LED retrofit for miniature bulbs

• US 8,106,569 B2
• Filed: 05/12/2010
• Issued: 01/31/2012
• Est. Priority Date: 05/12/2009
• Status: Active Grant

• Current Assignee: Elisa Sartori
• Original Assignee: RemPhos Technologies LLC
• Inventors: Gershaw, David
• Primary Examiner(s): Patel, Ashok
• Application Number:
  US12/778,264
• Publication Number:
  US 20100314986A1
• Time in Patent Office: 629 Days
• Field of Search: None
• US Class Current: 313/46
• CPC Class Codes: A61B 1/0653 with wavelength conversion
• CPC Class Codes: A61B 1/0669 at proximal end of an endoscope
• CPC Class Codes: A61B 1/0684 using light emitting diodes [LED]
• CPC Class Codes: A61B 1/128 provided with means for regulating temperature
• CPC Class Codes: A61B 1/227 for ears, i.e. otoscopes
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: F21K 9/69 Details of refractors forming part of the light source
• CPC Class Codes: F21V 29/70 characterised by passive heat-dissipating elements, e.g. heat-sinks
• CPC Class Codes: F21W 2131/20 Lighting for medical use
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48464 the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H05K 1/0203 Cooling of mounted components H05K1/0272 takes precedence
• CPC Class Codes: Y02B 20/30 Semiconductor lamps, e.g. solid state lamps [SSL] light emitting diodes [LED] or organic LED [OLED]

Abstract

Methods and devices are provided for an improved light source. In one exemplary embodiment a light source includes a heat sink, a LED die, and a phosphor dome. A conductive material can be disposed in the heat sink, the LED die can be mounted to a top portion of the conductive material such that the LED die is in electrical contact with the heat sink, and the phosphor dome can be coupled to a top face of the heat sink. In another embodiment, a light source includes a heat sink, a sleeve, a LED package, and an optic. A conductive material can be disposed in the heat sink, the sleeve can be disposed around at least a portion of the heat sink and the conductive material, the LED package can be mounted above the conductive material, and the optic can be located above the LED package and coupled to the sleeve. The light sources disclosed herein can be used to replace existing miniature bulbs in a number of different devices, including medical devices such as otoscopes.

Claims

1. A light source, comprising:

a heat sink having a conductive material disposed therein, the conductive material including an electrically conductive rod disposed in at least a portion of the heat sink;

a LED die mounted to a top portion of the conductive material and in electrical contact with the heat sink; and

a phosphor dome coupled to a top face of the heat sink.

2. The light source of claim 1, wherein a life expectancy of the light source is approximately 50,000 hours.

3. The light source of claim 1, further comprising an outer tube disposed around the electrically conductive rod.

4. The light source of claim 1, wherein a color rending index is approximately greater than or equal to about 85.

5. The light source of claim 1, wherein a color temperature is approximately in the range of about 2700 K to about 3200 K.

6. The light source of claim 1, wherein the heat sink further comprises one or more radiating fins.

7. The light source of claim 1, further comprising a wire bond configured to create electrical contact between the LED die and the heat sink.

8. The light source of claim 1, further comprising silicone disposed on at least a portion of at least one of the heat sink, the LED die, and the phosphor dome.

9. A light source, comprising:

a heat sink having a conductive material disposed therein;

a sleeve disposed around at least a portion of the heat sink and the conductive material;

a LED package mounted above the conductive material; and

an optic located above the LED package and coupled to the sleeve.

10. The light source of claim 9, wherein the heat sink further comprises a polymer.

11. The light source of claim 9, wherein the conductive material further comprises an electrically conductive rod disposed in at least a portion of the heat sink.

12. The light source of claim 11, further comprising an outer tube disposed around the electrically conductive rod.

13. Inc light source of claim 9, further comprising a spacer disposed between the LED package and the conductive material.

14. The light source of claim 9, wherein the LED package comprises a blue chip, an on-chip phosphor conversion layer, and a ceramic substrate.

15. The light source of claim 9, wherein a color rending index is approximately greater than or equal to about 85.

16. The light source of claim 9, wherein a color temperature is approximately in the range of about 2700 K to about 3200 K.

17. The light source of claim 9, wherein the heat sink further comprises one or more radiating fins.

18. The light source of claim 9, further comprising an optically clear substance located in a space surrounding the LED package.

19. The light source of claim 9, wherein a life expectancy of the light source is approximately 50,000 hours.