Lighting module
First Claim
Patent Images
1. A lighting module comprising:
- a base panel; and
a plurality of light-emitting diode chips attached directly to the base panel in electrical communication with a conductive trace;
wherein at least a portion of the base panel has a lumens-density metric greater than 1.0×
106 lm2/mm2W.
2 Assignments
0 Petitions
Accused Products
Abstract
A lighting module comprising a base panel and a plurality of light-emitting diode (LED) chips attached directly to the base panel. The LED chips are in electrical communication with conductive traces on the base panel, which deliver a current to the LED chips. Various embodiments of this generally described lighting module are also presented. Additionally, methods of preparing such a lighting module, and system components of the lighting module are presented.
58 Citations
30 Claims
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1. A lighting module comprising:
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a base panel; and a plurality of light-emitting diode chips attached directly to the base panel in electrical communication with a conductive trace; wherein at least a portion of the base panel has a lumens-density metric greater than 1.0×
106 lm2/mm2W. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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20. A lighting module comprising:
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a base panel; and wherein an area of the base panel about four inches wide and about four inches long includes about twenty-five light-emitting diode chips attached directly to the base panel in electrical communication with a conductive trace, wherein each light-emitting diode chip is about 500 μ
m wide by about 500 μ
m long; anda power source delivering a forward voltage of about 3.2+/−
0.3 volts;wherein at least a portion of the base panel has a lumens-density metric greater than 2.0×
106 lm2/mm2W.
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21. A lighting module comprising:
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a base panel; and wherein an area of the base panel about four inches wide and about four inches long includes about twenty-five light-emitting diode chips attached directly to the base panel in electrical communication with a conductive trace, wherein each light-emitting diode chip is about 500 μ
m wide by about 500 μ
m long; anda power source delivering a rated current of about 0.080+/−
0.010 amperes;wherein at least a portion of the base panel has a lumens-density metric greater than 2.0×
106 lm2/mm2W.
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22. A method of preparing a lighting module, comprising:
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attaching a plurality of light-emitting diode chips to a base panel in accordance with a lumens-density metric of greater than 1.0×
106 lm2/mm2W; andcoupling the light-emitting diode chips to a conductive trace. - View Dependent Claims (23, 24, 25)
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26. A lighting module comprising:
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a base panel; a plurality of conductive traces disposed on the base panel; and a plurality of light-emitting diode chips in electrical communication with the conductive traces and arranged in a serial configuration; wherein at least a portion of the base panel has a lumens-density metric greater than 1.0×
106 lm2/mm2W. - View Dependent Claims (27, 28, 29)
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30. A lighting module comprising:
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a base panel; and an 18 mm by 18 mm section of the base panel including four light-emitting diode chips, wherein each light-emitting diode chip is about 500 μ
m wide and about 500 μ
m long and is in electrical communication a conductive trace in a serial configuration; anda current source delivering about 50 mA of current to the light-emitting diode chips; wherein at least a portion of the base panel has a lumens-density metric greater than 1.0×
106 lm2/mm2W.
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Specification