Multiple chip module and package stacking method for storage devices

  • US 8,093,103 B2
  • Filed: 10/18/2010
  • Issued: 01/10/2012
  • Est. Priority Date: 12/29/2005
  • Status: Active Grant
First Claim
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1. A method for stacking a plurality of modules, said plurality of modules including a first memory module and a second memory module;

  • said first memory module having a first surface and a second surface;

    said second memory module having a third surface and a fourth surface;

    said method comprising;

    providing a first set of connections on said first memory module by;

    forming a first active ball on said first surface,forming a first set of passive balls on said first surface, said first set of passive balls including a first passive ball and a second passive ball, andforming a first set of passive pads on said second surface, said first set of passive pads including a first passive pad and a second passive pad;

    providing a second set of connections on said second memory module by;

    forming a second active ball on said third surface, andforming a third passive ball on said third surface, a third passive pad on said fourth surface;

    connecting said first passive ball to said first passive pad, connecting said second passive ball to said second passive pad, and connecting said third passive ball to said third passive pad;

    coupling said first passive pad to said second active ball by stacking said first memory module to said second memory module;

    forming a first serial chain route that includes at least one serial chain connection, said serial chain connection including;

    a serial chain circuit, a serial chain input, and serial chain output;

    coupling said serial chain input with said serial chain output through said serial chain circuit;

    forming a second serial chain route;

    forming a control circuit for enabling a routing path that connects said first serial chain route with said second serial chain route within an end module; and

    said control circuit is disposed to enable said routing path in response to a control input signal received from another module from the plurality of modules when said end module is coupled to said another module.

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