Configuration of multiple LED module
First Claim
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1. An LED module, comprising:
- a carrier having a first main area, a second main area, and at least one semiconductor layer comprising a semiconductor material, said first main area having a planar configuration;
a plurality of conductive regions formed on said first main area of said carrier;
a plurality of LED semiconductor bodies applied on said plurality of conductive regions;
a frame-like structure being formed on said first main area and enclosing the conductive regions; and
chip connection regions formed on said conductive regions, said LED semiconductor bodies being disposed on said chip connection regions,wherein each of said chip connection regions is formed as a stack of thin metal layers.
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Abstract
A configuration of multiple LED modules having a plurality of LED modules that each contain a carrier that has a first main area, a second main area and at least one semiconductor layer. The first main area has a planar configuration. The LED modules also include a plurality of LED semiconductor bodies that applied on the first main area of the carrier. In addition, the multiple LED modules include a common heat sink, where the carrier of the LED modules in each case are connected to the common heat sink on the second main area.
28 Citations
40 Claims
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1. An LED module, comprising:
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a carrier having a first main area, a second main area, and at least one semiconductor layer comprising a semiconductor material, said first main area having a planar configuration; a plurality of conductive regions formed on said first main area of said carrier; a plurality of LED semiconductor bodies applied on said plurality of conductive regions; a frame-like structure being formed on said first main area and enclosing the conductive regions; and chip connection regions formed on said conductive regions, said LED semiconductor bodies being disposed on said chip connection regions, wherein each of said chip connection regions is formed as a stack of thin metal layers. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28)
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29. An LED module, comprising:
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a carrier having a first main area, a second main area, and at least one semiconductor layer comprising a semiconductor material, said first main area having a planar configuration; a plurality of conductive regions formed on said first main area of said carrier; a plurality of LED semiconductor bodies applied on said plurality of conductive regions; a frame-like structure being formed on said first main area and enclosing the conductive regions; a heat sink connected to said carrier on said second main area; and a soldering compound connecting said heat sink to said semiconductor layer. - View Dependent Claims (30, 31, 32, 33, 34)
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35. An LED module, comprising:
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a carrier having a first main area, a second main area, and at least one semiconductor layer comprising a semiconductor material, said first main area having a planar configuration; a plurality of conductive regions formed on said first main area of said carrier; a plurality of LED semiconductor bodies applied on said plurality of conductive regions; a frame-like structure being formed on said first main area and enclosing the conductive regions; a heat sink connected to said carrier on said second main area; and a thermally conductive adhesive connecting said heat sink to said semiconductor layer. - View Dependent Claims (36, 37, 38, 39, 40)
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Specification