Light emitting diode and method of fabricating the same

• US 8,058,662 B2
• Filed: 11/09/2005
• Issued: 11/15/2011
• Est. Priority Date: 07/04/2005
• Status: Active Grant

• Current Assignee: Seoul Semiconductor Co., Ltd.
• Original Assignee: Seoul Semiconductor Co., Ltd.
• Inventors: Lee, Chung-Hoon, Kim, Do Hyung
• Primary Examiner(s): Andujar; Leonardo
• Assistant Examiner(s): Klein; Jordan
• Application Number:
  US11/994,813
• Publication Number:
  US 20080217637A1
• Time in Patent Office: 2,197 Days
• Field of Search: 257/79, 257/98, 257/99, 257/100, 438/22, 438/26, 438/29, 438/39, 438/42, 438/E33.055
• US Class Current: 257/98
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45139 Silver (Ag) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/8592 Applying permanent coating, e.g. protective coating
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00011 Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01049 Indium [In]
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/207 Diameter ranges
• CPC Class Codes: H01L 2933/0041 relating to wavelength conversion elements
• CPC Class Codes: H01L 33/505 characterised by the shape, e.g. plate or foil
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

The present invention relates to a light emitting diode and a method of fabricating the same, wherein the distance between a fluorescent substance and a light emitting diode chip is uniformly maintained to enhance luminous efficiency. To this end, there is provided a light emitting diode comprising at least one light emitting diode chip, lead terminals for use in applying electric power to the light emitting diode chip, and a frame that is used for mounting the light emitting diode chip thereon and is formed to have a predetermined height and a shape corresponding to that of the light emitting diode chip.

Claims

1. A light emitting diode, comprising:

at least one light emitting diode chip;

lead terminals to apply electric power to the light emitting diode chip;

a frame having the light emitting diode chip mounted thereon, the frame and the light emitting diode chip having the same shape in plan view; and

a molding portion comprising a fluorescent substance for converting the wavelength of light emitted from the light emitting diode chip, the molding portion being formed on the frame, and an outer side surface of the molding portion being substantially flush with an outer side surface of the frame.

2. The light emitting diode as claimed in claim 1, further comprising a peripheral molding portion encapsulating the light emitting diode chip.

3. The light emitting diode as claimed in claim 2, wherein the molding portion and the frame each comprise a plurality of outer side surfaces contacting the peripheral molding portion, and all corresponding outer side surfaces of the molding portion and the frame are substantially flush with each other.

4. The light emitting diode as claimed in claim 1, wherein the molding portion and the light emitting diode chip have the same shape.

5. The light emitting diode as claimed in claim 1, wherein the frame is formed on one of the lead terminals.

6. The light emitting diode as claimed in claim 5, wherein the frame and the lead terminal are formed integrally with each other.

7. The light emitting diode as claimed in claim 1, further comprising a substrate, the frame being formed on the substrate.

8. The light emitting diode as claimed in claim 7, wherein the frame and the substrate are formed integrally with each other.

9. The light emitting diode as claimed in claim 7, further comprising a housing surrounding the substrate.

10. The light emitting diode as claimed in claim 1, wherein a barrier is formed along the periphery of a top surface of the frame, the barrier protruding from the top surface of the frame.

11. The light emitting diode as claimed in claim 10, wherein the barrier and the frame are formed integrally with each other.

12. The light emitting diode as claimed in claim 1, wherein a groove is formed along the periphery of a top surface of the frame.

13. The light emitting diode as claimed in claim 1, wherein the frame is formed to have a rectangular shape.

14. The light emitting diode as claimed in claim 1, wherein the fluorescent substance is disposed above the frame without extending beyond a perimeter of the frame.

15. The light emitting diode as claimed in claim 1, wherein the fluorescent substance and the molding portion are both disposed above the frame without extending beyond a perimeter of the frame.

16. The light emitting diode as claimed in claim 1, wherein the molding portion is coterminous with the frame.

17. The light emitting diode as claimed in claim 1, wherein the molding portion and the frame comprise the same shape and the same size.

18. A method of fabricating a light emitting diode, comprising:

forming a frame;

mounting a light emitting diode chip on the frame;

applying a fluorescent substance on the frame; and

heating and curing the fluorescent substance,

wherein the frame is formed to have the same shape as the light emitting diode chip in plan view, and

wherein an outer side surface of the fluorescent substance is formed to be substantially flush with an outer side surface of the frame.

19. The method as claimed in claim 18, wherein a barrier is formed along the periphery of a top surface of the frame, the barrier protruding from the top surface of the frame.

20. The method as claimed in claim 18, wherein a groove is formed along the periphery of a top surface of the frame.