Immersion lithography apparatus and methods

• US 7,986,395 B2
• Filed: 06/29/2006
• Issued: 07/26/2011
• Est. Priority Date: 10/24/2005
• Status: Active Grant

• Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Original Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Inventors: Chang, Ching-Yu, Lin, Chin-Hsiang, Lin, Burn Jeng
• Primary Examiner(s): Glick; Edward J
• Assistant Examiner(s): Asfaw; Mesfin T
• Application Number:
  US11/427,421
• Publication Number:
  US 20070091287A1
• Time in Patent Office: 1,853 Days
• Field of Search: 355/53, 355/30
• US Class Current: 355/53
• CPC Class Codes: G03F 7/70341 Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply chemical composition of immersion liquids G03F7/2041
• CPC Class Codes: G03F 7/70925 Cleaning, i.e. actively freeing apparatus from pollutants, e.g. using plasma cleaning

Abstract

A lithography apparatus includes an imaging lens module; a substrate table positioned underlying the imaging lens module and configured to hold a substrate; and a cleaning module adapted to clean the lithography apparatus. The cleaning module is selected from the group consisting of an ultrasonic unit, a scrubber, a fluid jet, an electrostatic cleaner, and combinations thereof.

Claims

1. An immersion lithography apparatus, comprising:

an imaging lens module;

a substrate table positioned underlying the imaging lens module and configured to hold a substrate;

an immersion fluid retaining module; and

a cleaning module adapted to clean the imaging lens module, substrate table, and immersion fluid retaining module, wherein the cleaning module includes an ultrasonic unit, wherein the cleaning module is a distinct module separate from the substrate table and the immersion fluid retaining module, and wherein the cleaning module is integrated with a robot.

2. The apparatus of claim 1, wherein the cleaning module is integrated with the robot such that the cleaning module is operable to move to an idle location and a cleaning location, wherein the idle location and the cleaning location are different.

3. The apparatus of claim 1, wherein the cleaning module is configured to move in a mode selected from the group consisting of rotation, vibration, horizontal movement, and combinations thereof.

4. The apparatus of claim 1, wherein the cleaning module further comprises a cleaning fluid inlet to provide a cleaning fluid for use with the cleaning module and a heater for heating the cleaning fluid to a higher temperature.

5. The apparatus of claim 4, wherein the cleaning fluid is selected from the group consisting of an immersion fluid, a chemical solution, and a purge gas.

6. The apparatus of claim 4, wherein the cleaning fluid comprises a material selected from the group consisting of surfactant, solvent, NH₄OH, H₂O₂, O₃, NMP, PGME/PGMEA cyclohexanol, IPA, acetone, alcohol, MEA, and HA.

7. The apparatus of claim 4, wherein the cleaning module comprises a vacuum component configured to draw the cleaning fluid.

8. The apparatus of claim 1, wherein the cleaning module further comprises a scrubber, the scrubber selected from a sponge and a brush.

9. The apparatus of claim 1, wherein the cleaning module further comprises a scrubber, the scrubber comprising a material selected from the group consisting of Polyethylene (PE), Polyvinyl Alcohol (PVA), and Polypropylene (PP).

10. The apparatus of claim 1, wherein the cleaning module further comprises a fluid jet, the fluid jet operable at various pressures, angles, and movements.

11. The apparatus of claim 10, wherein the fluid jet is configured to use a liquid gas for cleaning.

12. An immersion lithography apparatus, comprising:

an imaging lens module;

a substrate table configured to secure a substrate and positioned under the imaging lens;

a fluid module configured to provide a fluid to a space between the imaging lens module and a substrate on the stage; and

an ultrasonic unit configured to clean the immersion lithography apparatus, wherein the ultrasonic unit is configured to move to various locations in the apparatus independently of the substrate table.

13. The apparatus of claim 12, wherein the ultrasonic unit operates in conjunction with a scrubber.

14. The apparatus of claim 12, wherein the ultrasonic unit operates in conjunction an electrostatic cleaner.

15. The apparatus of claim 12, wherein a fluid jet operates in conjunction with the ultrasonic unit and a scrubber.

16. A method, comprising:

providing a lithography apparatus having a cleaning module, wherein the cleaning module includes an ultrasonic unit, and wherein the lithography apparatus includes imaging a lens module, a substrate table, and an immersion fluid retaining module, and wherein the cleaning module is operable to move independently of each of the lens module, the substrate table, and the immersion fluid retaining module;

moving the cleaning module to a first position;

performing a cleaning process to the imaging lens module, substrate table, and immersion fluid retaining module by utilizing the cleaning module, while the cleaning module is at the first position;

moving the cleaning module to a second position; and

performing an exposure process to a substrate coated with an imaging layer, while the cleaning module is at the second position.

17. The method of claim 16, wherein the performing of the exposure process comprises exposing a semiconductor wafer.

18. The method of claim 16, wherein the performing of the cleaning process includes drying the substrate.

19. The method of claim 16, further comprising:

moving the cleaning module to a third position, after the first position and prior to the second position, wherein the third position is proximate to the lens module, and wherein the cleaning process is performed at the third position.

20. The method of claim 19, further comprising:

moving the cleaning module to a fourth position, after the third position and prior to the second position, wherein the third position is proximate to the immersion fluid retaining module, wherein the first, second, third, and fourth position are different, and wherein the cleaning process is performed at the fourth position.