Micro movable device

• US 8,089,131 B2
• Filed: 07/14/2009
• Issued: 01/03/2012
• Est. Priority Date: 08/13/2008
• Status: Expired due to Fees

• Current Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: Yamazaki, Hiroaki
• Primary Examiner(s): Luu, Chuong A.
• Application Number:
  US12/502,500
• Publication Number:
  US 20100038732A1
• Time in Patent Office: 903 Days
• Field of Search: 257/415, 257/678, 257/418, 257/419, 257/773, 216/2, 216/72, 216/79
• US Class Current: 257/415
• CPC Class Codes: B81B 2201/016 having a bridge fixed on two ends and connected to one or more dimples
• CPC Class Codes: B81B 2201/0264 Pressure sensors
• CPC Class Codes: B81B 2207/098 Arrangements not provided for in groups B81B2207/092 - B81B2207/097
• CPC Class Codes: B81B 3/0086 Electrical characteristics, e.g. reducing driving voltage, improving resistance to peak voltage
• CPC Class Codes: B81B 7/007 Interconnections between the MEMS and external electrical signals
• CPC Class Codes: H01H 2059/0054 Rocking contacts or actuating members
• CPC Class Codes: H01H 59/0009 making use of micromechanics

Abstract

A micro movable device includes a protection cap for protecting a movable unit arranged above a semiconductor substrate and the movable unit, signal line for transmitting a high-frequency signal formed above the semiconductor substrate, and insulation layer that has projection formed to project upward from the semiconductor substrate and coated surfaces with the signal line.

Claims

1. A micro movable device comprising:

a movable unit formed above a semiconductor substrate;

a protection cap that is arranged above the semiconductor substrate and the movable unit and protects the movable unit;

a signal line that is formed above the semiconductor substrate and transmit a high-frequency signal, a part of the signal line being provided below the movable unit; and

an insulation layer that has a projection formed to project upward from the semiconductor substrate, the projection being provided at outside of the movable unit in a plain view and being formed at an outside of the protection cap and the insulation layer having coated upper and side surfaces with the signal line, the coated surfaces being provided in a higher position than a bottom of the signal line below the movable unit, wherein

a position of the signal line on the upper surface of the projection in a height direction is higher than a position of the signal line under the movable unit in a height direction.

2. The micro movable device according to claim 1, wherein a position of the movable unit in a height direction is substantially equal to position of the signal line in a height direction arranged on the insulation layer.

3. The micro movable device according to claim 1, wherein the projection is formed at only outside of the protection cap.

4. The micro movable device according to claim 1, further comprising a pad formed on the signal line coating the projection.

5. The micro movable device according to claim 1, wherein the projection is formed at inside and the outside of the protection cap.

6. The micro movable device according to claim 1, wherein a drive signal for driving the movable unit is input to the signal line.

7. The micro movable device according to claim 1, further comprising a ground line that is arranged above the semiconductor substrate and is connected to the movable unit.

8. The micro movable device according to claim 1, further comprising a cavity formed beneath a portion of the signal line arranged at the inside of the protection cap.

9. A micro movable device comprising:

a movable unit formed above a semiconductor substrate;

a first insulation layer formed above the semiconductor substrate below the movable unit with a gap between the movable unit and the first insulation layer;

a protection cap that is arranged above the first insulation layer and the movable unit and protects the movable unit;

a first signal line that is arranged at inside of the protection cap and is formed on the first insulation layer with a gap between the movable unit and the first signal line and a part of the first signal line being provided below the movable unit and the first insulation layer;

a second insulation layer that are arranged at outside of the protection cap and has a projection formed to project upward from the first insulation layer; and

a second signal line electrically connected to the first signal line, and coating upper and side surfaces of the projection of the second insulation layer, the second signal line being provided in a higher position than the part of the first signal line.

10. The micro movable device according to claim 9, wherein a position of the movable unit in a height direction is substantially equal to a position of the second signal line in a height direction arranged on the insulation layer.

11. The micro movable device according to claim 9, wherein the movable unit and the second signal line are configured by a substantially same metal film.

12. The micro movable device according to claim 9, further comprising a pad formed on the second signal line.

13. The micro movable device according to claim 9, wherein a drive signal for driving the movable unit is input to the first signal line and the second signal line.

14. The micro movable device according to claim 9, further comprising a ground line that is arranged above the semiconductor substrate and is connected to the movable unit.

15. The micro movable device according to claim 9, further comprising a cavity formed beneath a portion of the first signal line.

16. A micro movable device comprising:

a movable unit formed above a semiconductor substrate;

a first insulation layer formed above the semiconductor substrate below the movable unit with a gap between the movable unit and the insulation layer;

a protection cap that is arranged above the first insulation layer and the movable unit and protects the movable unit;

a first signal line that is arranged at inside of the protection cap and is formed on the first insulation layer with a gap between the movable unit and the first signal line;

a second insulation layer that is arranged at outside of the protection cap and has a projection formed to project upward from the first insulation layer;

a second signal line electrically connected to the first signal line, and coating a surface of the projection of the second insulation layer;

a first ground line that is arranged at inside of the protection cap and is formed on the first insulation layer;

a third insulation layer that is arranged at outside of the protection cap and has a projection formed to project upward from the first insulation layer; and

a second ground line electrically connected to the first ground line and coating an entire exposed surface of the third insulation layer.

17. The micro movable device according to claim 16, wherein a position of the movable unit in a height direction, a position of the second signal line in a height direction arranged on the second insulation layer, and a position of the second ground line in a height direction arranged on the third insulation layer are substantially equal.

18. The micro movable device according to claim 16, wherein the movable unit, the second signal line, and the second ground line are configured by a substantially same metal film.

19. The micro movable device according to claim 16, further comprising a first pad formed on the second signal line and a second pad formed on the second ground line.

20. The micro movable device according to claim 16, further comprising a first cavity formed beneath the first signal line and a second cavity formed beneath the first ground line.