×

LED package methods and systems

  • US 8,080,819 B2
  • Filed: 12/04/2009
  • Issued: 12/20/2011
  • Est. Priority Date: 07/08/2004
  • Status: Active Grant
First Claim
Patent Images

1. A compact light source, comprising:

  • at least one LED die including an LED; and

    a package for said LED die mounted on a substrate, said package including a reflector for reflecting light from said at least one LED die and having a submount, a filler of silicone or injection-molded plastic filler, a plastic encasing element, a lens, and at least one lead for providing external electronic connection from said package, wherein said submount incorporates at least one electronic component for controlling said LED, said at least one electronic component being configured to receive an AC voltage and facilitate control of at least one of said intensity and said apparent intensity of said LED die;

    wherein said submount is encapsulated within said package and located below said LED die and within said reflector; and

    wherein said electronic component of said submount manipulates said AC voltage within said package.

View all claims
  • 2 Assignments
Timeline View
Assignment View
    ×
    ×