Device and connecting method for connecting power-supply terminals to a power-supply bus based on noise intensities

• US 8,013,691 B2
• Filed: 02/28/2007
• Issued: 09/06/2011
• Est. Priority Date: 03/01/2006
• Status: Expired due to Fees

• Current Assignee: Daikin Industries Ltd
• Original Assignee: Daikin Industries Ltd
• Inventors: Okano, Takashi
• Primary Examiner(s): Pascal; Robert
• Assistant Examiner(s): Glenn; Kimberly E
• Application Number:
  US12/224,133
• Publication Number:
  US 20090058558A1
• Time in Patent Office: 1,651 Days
• Field of Search: 333/181, 333/185, 361/748
• US Class Current: 333/181
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H05K 1/0216 Reduction of cross-talk, noise or electromagnetic interference grounding H05K1/0215
• CPC Class Codes: H05K 1/0231 Capacitors or dielectric substances
• CPC Class Codes: H05K 1/0233 Filters, inductors or a magnetic substance
• CPC Class Codes: H05K 1/181 associated with surface mounted components
• CPC Class Codes: H05K 2201/086 for inductive purposes, e.g. printed inductor with ferrite core
• CPC Class Codes: H05K 2201/09281 Layout details of a single conductor meander H05K2201/09263; layout details of angles or corners H05K2201/09272
• CPC Class Codes: H05K 2201/10522 Adjacent components
• CPC Class Codes: H05K 2201/10689 Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]

Abstract

One end of a power-supply bus is connected to a power supply through a ferrite bead. The power-supply bus is connected to power-supply terminals. The power-supply terminals are connected at positions in such a manner that a terminal with a higher intensity is connected closer to the other end of the power-supply bus. Ground terminals are connected to ground. Capacitors are bypass capacitors or decoupling capacitors, for example, and connected between respective power-supply terminals and ground.

Claims

1. A device comprising:

a plurality of power-supply terminals;

an integrated circuit that is connected to said plurality of said power-supply terminals; and

a power-supply bus having one end connected to a power supply, and one other end,

said plurality of power-supply terminals being connected to said power-supply bus in such a manner that one of the plurality of power supply, terminals, relative to, other one of the plurality of power supply terminals, having noise of a higher intensity contained in a current flowing in itself is connected to said power-supply bus at a position closer to said one other end.

2. The device according to claim 1, further comprising a plurality of noise removing portions connected between respective ones of said plurality of power-supply terminals and another power supply.

3. The device according to claim 1, further comprising at least one noise removing portion connected, wherein a power-supply terminal with highest noise intensity in said plurality of power-supply terminals is connected to another power supply via said at least one noise removing portion, whereas at least one power-supply terminal not having highest noise intensity in said plurality power-supply terminals is connected to said another power supply by said at least one noise removing portion.

4. The device according to claim 2, wherein said plurality of noise removing portions are capacitors.

5. The device according to claim 3, wherein said at least one noise removing portion is a capacitor.

6. The device according to claim 4, wherein a resonance frequency determined by one of said capacitors and said power-supply bus differs from a resonance frequency determined by another of said capacitors and said power-supply bus.

7. The device according to claim 5, wherein said at least one noise removing portion is a plurality of noise removing portions, and said plurality of noise removing portions are capacitors, and a resonance frequency determined by one of said capacitors and said power-supply bus differs from a resonance frequency determined by another of said capacitors and said power-supply bus.

8. The device according to claim 1, wherein the one end of said power-supply bus is connected to said power supply through a second noise removing portion.

9. The device according to claim 8, wherein said second noise removing portion is a ferrite bead.

10. The device according to claim 1, further comprising:

an interconnection connected to ground; and

a multilayer stacked substrate in which said power-supply bus and said interconnection are stacked with an insulating substrate therebetween,

wherein said integrated circuit is provided on said multilayer stacked substrate on a side of said power-supply bus, and

a distance between said integrated circuit and said interconnection is not more than 1 mm in a direction of stacking of said multilayer stacked substrate.

11. The device according to claim 8, further comprising:

an interconnection connected to ground; and

a multilayer stacked substrate in which said power-supply bus and said interconnection are stacked with an insulating substrate therebetween,

wherein said integrated circuit is provided on said multilayer stacked substrate on a side of said power-supply bus, and

a distance between said integrated circuit and said interconnection is not more than 1 mm in a direction of stacking of said multilayer stacked substrate.

12. The device according to claim 9, further comprising:

an interconnection connected to ground; and

a multilayer stacked substrate in which said power-supply bus and said interconnection are stacked with an insulating substrate therebetween,

wherein said integrated circuit is provided on said multilayer stacked substrate on a side of said power-supply bus, and

a distance between said integrated circuit and said interconnection is not more than 1 mm in a direction of stacking of said multilayer stacked substrate.

13. The device according to claim 1, further comprising:

a substrate; and

an interconnection connected to ground,

wherein said integrated circuit is provided on a surface of the substrate, and

said interconnection is provided on the same said surface with said integrated circuit, and surrounds said integrated circuit and said power-supply terminals.

14. The device according to claim 2, further comprising:

a substrate; and

an interconnection connected to ground,

wherein said integrated circuit is provided on a surface of the substrate, and

said interconnection is provided on the same said surface with said integrated circuit, and surrounds said integrated circuit and said power-supply terminals.

15. The device according to claim 3, further comprising:

a substrate; and

an interconnection connected to ground,

wherein said integrated circuit is provided on a surface of the substrate, and

said interconnection is provided on the same said surface with said integrated circuit, and surrounds said integrated circuit and said power-supply terminals.

18. The device according to claim 4, further comprising:

a substrate; and

an interconnection connected to ground,

wherein said integrated circuit is provided on a surface of the substrate, and

said interconnection is provided on the same said surface with said integrated circuit, and surrounds said integrated circuit and said power-supply terminals.

19. The device according to claim 5, further comprising:

a substrate; and

an interconnection connected to ground,

wherein said integrated circuit is provided on a surface of the substrate, and

said interconnection is provided on the same said surface with said integrated circuit, and surrounds said integrated circuit and said power-supply terminals.

20. The device according to claim 7, further comprising:

a substrate; and

an interconnection connected to ground,

wherein said integrated circuit is provided on a surface of the substrate, and

said interconnection is provided on the same said surface with said integrated circuit, and surrounds said integrated circuit and said power-supply terminals.

16. A connecting method, wherein a device comprises:

a plurality of power-supply terminals;

an integrated circuit that is connected to said plurality of said power-supply terminals; and

a power-supply bus having one end connected to a power supply, and one other end,

and wherein said connecting method is a method for connecting said plurality of power-supply terminals of said device to said power-supply bus, and

said power-supply terminals are connected to said power-supply bus in such a manner that one of the plurality of power supply, terminals, relative to, other one of the plurality of power supply terminals, having noise of a higher intensity contained in a current flowing in itself is connected to said power-supply bus at a position closer to said one other end.

17. The connecting method according to claim 16, comprising:

connecting said plurality of power-supply terminals to a power-supply bus prepared separately from said power-supply bus, and supplying a power supply to said integrated circuit;

previously measuring intensities of noises of currents respectively flowing in said plurality of power-supply terminals; and

determining said positions at which said plurality of power-supply terminals are connected to said power-supply bus on the basis of said intensities of noises.