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Method and apparatus for integrated-circuit battery devices

  • US 8,044,508 B2
  • Filed: 10/18/2006
  • Issued: 10/25/2011
  • Est. Priority Date: 03/24/2000
  • Status: Active Grant
First Claim
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1. An integrated circuit package apparatus, comprising:

  • an integrated circuit die;

    a lead-frame;

    a thin-film battery provided on a substrate, wherein the thin-film battery includes a plurality of layers successively deposited on one another as solid-state thin-film layers;

    an electrical connection between said integrated circuit die and said thin-film battery;

    said integrated circuit die, said lead-frame;

    said substrate, said thin-film battery and said electrical connection encapsulated together within an encapsulant material, wherein said lead-frame includes a die pad on which said integrated circuit die is supported, said thin-film battery interposed between said die pad and said integrated circuit die, and wherein said plurality of layers of the thin-film battery includes a first electrode layer electrically connected to a back of said integrated circuit die, and a second electrode layer electrically connected to said die pad, and wherein said die pad is electrically connected to said integrated circuit die.

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