Lightweight audio system for automotive applications and method

• US 8,087,165 B2
• Filed: 02/26/2010
• Issued: 01/03/2012
• Est. Priority Date: 08/18/2006
• Status: Active Grant

• Current Assignee: Aptiv Technologies AG (Aptiv PLC)
• Original Assignee: Delphi Technologies, Inc. (Aptiv PLC)
• Inventors: Snider, Chris R., Gupta, Vineet, Huntzinger, Joseph K., Coady, Michael G., Meyer, Kevin Earl, Garner, Timothy D., Bell, Jeffrey T., Vadas, Robert L., Oberlin, Allen E., Stapert, Curtis Allen
• Primary Examiner(s): Banks, Derris
• Assistant Examiner(s): PARVEZ, AZM A
• Application Number:
  US12/713,423
• Publication Number:
  US 20100186217A1
• Time in Patent Office: 676 Days
• Field of Search: 298/54, 295/921, 361/818, 361/730, 174/357, 174/5.R, 174/50.54, 174/520, 174/521, 381/86
• US Class Current: 29/854
• CPC Class Codes: B29C 59/16 by wave energy or particle radiation , e.g. infrared heating B29C59/007 takes precedence
• CPC Class Codes: B60R 11/02 for radio sets, television sets, telephones, or the like; Arrangement of controls thereof
• CPC Class Codes: G06F 11/00 Error detection; Error correction; Monitoring error detection, correction or monitoring in information storage based on relative movement between record carrier and transducer G11B20/18; monitoring, i.e. supervising the progress of recording or reproducing G11B27/36; in static stores G11C29/00
• CPC Class Codes: H04B 1/082 to be used in vehicles H04B1/086 takes precedence; holding or mounting accessories B60R11/02
• CPC Class Codes: H04R 1/02 Casings; Cabinets ; Supports therefor; Mountings therein H04R1/28 takes precedence ; attachments for microphones H04R1/08; mounting of transducers in earpieces H04R1/1075
• CPC Class Codes: H05K 1/0215 Grounding of printed circuits by connection to external grounding means
• CPC Class Codes: H05K 1/141 One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters H05K1/142 and H05K1/147 take precedence
• CPC Class Codes: H05K 13/00 Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
• CPC Class Codes: H05K 2201/09081 Tongue or tail integrated in planar structure, e.g. obtained by cutting from the planar structure
• CPC Class Codes: H05K 2201/10386 Clip leads; Terminals gripping the edge of a substrate
• CPC Class Codes: H05K 2201/10446 Mounted on an edge soldering edge mounted components H05K3/3405; edge terminals H05K2201/1034
• CPC Class Codes: H05K 5/0217 Mechanical details of casings covers, lids, hoods or members for covering apertures H05K5/03
• CPC Class Codes: H05K 5/0221 Locks; Latches
• CPC Class Codes: H05K 5/0226 Hinges
• CPC Class Codes: H05K 7/20409 Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
• CPC Class Codes: H05K 7/20418 the radiating structures being additional and fastened onto the housing
• CPC Class Codes: H05K 7/20436 Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
• CPC Class Codes: H05K 9/0007 Casings standardised racks H05K9/0062
• CPC Class Codes: H05K 9/0047 being rigid plastic containers having conductive particles, fibres or mesh embedded therein
• CPC Class Codes: H05K 9/0079 Electrostatic discharge protection, e.g. ESD treated surface for rapid dissipation of charges
• CPC Class Codes: H05K 9/0081 : Electromagnetic shielding materials, e.g. EMI, RFI shielding H05K9/0003 takes precedence
• CPC Class Codes: Y10T 29/49002 : Electrical device making
• CPC Class Codes: Y10T 29/49124 : On flat or curved insulated base, e.g., printed circuit, etc.
• CPC Class Codes: Y10T 29/49126 : Assembling bases
• CPC Class Codes: Y10T 29/49128 : Assembling formed circuit to base
• CPC Class Codes: Y10T 29/4913 : Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49169 : Assembling electrical component directly to terminal or elongated conductor
• CPC Class Codes: Y10T 29/49172 : by molding of insulating material
• CPC Class Codes: Y10T 29/4957 : Sound device making
• CPC Class Codes: Y10T 29/49826 : Assembling or joining
• CPC Class Codes: Y10T 29/49861 : Sizing mating parts during final positional association
• CPC Class Codes: Y10T 29/5313 : Means to assemble electrical device
• CPC Class Codes: Y10T 403/70 : Interfitted members
• CPC Class Codes: Y10T 428/24289 : Embedded or interlocked
• CPC Class Codes: Y10T 74/20396 : Hand operated

Abstract

A lightweight radio/CD player for vehicular application is virtually “fastenerless” and includes a case and frontal interface formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides EMC, RFI, BCI and ESD shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. The PCB architecture is bifurcated into a first board carrying common circuit components in a surface mount configuration suitable for high volume production, and a second board carrying application specific circuit components in a wave soldered stick mount configuration. The major components and subassemblies are self-fixturing during the final assembly process, eliminating the need for dedicated tools, fixtures and assembly equipment. The major components and subassemblies self-interconnect by integral guide and connection features effecting “slide lock” and “snap lock” self-interconnection. The radio architecture includes improved push buttons employing 4-bar living hinge linkage and front loaded decorative trim buttons.

Claims

1. A method of fabricating an automotive audio system housing assembly including a box-like case having wall portions and a front closure member enclosing at least one audio component, said method comprising the steps of:

forming a sheet of composite material comprising at least one layer of relatively rigid polymer material and at least one layer of electrically conductive material capable of shielding said audio component from electrical anomalies such as RFI (radio frequency interference), EMI (electromagnetic interference), BCI (bulk current injection), and ESD (electrostatic discharge);

shaping a planer case preform comprising a plurality of wall panels interconnected along adjacent edges thereof by continuous living hinges formed at least by one of said constituent materials;

providing a plurality of cooperating engagement features affixed to said preform adjacent said wall panel edges;

affixing said audio component to one of said preform wall panels;

folding said preform panels at respective right angles to form said case; and

affixing respective pairs of said engagement features to retain said case in a three-dimensional configuration.

2. The method of claim 1, wherein said living hinges comprise composite layers of said electrically conductive material and said polymer material.

3. The method of claim 2, further comprising the step of locally thinning/upsetting said layer of polymer material to define said living hinge.

4. The method of claim 1, wherein said engagement features are integrally formed as part of said planer case preform.

5. The method of claim 1, further comprising the step of affixing a heat sink to one of said preform wall panels.

6. The method of claim 1, further comprising the step of forming a discrete front plate closure member.

7. The method of claim 6, further comprising the step of interconnecting the front closure member to the case through an interconnecting audio component.

8. The method of claim 1, further comprising the step of interconnecting at least two preform wall panels through an interconnecting audio component.

9. The method of claim 1, further comprising the step of forming ventilation and connector access openings within selected preform wall panels.

10. The method of claim 1, further comprising the step of die cutting said planer case preform from said composite sheet of polymer material and electrically conductive material.

11. The method of claim 1, wherein said step of forming said sheet comprises the steps of:

overlaying continuous sheets of said polymer material and electrically conductive material;

heating said overlayment of sheets to a temperature sufficient to affect bonding therebetween;

roll-firming said overlayment of sheets to form a single composite structure;

curing said single composite structure;

die/punch cutting said composite structure to form said case preform; and

scribing/forming profiles of said living hinge.

12. The method of claim 1, wherein said step of forming said composite sheet comprises the step of fluidly extruding said polymer material around a continuous sheet of electrically conductive material.

13. The method of claim 1, wherein said step of forming said sheet comprises injection molding said polymer material around a sheet of electrically conductive material.

14. The method of claim 1, wherein said electrically conductive material comprises wire screen.

15. A method of fabricating an electrical system housing assembly including a box-like case having wall portions enclosing at least one electrical component, said method comprising the steps of:

forming a sheet of material comprising at least one layer of electrically conductive material capable of shielding said electrical component from electrical anomalies such as RFI (radio frequency interference), EMI (electromagnetic interference), BCI (bulk current injection), and ESD (electrostatic discharge);

shaping a case preform from said sheet material, said preform comprising a plurality of wall panels interconnected along adjacent edges thereof by living hinges, wherein exposed surfaces of said wall panels are disposed in a substantially co-planar orientation;

providing a plurality of cooperating engagement features affixed to said preform adjacent said wall panel edges;

mounting said electrical component to an exposed surface of at least one of said preform wall panels;

folding said preform panels at respective right angles to form said case; and

affixing respective pairs of said engagement features to retain said case in a three-dimensional configuration.

16. The method of claim 15, wherein said living hinges comprise composite layers of said electrically conductive material and relatively rigid polymer material.

17. The method of claim 16, further comprising the step of locally thinning/upsetting said layer of polymer material to define said living hinge.

18. The method of claim 15, wherein said engagement features are integrally formed as part of said case preform.

19. The method of claim 15, further comprising the step of affixing a heat sink to one of said preform wall panels.

20. The method of claim 15, further comprising the step of forming a discrete front plate closure member comprising at least one layer of electrically conductive material capable of shielding said electrical component from electrical anomalies such as RFI (radio frequency interference), EMI (electromagnetic interference), BCI (bulk current injection), and ESD (electrostatic discharge).

21. The method of claim 20, further comprising the step of interconnecting the front closure member to the case through an interconnecting electrical component.

22. The method of claim 15, further comprising the step of interconnecting at least two preform wall panels through an interconnecting electrical component.

23. The method of claim 15, further comprising the step of forming ventilation and connector access openings within selected preform wall panels.

24. The method of claim 15, further comprising the step of die cutting said case preform from a composite sheet of polymer material and said electrically conductive material.

25. The method of claim 16, wherein said step of forming said sheet of material comprises the steps of:

overlaying continuous sheets of polymer material and said electrically conductive material;

heating said overlayment of sheets to a temperature sufficient to affect bonding therebetween;

roll-forming said overlayment of sheets to form a single composite structure;

curing said single composite structure;

die/punch cutting said composite structure to form said case preform; and

scribing/forming profiles of said living hinge.

26. The method of claim 15, wherein said step of forming said composite sheet comprises the step of fluidly extruding polymer material around a continuous sheet of electrically conductive material.

27. The method of claim 15, wherein said step of forming said sheet comprises injection molding polymer material around a sheet of electrically conductive material.

28. The method of claim 15, wherein said electrically conductive material comprises wire screen.