Bi-directional released-beam sensor
First Claim
1. A sensor, comprising:
- a semiconductor substrate;
a first layer formed on a surface of the substrate;
a first aperture within the first layer;
a beam having first and second ends, the beam being mechanically coupled at the first end to the first layer and suspended above the first layer for at least a portion of the length of the beam and the second end having a region above the first aperture;
a first boss coupled to a lower surface of the second end of the beam and suspended at least partially within the first aperture; and
a second boss coupled to an upper surface of the second end of the beam.
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Accused Products
Abstract
An acceleration sensor includes a semiconductor substrate, a first layer formed on the substrate, a first aperture within the first layer, and a beam coupled at a first end to the substrate and suspended above the first layer for a portion of the length thereof. The beam includes a first boss coupled to a lower surface thereof and suspended within the first aperture, and a second boss coupled to an upper surface of the second end of the beam. A second layer is positioned on the first layer over the beam and includes a second aperture within which the second boss is suspended by the beam. Contact surfaces are positioned within the apertures such that acceleration of the substrate exceeding a selected threshold in either direction along a selected axis will cause the beam to flex counter to the direction of acceleration and make contact through one of the bosses with one of the contact surfaces.
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Citations
31 Claims
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1. A sensor, comprising:
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a semiconductor substrate; a first layer formed on a surface of the substrate; a first aperture within the first layer; a beam having first and second ends, the beam being mechanically coupled at the first end to the first layer and suspended above the first layer for at least a portion of the length of the beam and the second end having a region above the first aperture; a first boss coupled to a lower surface of the second end of the beam and suspended at least partially within the first aperture; and a second boss coupled to an upper surface of the second end of the beam. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 14)
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13. A sensor, comprising:
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a semiconductor substrate; a first layer formed on a surface of the substrate; a first aperture within the first layer; a second layer formed on the surface of the substrate and spaced apart from the first layer; a second aperture within the second layer in a position opposite the first aperture; a beam having first and second ends, the beam being mechanically coupled at the first end to the first layer and suspended between the first and second layers for at least a portion of the length thereof and the second end having a region between the first and second apertures; a first boss coupled to a lower surface of the second end of the beam and suspended at least partially within the first aperture; a second boss coupled to an upper surface of the second end of the beam and suspended at least partially within the second aperture; and a first contact surface positioned on a first sidewall of the first aperture, a second contact surface positioned on a first sidewall of the second aperture, third and fourth contact surfaces positioned on second and third sidewalls of the first aperture, and fifth and sixth contact surfaces positioned on second and third sidewalls of the second aperture.
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15. A sensor, comprising:
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a semiconductor substrate; a first layer formed on a surface of the substrate; a first aperture within the first layer; a beam having first and second ends, the beam being mechanically coupled at the first end to the first layer and suspended above the first layer for at least a portion of the length thereof, and the second end having a region above the first aperture, the beam having a cylindrical shape along at least a portion of a length thereof; a first boss coupled to a lower surface of the second end of the beam and suspended at least partially within the first aperture; and a second boss coupled to an upper surface of the second end of the beam.
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16. A sensor, comprising:
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a semiconductor substrate; a first layer of material formed on a surface of the substrate; a beam having first and second ends, the beam being mechanically coupled at the first end to the first layer and suspended above the first layer such that the second end forms a cantilever above the first layer; means for increasing a bi-directional sensitivity of the cantilever to acceleration of the substrate along a first axis; and means for detecting response of the beam to acceleration bi-directionally along the one axis. - View Dependent Claims (17, 18, 19)
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20. A system, comprising:
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a vehicle having a motor, a drive train coupled to the motor, an axle coupled to the drive train, and wheels coupled to the axle for causing movement of the vehicle powered by the motor; a passenger seat within said vehicle; an airbag positioned adjacent to the passenger seat; a sensor coupled to the airbag configured to cause inflation of the airbag, the sensor including; a semiconductor material substrate, a first layer above the semiconductor substrate, a first aperture formed in the first layer, a beam having first and second ends, the beam being mechanically coupled at the first end to the substrate and positioned above the first layer for a portion of a length of the beam to form a cantilever in a plane that is substantially parallel to an upper surface of the substrate, and first and second bosses coupled to upper and lower surfaces, respectively, of the second end of the beam and suspended over the substrate, the first boss suspended at least partially within the aperture. - View Dependent Claims (21)
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22. A method, comprising:
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subjecting a semiconductor substrate to an acceleration; moving a first boss coupled to an outer end of a cantilevered beam that is coupled at an inner end to the substrate, in response to the acceleration; making electrical contact between the first boss and a contact surface on a sidewall of an aperture formed in a layer positioned between the cantilevered beam and the semiconductor substrate if the acceleration exceeds a selected threshold along a selected vector; and sending a signal from the cantilevered beam to a sensing circuit only if the acceleration exceeds the selected threshold along the selected vector. - View Dependent Claims (23, 24, 25, 26, 27, 28, 29)
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30. A sensor, comprising:
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a semiconductor substrate; a first layer formed on a surface of the substrate; a first aperture within the first layer; a beam having first and second ends, the beam being mechanically coupled at the first end to the first layer and suspended above the first layer for at least a portion of the length of the beam and the second end having a region above the first aperture; a boss coupled to a lower surface of the second end of the beam and suspended at least partially within the first aperture; and a first contact surface, a second contact surface, and a third contact surface positioned, respectively, on first, second, and third sidewalls of the first aperture. - View Dependent Claims (31)
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Specification