Liquid crystal display

• US 8,111,368 B2
• Filed: 02/28/2006
• Issued: 02/07/2012
• Est. Priority Date: 02/28/2006
• Status: Active Grant

• Current Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Original Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Inventors: Liu, Qin, Arthur, Alan R.
• Primary Examiner(s): Robinson, Mark
• Assistant Examiner(s): EL SHAMMAA, MARY A
• Application Number:
  US11/364,760
• Publication Number:
  US 20070200996A1
• Time in Patent Office: 2,170 Days
• Field of Search: 349/155, 349/156
• US Class Current: 349/153
• CPC Class Codes: G02F 1/1333 Constructional arrangements; Manufacturing methodsG02F1/135, G02F1/136 take precedence
• CPC Class Codes: G02F 1/133707 Structures for producing distorted electric fields, e.g. bumps, protrusions, recesses, slits in pixel electrodes
• CPC Class Codes: G02F 1/13378 by treatment of the surface, e.g. embossing, rubbing or light irradiation G02F1/133711, G02F1/133734, G02F1/133753 take precedence
• CPC Class Codes: G02F 1/13394 spacers regularly patterned on the cell subtrate, e.g. walls, pillars G02F1/133377 takes precedence
• CPC Class Codes: G02F 1/1391 Bistable or multi-stable liquid crystal cells G02F1/141 takes precedence

Abstract

Exemplary methods and apparatus are provided herein related to display systems. According to one exemplary embodiment, a method of forming a display is discussed that includes providing an embossable material and embossing the embossable material to form a plurality of features including at least one geometric adhesive portion.

Claims

1. A liquid crystal device, comprising:

a first substrate;

a second substrate spaced apart from said first substrate;

liquid crystal filling at least a portion of a space between said first and second substrates; and

a number of geometric adhesive portions bonding said first and second substrate,

in which said geometric adhesive portions comprise a number of elongated members, and

in which said elongated members extend from said first substrate to said second substrate.

2. The device of claim 1, wherein said geometric adhesive portions are formed in an embossable material.

3. The device of claim 2, further comprising posts for post-aligned bi-stable devices and spacers, said posts and spacers being formed in said embossable material.

4. The device of claim 1, wherein said first and second substrates are substantially transparent.

5. The device of claim 1, wherein said first and second substrates are flexible substrates.

6. The device of claim 1, wherein said geometric adhesive portions include a plurality of elongated members, said elongated members having a width of less than about 1 micron and a pitch of less than about 3 microns.

7. The device of claim 1, wherein said geometric adhesive portions are used to bond components of an image forming layer.

8. The device of claim 1, wherein said geometric adhesive portions are used to bond an image processing layer to other parts of said device.

9. The device of claim 1, wherein said geometric adhesive portions comprise cured UV curable material.

10. A display, comprising:

a display panel including a first substrate, a second substrate spaced apart from said first substrate, and a number of geometric adhesive portions bonding said first and second substrate,

in which said first substrate is directly bonded to said second substrate by said geometric adhesive portions.

11. The display of claim 10, wherein said display panel comprises a liquid crystal panel.

12. The display of claim 10, wherein said display panel comprises a flexible display panel.

13. The display of claim 10, further comprising a light source coupled to said display panel.

14. A display system comprising:

a display having a display panel including a first substrate, a second substrate spaced apart from said first substrate, and a number of geometric adhesive portions bonding said first substrate and said second substrate; and

an image processing unit coupled to said display panel,

in which said geometric adhesive portions bond said first substrate and said second substrate using only van der Waal force or capillary forces.