Apparatus and method for conformal mask manufacturing

• US 7,993,813 B2
• Filed: 11/21/2007
• Issued: 08/09/2011
• Est. Priority Date: 11/22/2006
• Status: Active Grant

• Current Assignee: Nexgen Semi Holding, Inc.
• Original Assignee: Nexgen Semi Holding, Inc.
• Inventors: Zani, Michael, Mayse, Mark, Bennahmias, Mark, Scott, Jeffrey
• Primary Examiner(s): Young; Christopher G
• Application Number:
  US11/944,360
• Publication Number:
  US 20080160431A1
• Time in Patent Office: 1,357 Days
• Field of Search: 430/5, 430/296, 430/942, 438/712
• US Class Current: 430/296
• CPC Class Codes: B82Y 10/00 Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
• CPC Class Codes: B82Y 40/00 Manufacture or treatment of nanostructures
• CPC Class Codes: H01J 37/3174 Particle-beam lithography, e.g. electron beam lithography
• CPC Class Codes: H01J 37/3177 Multi-beam, e.g. fly's eye, comb probe
• CPC Class Codes: H01L 21/0331 for lift-off processes
• CPC Class Codes: H01L 21/0332 characterised by their composition, e.g. multilayer masks, materials
• CPC Class Codes: H01L 21/0337 characterised by the process involved to create the mask, e.g. lift-off masks, sidewalls, or to modify the mask, e.g. pre-treatment, post-treatment
• CPC Class Codes: H01L 21/26533 of electrically inactive species in silicon to make buried insulating layers
• CPC Class Codes: H01L 21/28123 Lithography-related aspects, e.g. sub-lithography lengths; Isolation-related aspects, e.g. to solve problems arising at the crossing with the side of the device isolation; Planarisation aspects
• CPC Class Codes: H01L 21/30621 Vapour phase etching
• CPC Class Codes: H01L 29/66659 with asymmetry in the channel direction, e.g. lateral high-voltage MISFETs with drain offset region, extended drain MISFETs
• CPC Class Codes: H01L 29/7835 with asymmetrical source and drain regions, e.g. lateral high-voltage MISFETs with drain offset region, extended drain MISFETs
• CPC Class Codes: Y10S 430/143 Electron beam

Abstract

A manufacturing process technology creates a pattern on a first layer using a focused ion beam process. The pattern is transferred to a second layer, which may act as a traditional etch stop layer. The pattern can be formed on the second layer without irradiation by light through a reticle and without wet chemical developing, thereby enabling conformal coverage and very fine critical feature control. Both dark field patterns and light field patterns are disclosed, which may enable reduced or minimal exposure by the focused ion beam.

Claims

1. A method for processing comprising:

providing a workpiece comprising a resistless layer that is configured to be patterned by a particle beam and a first transfer layer thereunder, the particle beam patternable layer being thinner than the first transfer layer; and

exposing regions of the particle beam patternable layer using a collimated beam of spatially and temporally resolved charged particles, thereby changing said regions;

wherein the first transfer layer is configured to be selectively processed relative to the particle beam patternable layer using a first removal process that removes regions of the first transfer layer having a shape substantially determined by the shape of the exposed regions of the particle beam patternable layer.

2. The method of claim 1, further comprising a second transfer layer configured to be selectively processed relative to the first transfer layer using a second removal process that removes regions of the second transfer layer having a shape substantially determined by the shape of the exposed regions of the particle beam patternable layer.

3. The method of claim 2, wherein said first transfer layer is between said particle beam patternable layer and said second transfer layer.

4. The method of claim 2, wherein the first transfer layer is configured to be selectively processed relative to the second transfer layer using said first removal process.

5. The method of claim 2, wherein the second transfer layer is about 1 to 1000 nm thick.

6. The method of claim 5, wherein the second transfer layer is about 5 to 500 nm thick.

7. The method of claim 6, wherein the second transfer layer is about 10 to 200 nm thick.

8. The method of claim 2, wherein the second transfer layer comprises organic material.

9. The method of claim 2, wherein the first transfer layer is thinner than the second transfer layer.

10. The method of claim 2, wherein the first transfer layer is about 1 to 1000 nm thick.

11. The method of claim 10, wherein the first transfer layer is about 5 to 500 nm thick.

12. The method of claim 11, wherein the first transfer layer is about 10 to 200 nm thick.

13. The method of claim 12, wherein the first transfer layer is about 1 to 20 nm thick.

14. The method of claim 2, wherein the first transfer layer comprises a metal.

15. The method of claim 14, wherein the first transfer layer comprises titanium.

16. The method of claim 2, wherein the first transfer layer comprises a semiconductor or metalloid.

17. The method of claim 16, wherein the first transfer layer comprises silicon.

18. The method of claim 1, wherein the particle beam patternable layer is about 0.1 angstrom to 200 nm thick.

19. The method of claim 18, wherein the particle beam patternable layer is about 5 angstroms to 100 nm thick.

20. The method of claim 19, wherein the particle beam patternable layer is about 20 angstroms to 10 nm thick.

21. The method of claim 18, wherein the particle beam patternable layer is about 1 to 2 nm thick.

22. The method of claim 1, wherein the particle beam patternable layer comprises an oxide.

23. The method of claim 22, wherein the particle beam patternable layer comprises aluminum oxide.

24. The method of claim 1, wherein said particle beam patternable layer is formed by adsorbing atoms or molecules, and the particle beam patternable layer forms a complex when subjected to a reactive fluid.

25. The method of claim 24, further comprising removing the exposed regions of the particle beam patternable layer.

26. The method of claim 25, further comprising subjecting the adsorbed layer to the reactive fluid to form the complex in the regions of the particle beam patternable layer not subjected to the beam of charged particles.

27. The method of claim 25, wherein the complex comprises an oxide monolayer.

28. The method of claim 1, wherein the first removal process comprises an etch process.

29. The method of claim 28, wherein the first removal process comprises a wet etch.

30. The method of claim 28, wherein the first removal process comprises a dry etch.

31. The method of claim 30, wherein the dry etch comprises reactive ion etch.

32. The method of claim 2, wherein the second removal process comprises an etch process.

33. The method of claim 32, wherein the second removal process comprises a dry etch.

34. The method of claim 33, wherein the dry etch comprises reactive ion etch.

35. The method of claim 1, wherein subjecting the regions of the particle beam patternable layer to the collimated beam of spatially and temporally resolved charged particles is adapted to substantially remove the regions of said particle beam patternable layer down to said first transfer layer.

36. The method of claim 1, wherein the first transfer layer comprises organic material.

37. The method of claim 36, wherein the first transfer layer is about 1 to 1000 nm thick.

38. The method of claim 37, wherein the first transfer layer is about 5 to 500 nm thick.

39. The method of claim 38, wherein the first transfer layer is about 10 to 200 nm thick.

210. The method of claim 1, wherein the workpiece comprises a semiconductor wafer.

211. The method of claim 1, wherein the workpiece comprises a photomask.

212. The method of claim 1, wherein the workpiece comprises a data storage disk.

40. A method for forming structures comprising:

providing a workpiece comprising a resistless layer that is configured to be patterned by a particle beam and a first transfer layer thereunder;

exposing regions of the particle beam patternable layer to a collimated beam of spatially and temporally resolved charged particles thereby changing said regions;

removing the exposed regions of the particle beam patternable layer to reveal regions of the first transfer layer having a shape substantially determined by the shape of the exposed regions of the particle beam patternable layer; and

performing a first removal process on the first transfer layer thereby removing regions of the first transfer layer having a shape substantially determined by the shape of the exposed regions of the particle beam patternable layer.

41. The method of claim 40, wherein the patternable layer is selected to have a particle beam sputter yield greater than 5 atoms/ion.

42. The method of claim 41, wherein the patternable layer is selected to have a particle beam sputter yield greater than 50 atoms/ion.

43. The method of claim 42, wherein the patternable layer is selected to have a particle beam sputter yield greater than 100 atoms/ion.

44. The method of claim 43, wherein the patternable layer is selected to have a particle beam sputter yield greater than 500 atoms/ion.

45. The method of claim 44, wherein the patternable layer is selected to have a particle beam sputter yield greater than 1000 atoms/ion.

46. The method of claim 45, wherein the patternable layer is selected to have a particle beam sputter yield greater than 5000 atoms/ion.

47. The method of claim 40, wherein the removed regions of the first transfer layer have substantially the same shape as the exposed regions of the particle beam patternable layer.

48. The method of claim 40, wherein the removed regions of the first transfer layer have substantially the same critical dimensions as the exposed regions of the particle beam patternable layer.

49. The method of claim 40, wherein the workpiece further comprises a second transfer layer configured to be selectively processed relative to the first transfer layer using a second removal process.

50. The method of claim 49, wherein the first transfer layer is configured to be selectively processed relative to the second transfer layer using the first removal process.

51. The method of claim 49, further comprising performing the second removal process on the second transfer layer thereby removing regions of the second transfer layer having a shape substantially determined by the exposed regions of the particle beam patternable layer.

52. The method of claim 51, wherein the second removal process removes regions of the second transfer layer having substantially the same shape as the exposed regions of the particle beam patternable layer down to a material below the second transfer layer.

53. The method of claim 51, wherein the removed regions of the second transfer layer have substantially the same critical dimensions as the exposed regions of the particle beam patternable layer.

54. The method of claim 40, wherein the first removal process comprises an etch process.

55. The method of claim 54, wherein the first removal process comprises a dry etch.

56. The method of claim 55, wherein the dry etch comprises a reactive ion etch.

57. The method of claim 49, wherein the second removal process comprises an etch process.

58. The method of claim 57, wherein the second removal process comprises a dry etch.

59. The method of claim 58, wherein the dry etch comprises a reactive ion etch.

60. The method of claim 49, wherein the second pattern layer is selected to have a reactive sensitivity to light or UV of less than 100 mJ/cm².

61. The method of claim 60, wherein the second pattern layer is selected to have a reactive sensitivity to light or UV of less than 50 mJ/cm².

62. The method of claim 61, wherein the second pattern layer is selected to have a reactive sensitivity to light or UV of less than 10 mJ/cm².

63. The method of claim 62, wherein the second pattern layer is selected to have a reactive sensitivity to light or UV of less than 5 mJ/cm².

64. The method of claim 63, wherein the second pattern layer is selected to have a reactive sensitivity to light or UV of less than 1 mJ/cm².

65. The method of claim 51, wherein the second removal process comprises exposing the second transfer layer to light and applying developer to the exposed second transfer layer.

66. The method of claim 65, wherein the developer comprises a wet chemical developer.

67. The method of claim 51, further comprising stopping the second removal process when the second transfer layer reaches a selected thickness.

68. The method of claim 67, wherein the selected thickness is about 0 to 90% of the thickness prior to application of the second removal process.

69. The method of claim 68, wherein the selected thickness is about 0 to 70% of the thickness prior to application of the second removal process.

70. The method of claim 69, wherein the selected thickness is about 0 to 50% of the thickness prior to application of the second removal process.

71. The method of claim 67, further comprising:

substantially removing the particle beam patternable layer;

using a third removal process to at least partially remove the first transfer layer, the third removal process selectively processing the first transfer layer relative to the second transfer layer; and

using a fourth removal process to remove regions of the second transfer layer having a shape substantially determined by the exposed regions of the particle beam patternable layer.

72. The method of claim 71, wherein the third removal process removes the first transfer layer down to the second transfer layer.

73. The method of claim 71, wherein the third removal process comprises a dry etch.

74. The method of claim 71, wherein the fourth removal process reveals regions of the workpiece having a shape substantially determined by the shape of the exposed regions of the particle beam patternable layer and reacts with the revealed regions of the workpiece.

75. The method of claim 49, further comprising depositing a material into the regions of the first transfer layer.

76. The method of claim 75, wherein the deposited material comprises a metal.

77. The method of claim 75, wherein the workpiece further comprises a plating base layer and electroplating is used to deposit said deposited material.

78. The method of claim 75, further comprising:

substantially removing the particle beam patternable layer;

selectively processing the first transfer layer relative to said deposited material using a third removal process; and

selectively processing the second transfer layer relative to the deposited material using a fourth removal process.

79. A method for processing comprising:

providing a workpiece comprising a resistless layer that is configured to be patterned by a particle beam and a first transfer layer under the patternable layer; and

exposing regions of the particle beam patternable layer to a beam of charged particles thereby changing said regions;

wherein the first transfer layer is configured to be selectively processed relative to the particle beam patternable layer using a first removal process that removes regions of the first transfer layer having a shape substantially determined by the shape of the exposed regions of the particle beam patternable layer, the selectivity of the first removal process to the first transfer layer relative to the patternable layer being at least 2x.

80. The method of claim 79, further comprising a second transfer layer configured to be selectively processed relative to the first transfer layer using a second removal process that removes regions of the second transfer layer having a shape substantially determined by the shape of the exposed regions of the particle beam patternable layer.

81. The method of claim 80, the selectivity of the second removal process to the second transfer layer relative to the first transfer layer being at least 2x.

82. The method of claim 81, the selectivity of the second removal process to the second transfer layer relative to the first transfer layer being at least 10x.

83. The method of claim 82, the selectivity of the second removal process to the second transfer layer relative to the first transfer layer being at least 50x.

84. The method of claim 83, the selectivity of the second removal process to the second transfer layer relative to the first transfer layer being at least 100x.

85. The method of claim 84, the selectivity of the second removal process to the second transfer layer relative to the first transfer layer being at least 500x.

86. The method of claim 79, the selectivity of the first removal process to the first layer relative to the patternable layer being at least 10x.

87. The method of claim 86, the selectivity of the first removal process to the first layer relative to the patternable layer being at least 50x.

88. The method of claim 87, the selectivity of the second removal process to the first layer relative to the patternable layer being at least 100x.

89. The method of claim 88, the selectivity of the second removal process to the first layer relative to the patternable layer being at least 500x.

90. The method of claim 80, wherein the second transfer layer is about 1 to 1000 nm thick.

91. The method of claim 90, wherein the second transfer layer is about 5 to 500 nm thick.

92. The method of claim 91, wherein the second transfer layer is about 10 to 200 nm thick.

93. The method of claim 80, wherein the second transfer layer comprises organic material.

94. The method of claim 80, wherein the first transfer layer is thinner than the second transfer layer.

95. The method of claim 80, wherein the first transfer layer is about 1 to 1000 nm thick.

96. The method of claim 95, wherein the first transfer layer is about 5 to 500 nm thick.

97. The method of claim 96, wherein the first transfer layer is about 10 to 200 nm thick.

98. The method of claim 95, wherein the first transfer layer is about 1 to 20 nm thick.

99. The method of claim 79, wherein the first transfer layer comprises titanium.

100. The method of claim 79, wherein the first transfer layer comprises silicon.

101. The method of claim 79, wherein the particle beam patternable layer is about 0.1 angstroms to 200 nm thick.

102. The method of claim 101, wherein the particle beam patternable layer is about 5 angstroms to 100 nm thick.

103. The method of claim 102, wherein the particle beam patternable layer is about 20 angstroms to 10 nm thick.

104. The method of claim 101, wherein the particle beam patternable layer is about 1 to 2 nm thick.

105. The method of claim 79, wherein the particle beam patternable layer comprises an oxide.

106. The method of claim 79, wherein said particle beam patternable layer is formed by adsorbing atoms or molecules, and the particle beam patternable layer forms a complex when subjected to a reactive fluid.

107. The method of claim 106, further comprising removing said exposed regions of the particle beam patternable layer.

108. The method of claim 107, further comprising subjecting the adsorbed layer to the reactive fluid to form the complex in the regions of the particle beam patternable layer not subjected to the beam of charged particles.

109. The method of claim 107, wherein the complex comprises an oxide monolayer.

110. The method of claim 79, wherein the first removal process comprises an etch process.

111. The method of claim 110, wherein the first removal process comprises a dry etch.

112. The method of claim 111, wherein the first removal process comprises reactive ion etch.

113. The method of claim 80, wherein the second removal process comprises an etch process.

114. The method of claim 113, wherein the second removal process comprises a dry etch.

115. The method of claim 114, wherein the second removal process comprises reactive ion etch.

116. The method of claim 79, wherein subjecting the regions of the particle beam patternable layer to the beam of charged particles removes the regions of said particle beam patternable layer down to said first transfer layer.

117. A method for forming structures comprising:

providing a workpiece comprising a resistless layer that is configured to be patterned by a particle beam and a first transfer layer under the particle beam patternable layer,

the first transfer layer being configured to be selectively processed relative to the particle beam patternable layer using a first removal process that removes regions of the first transfer layer having a shape substantially determined by the shape of the exposed regions of the particle beam patternable layer, the selectivity of the first removal process to the first transfer layer relative to the particle beam patternable layer being at least 2x; and

exposing regions of the particle beam patternable layer to a beam of charged particles thereby changing said regions;

removing the exposed regions of the particle beam patternable layer to reveal regions of the first transfer layer having a shape substantially determined by the shape of the exposed regions of the particle beam patternable layer; and

performing the first removal process on the first transfer layer.

118. The method of claim 117, selectivity of the first removal process to the first transfer layer relative to the patternable layer being at least 10x.

119. The method of claim 118, selectivity of the first removal process to the first transfer layer relative to the patternable layer being at least 50x.

120. The method of claim 119, selectivity of the first removal process to the first transfer layer relative to the patternable layer being at least 100x.

121. The method of claim 120, selectivity of the first removal process to the first transfer layer relative to the patternable layer being at least 500x.

122. The method of claim 117 further comprising a second transfer layer under the first transfer layer, the second transfer layer being configured to be selectively processed relative to the first transfer layer using a second removal process that removes regions of the second transfer layer having a shape substantially determined by the shape of the exposed regions of the particle beam patternable layer.

123. The method of claim 122 further comprising performing the second removal process on the second transfer layer.

124. The method of claim 122, the selectivity of the second removal process to the second transfer layer relative to the first transfer layer being at least 2x.

125. The method of claim 124, the selectivity of the second removal process to the second transfer layer relative to the first transfer layer being at least 10x.

126. The method of claim 125, the selectivity of the second removal process to the second transfer layer relative to the first transfer layer being at least 50x.

127. The method of claim 126, the selectivity of the second removal process to the second transfer layer relative to the first transfer layer being at least 100x.

128. The method of claim 127, the selectivity of the second removal process to the second transfer layer relative to the first transfer layer being at least 500x.

129. The method of claim 117, wherein the particle beam patternable layer is selected to have a particle beam sputter yield greater than 5 atoms/ion.

130. The method of claim 129, wherein the particle beam patternable layer is selected to have a particle beam sputter yield greater than 5 atoms/ion.

131. The method of claim 130, wherein the particle beam patternable layer is selected to have a particle beam sputter yield greater than 50 atoms/ion.

132. The method of claim 131, wherein the particle beam patternable layer is selected to have a particle beam sputter yield greater than 100 atoms/ion.

133. The method of claim 132, wherein the particle beam patternable layer is selected to have a particle beam sputter yield greater than 500 atoms/ion.

134. The method of claim 133, wherein the particle beam patternable layer is selected to have a particle beam sputter yield greater than 1000 atoms/ion.

135. The method of claim 134, wherein the particle beam patternable layer is selected to have a particle beam sputter yield greater than 5000 atoms/ion.

136. The method of claim 117, wherein the removed regions of the first transfer layer have substantially the same shape as the exposed regions of the particle beam patternable layer.

137. The method of claim 117, wherein the removed regions of the first transfer layer have substantially the same critical dimensions as the exposed regions of the particle beam patternable layer.

138. The method of claim 123, wherein the second removal process removes regions of the second transfer layer having substantially the same shape as the exposed regions of the particle beam patternable layer down to a material below the second transfer layer.

139. The method of claim 123, wherein the removed regions of the second transfer layer have substantially the same critical dimensions as the exposed regions of the particle beam patternable layer.

140. The method of claim 117, wherein the first removal process comprises an etch process.

141. The method of claim 117, wherein the first removal process comprises a dry etch.

142. The method of claim 141, wherein the first removal process comprises a reactive ion etch.

143. The method of claim 122, wherein the second removal process comprises an etch process.

144. The method of claim 143, wherein the second removal process comprises a dry etch.

145. The method of claim 143, wherein the second removal process comprises a reactive ion etch.

146. The method of claim 122, wherein the second pattern layer is selected to have a reactive sensitivity to light or UV of less than 100 mJ/cm².

147. The method of claim 146, wherein the second pattern layer is selected to have a reactive sensitivity to light or UV of less than 50 mJ/cm².

148. The method of claim 147, wherein the second pattern layer is selected to have a reactive sensitivity to light or UV of less than 10 mJ/cm².

149. The method of claim 148, wherein the second pattern layer is selected to have a reactive sensitivity to light or UV of less than 5 mJ/cm².

150. The method of claim 149, wherein the second pattern layer is selected to have a reactive sensitivity to light or UV of less than 1 mJ/cm².

151. The method of claim 122, wherein the second removal process comprises exposing the second transfer layer to light or UV and applying developer to the exposed second transfer layer.

152. The method of claim 151, wherein the developer comprises a wet chemical developer.

153. The method of claim 123, further comprising stopping the second removal process when the second transfer layer reaches a selected thickness.

154. The method of claim 153, wherein the selected thickness is about 0 to 90% of the thickness prior to application of the second removal process.

155. The method of claim 154, wherein the selected thickness is about 0 to 70% of the thickness prior to application of the second removal process.

156. The method of claim 155, wherein the selected thickness is about 0 to 50% of the thickness prior to application of the second removal process.

157. The method of claim 123, further comprising:

substantially removing the particle beam patternable layer;

using a third removal process to at least partially remove the first transfer layer, the third removal process selectively processing the first transfer layer relative to the second transfer layer; and

using a fourth removal process to remove regions of the second transfer layer having a shape substantially determined by the shape of the exposed regions of the particle beam patternable layer.

158. The method of claim 157, wherein the third removal process substantially removes the first transfer layer down to the second transfer layer.

159. The method of claim 157, wherein the third removal process comprises a dry etch.

160. The method of claim 157, wherein the fourth removal process reveals regions of the workpiece having a shape substantially determined by the shape of the exposed regions of the particle beam patternable layer and reacts with the revealed regions of the workpiece.

161. The method of claim 123, further comprising depositing a material into the regions of the second transfer layer.

162. The method of claim 161, wherein the deposited material comprises a metal.

163. The method of claim 161, wherein the workpiece further comprises a plating base layer and electroplating is used to deposit said material.

164. The method of claim 161, further comprising:

substantially removing the particle beam patternable layer;

selectively processing the first transfer layer relative to said deposited material using a third removal process; and

selectively processing the second transfer layer relative to the deposited material using a fourth removal process.

165. An in-process workpiece comprising:

a substrate;

a first transfer layer;

a second transfer layer between the first transfer layer and the substrate, said second transfer layer comprising organic material; and

a patterned resistless layer of oxide, the first transfer layer disposed between the oxide layer and the second transfer layer,

wherein the first transfer material is configured to be selectively removed relative to the oxide layer and relative to the second transfer layer, and

wherein the second transfer layer is configured to be selectively removed relative to the first transfer layer.

166. The workpiece of claim 165, wherein the organic material comprises photoresist.

167. The workpiece of claim 165, wherein the oxide layer has a thickness between about 0.1 angstroms and 200 nm.

168. The workpiece of claim 167, wherein the oxide layer has a thickness between about 5 angstroms and 100 nm.

169. The workpiece of claim 168, wherein the oxide layer has a thickness between about 20 angstroms and 10 nm.

170. The workpiece of claim 167, wherein the oxide layer has a thickness between about 1 and 2 nm.

171. A method for processing comprising:

providing a workpiece comprising a first transfer layer; and

depositing material on regions of the first transfer layer using a particle beam thereby forming on the first transfer layer a layer having a pattern,

wherein the first transfer layer is configured to be selectively processed relative to the patterned layer using a first removal process that removes regions of the first transfer layer having a shape substantially determined by the shape of the deposited regions of the patterned layer.

172. The method of claim 171, further comprising a second transfer layer configured to be selectively processed relative to the first transfer layer using a second removal process that removes regions of the second transfer layer having a shape substantially determined by the shape of the deposited regions of the patterned layer.

173. The method of claim 172, wherein the first transfer layer is configured to be selectively processed relative to the second transfer layer using said first removal process.

174. The method of claim 172, wherein the second transfer layer is about 1 to 1000 nm thick.

175. The method of claim 174, wherein the second transfer layer is about 5 to 500 nm thick.

176. The method of claim 175, wherein the second transfer layer is about 10 to 200 nm thick.

177. The method of claim 172, wherein the second transfer layer comprises organic material.

178. The method of claim 172, wherein the first transfer layer is thinner than the second transfer layer.

179. The method of claim 172, wherein the first transfer layer is about 1 to 1000 nm thick.

180. The method of claim 179, wherein the first transfer layer is about 5 to 500 nm thick.

181. The method of claim 180, wherein the first transfer layer is about 10 to 200 nm thick.

182. The method of claim 179, wherein the first transfer layer is about 1 to 20 nm thick.

183. The method of claim 172, wherein the first transfer layer comprises titanium.

184. The method of claim 172, wherein the first transfer layer comprises silicon.

185. The method of claim 171, wherein the pattern layer is about 0.1 angstroms monolayer to 200 nm thick.

186. The method of claim 185, wherein the pattern layer is about 5 angstroms to 100 nm thick.

187. The method of claim 186, wherein the pattern layer is about 20 angstroms to 10 nm thick.

188. The method of claim 185, wherein the pattern layer is about 1 to 2 nm thick.

189. The method of claim 171, wherein the first removal process comprises an etch process.

190. The method of claim 189, wherein the first removal process comprises a dry etch.

191. The method of claim 190, wherein the first removal process comprises reactive ion etch.

192. The method of claim 172, wherein the second removal process comprises an etch process.

193. The method of claim 192, wherein the second removal process comprises a dry etch.

194. The method of claim 193, wherein the second removal process comprises reactive ion etch.

195. The method of claim 171, wherein the first transfer layer is about 1 to 1000 nm thick.

196. The method of claim 195, wherein the first transfer layer is about 5 to 500 nm thick.

197. The method of claim 196, wherein the first transfer layer is about 10 to 200 nm thick.

198. The method of claim 171, wherein the first transfer layer comprises organic material.

199. The method of claim 171, wherein the particle beam comprises a collimated beam of spatially and temporally resolved charged particles.

200. The method of claim 171, the selectivity of the first removal process to the first transfer layer relative to the patterned layer being at least 2x.

201. The method of claim 200, the selectivity of the first removal process to the first transfer layer relative to the patterned layer being at least 10x.

202. The method of claim 201, the selectivity of the first removal process to the first transfer layer relative to the patterned layer being at least 50x.

203. The method of claim 202, the selectivity of the first removal process to the first transfer layer relative to the patterned layer being at least 100x.

204. The method of claim 203, the selectivity of the first removal process to the first transfer layer relative to the patterned layer being at least 500x.

205. The method of claim 172, wherein the selectivity of the second removal process to the second transfer layer relative to the first transfer layer is at least 2x.

206. The method of claim 205, wherein the selectivity of the second removal process to the second transfer layer relative to the first transfer layer is at least 10x.

207. The method of claim 206, wherein the selectivity of the second removal process to the second transfer layer relative to the first transfer layer is at least 50x.

208. The method of claim 207, wherein the selectivity of the second removal process to the second transfer layer relative to the first transfer layer is at least 100x.

209. The method of claim 208, wherein the selectivity of the second removal process to the second transfer layer relative to the first transfer layer is at least 500x.