Base for power module

• US 8,102,652 B2
• Filed: 03/08/2007
• Issued: 01/24/2012
• Est. Priority Date: 03/13/2006
• Status: Expired due to Fees

• Current Assignee: Kabushiki Kaisha Toyota Jidoshokki, Showa Denko KK
• Original Assignee: Kabushiki Kaisha Toyota Jidoshokki, Showa Denko KK
• Inventors: Toh, Keiji, Mori, Shogo, Wakabayashi, Nobuhiro, Nakagawa, Shintaro, Yamauchi, Shinobu, Obara, Hideyasu
• Primary Examiner(s): Pape, Zachary M
• Application Number:
  US12/282,729
• Publication Number:
  US 20100002397A1
• Time in Patent Office: 1,783 Days
• Field of Search: 361/699, 257/714, 257/716, 257/717, 257/706, 257/E23.098, 174/15.1, 174/252, 165 804- 805, 165/104.33
• US Class Current: 361/699
• CPC Class Codes: H01L 23/3677 Wire-like or pin-like cooling fins or heat sinks
• CPC Class Codes: H01L 23/3735 Laminates or multilayers, e.g. direct bond copper ceramic substrates
• CPC Class Codes: H01L 23/4006 with bolts or screws
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 25/072 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A power module base includes a heat radiation substrate formed of a high-thermal-conduction material, an insulating substrate joined to an upper surface of the heat radiation substrate, a wiring layer provided on an upper surface of the insulating substrate, and a heat radiation fin joined to a lower surface of the heat radiation substrate. A component attachment plate thicker than the heat radiation substrate and including a through hole for accommodating the insulating substrate is joined to the upper surface of the heat radiation substrate such that the insulating substrate is located within the through hole. This power module base can maintain the upper surface of the component attachment plate flat, and various components required for a power module, such as a casing, can be attached onto the component attachment plate.

Claims

1. A power module base comprising:

a heat radiation substrate formed of a high-thermal-conduction material, the heat radiation substrate having a first surface and a second surface opposite to the first surface;

an insulating substrate provided over the first surface of the heat radiation substrate;

a stress relaxation member interposed between the insulating substrate and the heat radiation substrate;

a wiring layer provided on a surface of the insulating substrate opposite a side where the insulating substrate is provided over the heat radiation substrate;

a first component attachment plate joined to the first surface of the heat radiation substrate, the first component attachment plate having a through hole such that the insulating substrate is located within the through hole;

a heat radiation fin brazed to the second surface of the heat radiation substrate;

a cooling jacket fixed to the second surface of the heat radiation substrate such that the cooling jacket covers the heat radiation fin, the cooling jacket comprising a circumferential wall and a bottom wall that closes a lower end opening of the circumferential wall; and

a second component attachment plate brazed to a surface of the bottom wall of the cooling jacket,

wherein the first component attachment plate is thicker than the heat radiation substrate and brazed to the heat radiation substrate, the stress relaxation member is formed of a high-thermal-conduction material, the stress relaxation member is brazed to the insulating substrate and to the heat radiation substrate, the stress relaxation member comprises a plate-like body having a plurality of through holes formed therein, the heat radiation fin has a corrugate shape including wave crest portions, wave trough portions, and connection portions connecting the wave crest portions and the wave trough portions, the wave crest portions are brazed to the heat radiation substrate, and the wave trough portions are brazed to the cooling jacket.

2. A power module base according to claim 1, wherein the cooling jacket is configured such that a cooling liquid flows within the cooling jacket.

3. A power module base claim 1, wherein the second component attachment plate is joined to an outer surface of the bottom wall.

4. A power module base according to claim 3, wherein the first and second component attachment plates are connected together.

5. A power module base according to claim 1, wherein the insulating substrate is formed of a ceramic, and the ceramic is formed of aluminum nitride, aluminum oxide, or silicon nitride.

6. A power module base according to claim 1, wherein the wiring layer is formed of aluminum or copper.

7. A power module base according to claim 1, wherein the stress relaxation member is formed of a material having a linear expansion coefficient between a linear expansion coefficient of the insulating substrate and a linear expansion coefficient of the heat radiation substrate.

8. A power module comprising:

the power module base according to claim 1; and

a power device mounted on the wiring layer of the insulating substrate of the power module base.

9. A power module according to claim 8, further comprising a casing attached to the first component attachment plate and covering the power device and the insulating substrate of the power module base.

10. A power module base comprising:

a heat radiation substrate formed of a high-thermal-conduction material, the heat radiation substrate having a first surface and a second surface opposite to the first surface;

an insulating substrate provided over the first surface of the heat radiation substrate;

a wiring layer provided on a surface of the insulating substrate opposite a side where the insulating substrate is provided over the heat radiation substrate;

a heat transfer layer which is formed of a high-thermal-conduction material and is provided on a surface of the insulating substrate opposite the side where the wiring layer is provided;

a stress relaxation member interposed between the heat transfer layer and the heat radiation substrate,

a first component attachment plate joined to the first surface of the heat radiation substrate, the first component attachment plate having a through hole such that the insulating substrate is located within the through hole;

a heat radiation fin brazed to the second surface of the heat radiation substrate;

a cooling jacket fixed to the second surface of the heat radiation substrate such that the cooling jacket covers the heat radiation fin, the cooling jacket comprising a circumferential wall and a bottom wall that closes a lower end opening of the circumferential wall; and

a second component attachment plate brazed to a surface of the bottom wall of the cooling jacket,

wherein the first component attachment plate is thicker than the heat radiation substrate and brazed to the heat radiation substrate, the stress relaxation member is formed of a high-thermal-conduction material, the stress relaxation member is brazed to the heat transfer layer and to the heat radiation substrate, the stress relaxation member comprises a plate-like body having a plurality of through holes formed therein, the heat radiation fin has a corrugate shape including wave crest portions, wave trough portions, and connection portions connecting the wave crest portions and the wave trough portions, the wave crest portions are brazed to the heat radiation substrate, and the wave trough portions are brazed to the cooling jacket.

11. A power module base according to claim 10, wherein the surface of the insulating substrate opposite the side where the wiring layer is provided is joined directly to the heat transfer layer.