Reworkable thermosetting resin composition

• US 8,053,587 B2
• Filed: 12/20/2007
• Issued: 11/08/2011
• Est. Priority Date: 03/31/2000
• Status: Expired due to Fees

• Current Assignee: Henkel IP & Holding GmbH (Henkel AG & Co KGaA)
• Original Assignee: Henkel Corporation (Henkel AG & Co KGaA)
• Inventors: Doba, Takahisa, Torres-Filho, Afranio, Yeager, Erin K., Messana, Andrew D., Klemarczyk, Philip T.
• Primary Examiner(s): DENTZ, BERNARD I
• Application Number:
  US12/004,343
• Publication Number:
  US 20080214840A1
• Time in Patent Office: 1,419 Days
• Field of Search: 549/1, 549/545
• US Class Current: 549/545
• CPC Class Codes: C07D 407/12 linked by a chain containing hetero atoms as chain links
• CPC Class Codes: C07D 493/08 Bridged systems
• CPC Class Codes: C07D 493/10 Spiro-condensed systems
• CPC Class Codes: C08G 59/24 carbocyclic
• CPC Class Codes: C08G 59/40 characterised by the curing agents used
• CPC Class Codes: C08K 5/0025 Crosslinking or vulcanising agents; including accelerators
• CPC Class Codes: H01L 21/563 Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73203 Bump and layer connectors
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 23/293 Organic, e.g. plastic
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01012 Magnesium [Mg]
• CPC Class Codes: H01L 2924/01019 Potassium [K]
• CPC Class Codes: H01L 2924/01077 Iridium [Ir]

Abstract

This invention relates to thermosetting resin compositions useful for mounting onto a circuit board semiconductor devices, such as CSPs, BGAs, LGAs and the like, each of which having a semiconductor chip, such as LSI, on a carrier substrate. The compositions of this invention are reworkable when subjected to appropriate conditions.

Claims

1. A compound within the following structure:

2. A compound represented by: