Substrate processing apparatus

• US 8,012,259 B2
• Filed: 03/06/2008
• Issued: 09/06/2011
• Est. Priority Date: 03/09/2007
• Status: Expired due to Fees

• Current Assignee: Kokusai Electric Corp.
• Original Assignee: Hitachi Kokusai Electric Incorporated (Hitachi, Ltd.)
• Inventors: Takebayashi, Yuji
• Primary Examiner(s): Chen; Keath T
• Application Number:
  US12/043,574
• Publication Number:
  US 20080216742A1
• Time in Patent Office: 1,279 Days
• Field of Search: 118/715
• US Class Current: 118/715
• CPC Class Codes: C23C 16/45546 specially adapted for a substrate stack in the ALD reactor
• CPC Class Codes: C23C 16/45591 Fixed means, e.g. wings, baffles
• CPC Class Codes: C23C 16/4584 the substrate being rotated
• CPC Class Codes: H01L 21/67309 characterized by the substrate support

Abstract

A substrate processing apparatus having a support for holding a wafer, a processing chamber for accommodating the wafer, a gas supply hole for supplying desired processing gas in a parallel direction to the surface to be processed of the wafer to be accommodated in said processing chamber, an adjustment plate to be arranged with facing the surface to be processed of the wafer accommodated in the foregoing processing chamber, and an exhaust means for exhausting atmosphere in said processing chamber. A substrate processing apparatus wherein distance between the surface to be processed of wafer and the center part of the adjustment plate is narrower than distance between the surface to be processed of wafer and the circumference part and the midway part of the adjustment plate, in a direction perpendicular to a supply direction of processing gas.

Claims

1. A substrate processing apparatus comprising;

a substrate hold unit for holding a substrate;

a processing chamber for accommodating said substrate and said substrate hold unit;

a supply unit for supplying desired processing gas in a parallel direction to the surface to be processed of said substrate;

a member to be arranged with facing the surface to be processed of said substrate to be accommodated in said processing chamber; and

an exhaust unit for exhausting atmosphere in said processing chamber,

wherein a distance between the surface to be processed of said substrate to be accommodated in said processing chamber, and the center part of said member is narrower than a distance between the surface to be processed of said substrate to be accommodated in said processing chamber, and a part other than the center part of said member, in a direction perpendicular to a supplying direction of said processing gas, and

wherein pins for supporting the substrate are installed on the upper surface of said member.

2. A substrate processing apparatus comprising;

a substrate hold unit for holding a substrate;

a processing chamber for accommodating said substrate and said substrate hold unit;

a supply unit for supplying desired processing gas in a parallel direction to the surface to be processed of said substrate;

a member to be arranged with facing the surface to be processed of said substrate to be accommodated in said processing chamber; and

an exhaust unit for exhausting atmosphere in said processing chamber,

wherein a distance between the surface to be processed of said substrate to be accommodated in said processing chamber, and the center part of said member is narrower than a distance between the surface to be processed of said substrate to be accommodated in said processing chamber, and a part other than the center part of said member, in a direction perpendicular to a supplying direction of said processing gas , and

wherein said member is configured slidably along a longitudinal direction of said processing chamber.

3. The substrate processing apparatus according to claim 2 wherein said member is configured by a dielectric substance.

4. A substrate processing apparatus comprising;

a substrate hold unit for holding a substrate;

a processing chamber for accommodating said substrate and said substrate hold unit;

a supply unit for supplying desired processing gas in a parallel direction to the surface to be processed of said substrate;

a member to be arranged with facing the surface to be processed of said substrate to be accommodated in said processing chamber; and

an exhaust unit for exhausting atmosphere in said processing chamber,

wherein a distance between the surface to be processed of said substrate to be accommodated in said processing chamber, and the center part of said member is narrower than a distance between the surface to be processed of said substrate to be accommodated in said processing chamber, and a part other than the center part of said member, in a direction perpendicular to a supplying direction of said processing gas , and

wherein said processing chamber comprises;

an outer tube, and

an inner tube which is installed inside said outer tube, and at least the lower end side is opened, where a plurality of substrates are held and accommodated by the substrate hold unit,

wherein said gas supply unit has a gas nozzle, which has a plurality of gas supply holes, installed inside said inner tube, so as to extend in a lamination direction of said multiple pieces of substrates,

wherein said processing chamber further comprises;

a plurality of exhaust ports installed at said inner tube, at a position facing said gas nozzle, with sandwiching said substrate, and

wherein one sheet of said member per one sheet of the substrate is installed facing the surface to be processed of said substrate.