of said spiral trace;

and

wherein each of said filaments is defined by electrically connecting said inner end of one of said segments with said outer end of another of said segments in a continuous chain from one of said spiral trace outermost ends of one of said traces to one of said innermost ends of one of said traces.

8. The printed circuit board coil of claim 1 wherein said plurality of segments defines a first spiral trace and a second spiral ace on each conductor layer;

and

further including a plurality of intralayer connectors for electrically connecting said segments from said first spiral trace with said segments of said second spiral trace within a single one of said conductor layers, said interlayer connectors and said intralayer connectors cooperatively defining said filaments following substantially identical, but offset, undulations within each of said layers and through each of said plurality of layers.

9. The printed circuit board coil of claim 1 wherein a first one of said conductor layers includes a spiral trace having a plurality of loops and wherein each segment of said trace of said first conductor layer is spaced apart from said segments of any adjacent loops of said first conductor layer to define a space;

and

wherein a second one of said conductor layers includes a spiral trace having a plurality of loops and wherein each segment of said trace of said second conductor layer is positioned to overlap said space of said first conductor layer.

10. The printed circuit board coal of claim 1 wherein one of each of said filament ends are connected to a common point and each of the other of said filament ends are connected to a different common point.

11. A printed circuit board coil assembly comprising:

an insulative substrate;

a first conductor layer disposed on said substrate, said first conductor layer including a first trace having a plurality of discrete coil conductor segments;

a second conductor layer disposed on said substrate on a side opposite said first conductor layer, said second conductor layer including a second trace having a plurality of discrete coil conductor segments; and

a plurality of interlayer connectors interconnecting said plurality of discrete coil conductor segments of said first conductive layer with said plurality of discrete coil conductor segments of said second conductive layer in a predetermined pattern to define a plurality of interconnected segments, wherein said plurality of interconnected segments define at least two filaments that undulate in a predetermined pattern between said first conductor layer and said second conductor layer, each of said at least two filaments having an innermost filament end and an outermost filament end.

12. The printed circuit board coil assembly of claim 11 further including:

a second insulative substrate positioned adjacent said first insulative substrate;

a third conductor layer disposed on said second substrate, said third conductor layer having a third trace including a plurality of discrete conductor segments;

a fourth conductor layer disposed on said second substrate on a side opposite said third conductor layer, said fourth conductor layer including a fourth trace having a plurality of discrete conductor segments; and

a plurality of interlayer connectors electrically interconnecting said segments of said first layer, said segments of said second layer, said segments of said third layer and said segments of said fourth layer in a predetermined pattern, wherein said interconnected segments define at least two filaments that undulate in a predetermined pattern between said first conductor layer, said second conductor layer, said third conductor layer and said fourth conductor layer.

13. The printed circuit board coil assembly of claim 11 wherein said first conductor layer includes a second trace having a plurality of discrete conductor segments;

and

further including a plurality of intralayer connectors electrically connecting said segments of said first trace with said segments of said third trace, whereby said filaments undulate in a predetermined pattern between said first conductor layer and said second conductor layer and between said first trace and said third trace.

14. The printed circuit board coil assembly of claim 13 wherein said second conductor layer includes a fourth trace having a plurality of conductor segments;

and

further including a plurality of intralayer connectors electrically connecting said segments of said second trace with said segments of said fourth trace, whereby said filaments undulate in a predetermined pattern between said first conductor layer and said second conductor layer and between said first trace and said third trace and between said second trace and said fourth trace.

15. The printed circuit board coil assembly of claim 11 wherein said filaments follow substantially parallel, but offset, paths undulating about said coil in a regular, repeating pattern.

16. The printed circuit board coil assembly of claim 11 wherein

each of said segments of said first trace having an inner end and an outer end, each of said segments of said second trace having an inner end and an outer end, each of said filaments being defined by a plurality of said segments interconnected by electrically connecting an inner end of one of said segments with an outer end of another of said segments in a continuous chain from said outermost filament end to said innermost filament end.

17. The printed circuit board coil assembly of claim 11 wherein each of said innermost filament ends are connected to a common point and each of said outermost filament ends are connected to a different common point.

18. A multilayer electromagnetic coil for a wireless power connection comprising:

a first conductor layer having a plurality of discrete coil conductor segments;

a second conductor layer disposed adjacent to said first conductor layer, said second conductor layer including a plurality of discrete coil conductor segments; and

a plurality of connectors interconnecting said plurality of discrete coil conductor segments of said first layer with said plurality of discrete coil segments of said second layer in a predetermined pattern to define a plurality of interconnected segments, wherein said plurality of interconnected segments define at least two filaments that undulate in a predetermined pattern between said first conductor layer and said second conductor layer, each of said at least two filaments having two filament ends.

19. The multilayer coil of claim 18 wherein said segments and said connectors are arranged such that each of said filaments are substantially uniformly distributed throughout the coil, whereby each of said filaments contributes substantially equally to an inductance of the coil.

20. The multilayer coil of claim 18 further including a third conductor layer disposed adjacent to said second conductor layer, said third conductor layer including a plurality of discrete conductor segments;

and

said plurality of connectors interconnecting said segments of said first conductor layer, said second conductor layer and said third conductor layer in a predetermined pattern, wherein said interconnected segments define at least three filaments that undulate in a predetermined pattern through said first conductor layer, said second conductor layer and said third conductor layer, whereby each of said filaments contributes substantially equally to an inductance of the coil, each of said at east three filaments having two filament ends.

21. The multilayer coil of claim 18 in combination with a second inductive coil, said second inductive coil being inductive coupled with the coil, wherein said segments and said connectors are arranged such that each of said filaments are substantially uniformly distributed throughout the coil, whereby each of said filaments receives substantially uniform amounts of magnetic flux from said second coil.

22. The multilayer coil of claim 18 in combination with a second inductive coil, said second inductive coil being inductive coupled with the coil;

and

further including a third conductor layer disposed adjacent to said second conductor layer, said third conductor layer including a plurality of discrete conductor segments, said plurality of connectors interconnecting said segments of said first conductor layer, said second conductor layer and said third conductor layer in a predetermined pattern, wherein said interconnected segments define at least three filaments that undulate in a predetermined pattern through said first conductor layer, said second conductor layer and said third conductor layer, whereby each of said filaments receives substantially uniform amounts of magnetic flux from said second coil each of said at least three filaments having two filament ends.

23. The multilayer coil of claim 18 wherein said conductor segments of said first layer define a first trace and a second trace, and

wherein said plurality of connectors interconnect said segments of said first trace and said second trace with said segments of said second layer in a predetermined pattern, wherein said interconnected segments define at least two filaments that undulate in a predetermined pattern between said first trace of said first conductor layer, said second trace of said first conductor layer and said second conductor layer.

24. The multilayer coil of claim 18 wherein both of said first and second conductive layers are equal average distance from a paired coil.

25. The multilayer coil of claim 18 wherein each of said first and second conductive layers transmit or receive a uniform amount of flux.

26. The multilayer electromagnetic coil of claim 18 wherein one of each of said filament ends are connected to a common point and each of the other of said filament ends are connected to a different common point.