Arrangement for dissipating thermal energy generated by a light emitting diode
First Claim
1. Arrangement for dissipating thermal energy generated by a light emitting diode (LED), comprising:
- an LED including an LED circuit having a top surface from which radiation is emitted in response to current flow through the LED circuit and an opposite bottom surface mounted to a mounting surface, encapsulating material surrounding the LED circuit, the encapsulating material defining a top portion opposite the top surface of the LED circuit, a bottom portion opposite the bottom surface of the LED circuit and at least one side portion extending between the bottom portion and the top portion, a first electrical lead extending into the encapsulating material and electrically connected to the bottom surface of the LED circuit, and a second electrical lead extending into the encapsulating material and electrically connected to the top surface of the LED, anda thermal energy dissipating medium defining an opening therethrough sized to receive therein the LED such that the thermal energy dissipating medium defining the opening is in physical, thermally conductive contact with an exterior surface of the at least one side portion of the encapsulating material of the LED,wherein the thermal energy dissipating medium is not electrically connected to any of the LED circuit, the mounting surface, the first electrical lead and the second electrical lead,and wherein the thermal energy dissipating medium is formed of a material having a thermal conductivity of greater than or equal to 50 W/mK.
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Accused Products
Abstract
An arrangement for dissipating thermal energy generated by an LED includes an LED and a thermal energy dissipating medium. The LED includes an LED circuit, encapsulating material surrounding the LED circuit, and first and second electrical leads extending into the encapsulating material and electrically connected to the LED circuit. The thermal energy dissipating medium defines an opening therethrough sized to receive therein the LED such that the thermal energy dissipating medium defining the opening is in physical, thermally conductive contact with an exterior surface of at least one side portion of the encapsulating material of the LED. The thermal energy dissipating medium is not electrically connected to any of the LED circuit, the mounting surface, the first electrical lead and the second electrical lead. The thermal energy dissipating medium is formed of a material having a thermal conductivity of greater than or equal to 50 W/mK.
133 Citations
20 Claims
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1. Arrangement for dissipating thermal energy generated by a light emitting diode (LED), comprising:
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an LED including an LED circuit having a top surface from which radiation is emitted in response to current flow through the LED circuit and an opposite bottom surface mounted to a mounting surface, encapsulating material surrounding the LED circuit, the encapsulating material defining a top portion opposite the top surface of the LED circuit, a bottom portion opposite the bottom surface of the LED circuit and at least one side portion extending between the bottom portion and the top portion, a first electrical lead extending into the encapsulating material and electrically connected to the bottom surface of the LED circuit, and a second electrical lead extending into the encapsulating material and electrically connected to the top surface of the LED, and a thermal energy dissipating medium defining an opening therethrough sized to receive therein the LED such that the thermal energy dissipating medium defining the opening is in physical, thermally conductive contact with an exterior surface of the at least one side portion of the encapsulating material of the LED, wherein the thermal energy dissipating medium is not electrically connected to any of the LED circuit, the mounting surface, the first electrical lead and the second electrical lead, and wherein the thermal energy dissipating medium is formed of a material having a thermal conductivity of greater than or equal to 50 W/mK. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification