Polishing apparatus and method

• US 8,070,560 B2
• Filed: 11/24/2008
• Issued: 12/06/2011
• Est. Priority Date: 11/29/2007
• Status: Active Grant

• Current Assignee: Ebara Corporation
• Original Assignee: Ebara Corporation
• Inventors: Yasuda, Hozumi, Fukushima, Makoto, Togawa, Tetsuji
• Primary Examiner(s): Nguyen, Dung Van
• Application Number:
  US12/292,677
• Publication Number:
  US 20090142996A1
• Time in Patent Office: 1,107 Days
• Field of Search: 451285-289, 451/388, 451/397, 451/398, 451/5
• US Class Current: 451/289
• CPC Class Codes: B24B 37/30 for single side lapping of plane surfaces

Abstract

A polishing apparatus is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing table having a polishing surface, a polishing head having at least one elastic membrane configured to form a plurality of pressure chambers for being supplied with a pressurized fluid, and a controller configured to control supply of the pressurized fluid to the pressure chambers. The controller controls supply of the pressurized fluid so that the pressurized fluid is supplied first to the pressure chamber located at a central portion of the substrate when the substrate is brought into contact with the polishing surface, and then the pressurized fluid is supplied to the pressure chamber located at a radially outer side of the pressure chamber located at the central portion of the substrate.

Claims

1. An apparatus for polishing a substrate, comprising:

a polishing table having a polishing surface;

a polishing head having at least one elastic membrane configured to form a plurality of pressure chambers for being supplied with a pressurized fluid, said elastic membrane being configured to press the substrate against said polishing surface under a fluid pressure when said pressure chambers are supplied with the pressurized fluid; and

a diaphragm configured to cover at least part of said elastic membrane and extend over the two adjacent pressure chambers, said diaphragm being composed of a material having higher rigidity than said elastic membrane;

wherein said diaphragm has an area of not less than 10 mm from a boundary between said two pressure chambers both to an inner circumferential side and to an outer circumferential side of said elastic membrane.

2. The apparatus according to claim 1, wherein said diaphragm is fixed to said elastic membrane.

3. The apparatus according to claim 1, wherein said diaphragm is composed of one of resin comprising polyether ether ketone (PEEK), polyphenylene sulfide (PPS) or polyimide, metal comprising stainless steel or aluminum, and ceramics comprising alumina, zirconia, silicon carbide or silicon nitride.

4. The apparatus according to claim 3, wherein said elastic membrane is composed of ethylene propylene rubber (EPDM), polyurethane rubber, or silicone rubber.

5. The apparatus according to claim 1, wherein said diaphragm is configured to cover a substantially entire surface of said elastic membrane.

6. The apparatus according to claim 1, further comprising a second elastic membrane configured to cover said diaphragm, said second elastic membrane constituting a substrate holding surface configured to contact the substrate and hold the substrate.

7. The apparatus according to claim 6, wherein said second elastic membrane extends over said diaphragm and said elastic membrane configured to form said pressure chambers.