Methods of connecting an antenna to a transponder chip

• US 7,979,975 B2
• Filed: 08/28/2008
• Issued: 07/19/2011
• Est. Priority Date: 04/10/2007
• Status: Active Grant

• Current Assignee: Assa Abloy AB, HID Global GmbH (Assa Abloy AB)
• Original Assignee: Feinics Amatech Teavanta
• Inventors: Finn, David
• Primary Examiner(s): ARBES, CARL J
• Application Number:
  US12/200,926
• Publication Number:
  US 20090213027A1
• Time in Patent Office: 1,055 Days
• Field of Search: 229/592.1, 229/600, 229/825, 229/831, 235/492, 343/700.R
• US Class Current: 29/592.1
• CPC Class Codes: G06K 19/07327 Passive means, e.g. Faraday cages Faraday-type protection of electric circuits in general H05K9/00
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/0775 arrangements for connecting the integrated circuit to the antenna
• CPC Class Codes: G06K 19/07779 the inductive antenna being a coil
• CPC Class Codes: G06K 19/07781 the coil being fabricated in a winding process
• CPC Class Codes: H01L 2224/05553 being rectangular
• CPC Class Codes: H01L 2224/78301 Capillary
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01Q 1/2225 used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
• CPC Class Codes: H05K 2203/0285 Using ultrasound, e.g. for cleaning, soldering or wet treatment
• CPC Class Codes: Y10T 29/49002 Electrical device making
• CPC Class Codes: Y10T 29/49016 Antenna or wave energy "plumbing" making
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing
• CPC Class Codes: Y10T 29/49128 Assembling formed circuit to base

Abstract

An antenna wire (210, 260, 310, 410, 510, 610, 710) is mounted to a substrate (204, 254, 304, 404, 504, 604, 704) so that end portions (210a/b, 260a/b, 310a/b, 410a/b, 510a/b, 610a/b, 710a/b) of the wire are spaced far enough apart for a transponder chip (208, 250, 308, 408, 508, 608, 708) to be positioned therebetween, such as into a recess (206, 256, 306, 406, 506, 606, 706) in the substrate. The end portions are left unmounted, as “wire bridges”, “jump loops”, or “flat loops”. The end portions may be re-positioned to be over the terminals (208a/b, 258a/b, 308a/b, 408a/b, 508a/b, 608a/b, 708a/b) of the chip for bonding. Or, the chip (or substrate) may be moved (such as side-to-side, or rotated) so that the chip'"'"'s terminals are under the end portions of the wire for bonding. Insulation may be removed from the end portions of the wire prior to bonding.

Claims

1. Method of connecting an antenna wire to a transponder chip comprising:

providing a recess in a surface of the substrate for receiving the transponder chip;

mounting the antenna wire to a surface of a substrate so that two end portions of the antenna wire span the recess;

disposing the transponder chip into the recess, past the end portions of the antenna wire;

after disposing the transponder chip between the end portions of the antenna wire, rotating the transponder chip so that terminals of the transponder chip are in alignment with corresponding ones of the end portions of the antenna wire, for bonding thereto.

2. The method of claim 1, wherein:

the end portions comprise wire bridges, jump loops, or flat loops.

3. The method of claim 1, further comprising:

subsequently bonding the end portions of the antenna wire to corresponding terminals of the transponder chip.

4. The method of claim 1, further comprising:

removing insulation from the end portions of the wire prior to bonding.

5. The method of claim 4, further comprising:

providing slots in the substrate, under the end portions of the wire.

6. The method of claim 1, wherein:

the recess is sufficiently large to allow for said rotation of the transponder chip while it is in the recess.

7. The method of claim 1, wherein:

the end portions of the antenna wire are sized and shaped to permit the transponder chip to be rotated underneath them.

8. The method of claim 1, wherein mounting the antenna wire comprises:

embedding the antenna wire in the surface of the substrate or adhesively placing the antenna wire on the surface of the substrate.

9. The method of claim 1, wherein the substrate is a multi-layer substrate.

10. Method of connecting an antenna wire to a transponder chip comprising:

providing a recess in a surface of a substrate;

mounting the antenna wire to the surface of the substrate so that two end portions of the antenna wire span the recess;

disposing the chip in the recess, between the two end portions of the antenna wire; and

imparting at least one relative motion between the chip and the substrate so that a first terminal of the chip is positioned under a first of the two end portions of the wire for bonding thereto and so that a second terminal of the chip is positioned under a second of the two end portions of the wire for bonding thereto;

wherein;

the relative motion is imparted by moving the chip relative to a stationary substrate.

11. The method of claim 10, further comprising:

subsequently bonding the end portions of the antenna wire to corresponding terminals of the chip.

12. The method of claim 10, further comprising:

removing insulation from the end portions of the wire prior to bonding.

13. The method of claim 12, further comprising:

providing slots in the substrate, under the end portions of the wire.

14. The method of claim 10, wherein mounting the antenna wire comprises:

embedding the antenna wire in the surface of the substrate or adhesively placing the antenna wire on the surface of the substrate.

15. The method of claim 10, wherein the substrate is a multi-layer substrate.

16. The method of claim 10, further comprising:

removing insulation from at least a portion of the wire using a laser.

17. Method of preparing a transponder site comprising:

providing an inlay substrate;

providing a recess for receiving a chip module in a surface of the inlay substrate;

mounting an antenna wire to the surface of the inlay substrate with two end portions of the antenna wire spanning the recess;

inserting a chip module having two terminals into the recess, from the same side of the substrate as the antenna, past the end portions of the antenna wires; and

rotating the chip module in the recess so that the terminals of the chip module are in alignment with corresponding ones of the end portions of the antenna wire, for bonding thereto.

18. The method of claim 17, further comprising:

subsequently bonding the end portions of the antenna wire to corresponding terminals of the chip module.

19. The method of claim 17, further comprising:

removing insulation from the end portions of the wire prior to bonding.

20. The method of claim 17, wherein:

the recess is sufficiently large to allow for said rotation of the chip module while it is in the recess.

21. The method of claim 17, wherein mounting the antenna wire comprises:

embedding the antenna wire in the surface of the substrate or adhesively placing the antenna wire on the surface of the substrate.

22. The method of claim 17, wherein the substrate is a multi-layer substrate.

23. The method of claim 17, further comprising:

removing insulation from at least a portion of the wire using a laser.