High mobility tri-gate devices and methods of fabrication
First Claim
1. A high mobility semiconductor assembly comprising:
- a first substrate having a first reference orientation located at a <
110>
crystal plane location on the first substrate;
a second substrate formed on top of the first substrate, the second substrate having a second reference orientation located at a <
100>
crystal plane location on the second substrate,wherein the first reference orientation is aligned with the second reference orientation;
a non-planar device having a top surface and laterally opposite sidewalls formed in the second substrate, wherein each of the top surface and the laterally opposite sidewalls has a <
100>
crystal plane;
a gate dielectric formed on the top au ace and on the laterally opposite sidewalls;
a gate electrode formed adjacent the gate dielectric formed on the top of surface and on the laterally opposite sidewalls; and
a pair of source/drain regions formed on opposite sides of the gate electrode.
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Abstract
A high mobility semiconductor assembly. In one exemplary aspect, the high mobility semiconductor assembly includes a first substrate having a first reference orientation located at a <110> crystal plane location on the first substrate and a second substrate formed on top of the first substrate. The second substrate has a second reference orientation located at a <100> crystal plane location on the second substrate, wherein the first reference orientation is aligned with the second reference orientation. In another exemplary aspect, the second substrate has a second reference orientation located at a <110> crystal plane location on the second substrate, wherein the second substrate is formed over the first substrate with the second reference orientation being offset to the first reference orientation by about 45 degrees.
529 Citations
8 Claims
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1. A high mobility semiconductor assembly comprising:
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a first substrate having a first reference orientation located at a <
110>
crystal plane location on the first substrate;a second substrate formed on top of the first substrate, the second substrate having a second reference orientation located at a <
100>
crystal plane location on the second substrate,wherein the first reference orientation is aligned with the second reference orientation; a non-planar device having a top surface and laterally opposite sidewalls formed in the second substrate, wherein each of the top surface and the laterally opposite sidewalls has a <
100>
crystal plane;a gate dielectric formed on the top au ace and on the laterally opposite sidewalls; a gate electrode formed adjacent the gate dielectric formed on the top of surface and on the laterally opposite sidewalls; and a pair of source/drain regions formed on opposite sides of the gate electrode. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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Specification