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Configuration of multiple LED module

  • US 8,113,688 B2
  • Filed: 01/04/2011
  • Issued: 02/14/2012
  • Est. Priority Date: 10/16/2000
  • Status: Expired due to Term
First Claim
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1. An LED module, comprising:

  • a carrier having a first main area, a second main area, and at least one semiconductor layer comprising a semiconductor material, said first main area having a planar configuration;

    a plurality of conductive regions formed on said first main area of said carrier;

    a plurality of LED semiconductor bodies applied on said plurality of conductive regions;

    a frame-like structure being formed on said first main area and enclosing the conductive regions; and

    chip connection regions formed on said conductive regions, said LED semiconductor bodies being disposed on said chip connection regions,wherein each of said chip connection regions is formed as a stack of thin metal layers.

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