Configuring of lapping and polishing machines

• US 8,123,593 B2
• Filed: 05/07/2009
• Issued: 02/28/2012
• Est. Priority Date: 05/07/2008
• Status: Active Grant

• Current Assignee: Zygo Corporation (Ametek Incorporated)
• Original Assignee: Zygo Corporation (Ametek Incorporated)
• Inventors: Hoon, Douglas Martin
• Primary Examiner(s): NGUYEN, GEORGE BINH MINH
• Application Number:
  US12/437,238
• Publication Number:
  US 20090280721A1
• Time in Patent Office: 1,027 Days
• Field of Search: 451/5, 451/6, 451/8, 451/57, 451/56, 451/21, 451/259, 451/283, 451/443, 731/04, 731/05, 335/46, 335/51, 335/53, 333/54, 335/010.6
• US Class Current: 451/8
• CPC Class Codes: B24B 49/18 taking regard of the presence of dressing tools
• CPC Class Codes: B24B 53/017 Devices or means for dressing, cleaning or otherwise conditioning lapping tools

Abstract

A lapping or polishing machine includes a material having a first finishing surface to process a surface of a work item, a measuring tool to measure a contour of the first finishing surface, and a conditioning tool having a second finishing surface to process the first finishing surface to reduce a difference between the measured contour and a desired contour of the first finishing surface.

Claims

1. A method of processing a work item, the method comprising:

configuring a first finishing surface of a processing machine using a conditioning tool having a second finishing surface;

measuring a contour of the first finishing surface by measuring a movement of a measurement object in an opening of a section of a measurement stage, the measurement object comprising a puck that follows the contour of the first finishing surface;

using the second finishing surface to process the first finishing surface to reduce a difference between the measured contour and a desired contour for the first finishing surface; and

using the first finishing surface to process a work item to cause the work item to have a surface contour that is equal to or approximates a specified surface contour.

2. The method of claim 1 in which configuring a first finishing surface of a processing machine comprises configuring a first finishing surface of at least one of a lapping machine or a polishing machine.

3. The method of claim 1 in which using a conditioning tool having a second finishing surface comprises using a conditioning tool having a second finishing surface that has a diameter smaller than a diameter of a surface of the work item.

4. The method of claim 3, comprising generating ripples on the first finishing surface as the second finishing surface processes various portions of the first finishing surface, the ripples having a spatial period that is smaller than the diameter of the work item.

5. The method of claim 4, comprising canceling effects of the ripples on the first finishing surface when processing the work item using the first finishing surface.

6. The method of claim 1 in which measuring the contour of the first finishing surface comprises moving a measurement object across the first finishing surface and measuring positions of the measurement object while the measurement object follows the contour of the first finishing surface.

7. The method of claim 6 in which the first finishing surface comprises a surface of a material having grooves that cause discontinuities in the first finishing surface, and the measurement object has a diameter that is larger than a maximum width of the grooves.

8. The method of claim 6 in which measuring positions of the measurement object comprises at least one of (a) using a linear variable displacement transducer to measure the positions of the measurement object, (b) using a capacitive gauge to measure the positions of the measurement object, (c) using an inductive gauge to measure the positions of the measurement object, or (d) using a displacement measuring interferometer to measure positions of a mirror or retro-reflector attached to the measurement object.

9. The method of claim 1, comprising using the first finishing surface to process the work item in parallel to measuring the contour of the first finishing surface and using the second finishing surface to process the first finishing surface.

10. The method of claim 1 in which using the first finishing surface to process a work item comprises using the first finishing surface to process a surface comprising at least one of glass, ceramic, plastic, or metal.

11. The method of claim 1 in which configuring a first finishing surface comprises configuring a first finishing surface of a solid substrate.

12. The method of claim 1 in which configuring a first finishing surface comprises configuring a first finishing surface of a polishing pitch.

13. A method comprising:

moving a measurement object across a finishing surface of a material of a processing machine for processing surface contours of work items, the material having grooves that cause discontinuities in the finishing surface, the measurement object having a dimension that is larger than a maximum width of the grooves, the measurement object moving in an opening of a section of a measurement stage and comprising a puck that follows the contour of the finishing surface;

measuring positions of the measurement object; and

determining, using a computer, a contour of the finishing surface based on the measurements of the positions of the measurement object.

14. The method of claim 13, further comprising comparing the determined contour with a desired contour for the finishing surface, and using a conditioning tool to process the finishing surface to reduce a difference between the determined contour and the desired contour for the finishing surface.

15. The method of claim 14, further comprising using the finishing surface to process a work item to cause the work item to have a specified surface contour.

16. The method of claim 13 in which measuring positions of the measurement object comprises at least one of (a) using a linear variable displacement transducer to measure the positions of the measurement object, (b) using a capacitive gauge to measure the positions of the measurement object, (c) using an inductive gauge to measure the positions of the measurement object, or (d) using a displacement measuring interferometer to measure positions of a mirror or a retro-reflector attached to the measurement object.

17. The method of claim 13 in which the material comprises polishing pitch.

18. An apparatus comprising:

a material having a first finishing surface to process a surface of a work item;

a measuring tool to measure a contour of the first finishing surface, the measuring tool comprising a measurement stage having a section having an opening, and a measurement object disposed in the opening and comprising a puck that follows the contour of the first finishing surface; and

a conditioning tool having a second finishing surface to process the first finishing surface to reduce a difference between the measured contour and a desired contour of the first finishing surface.

19. The apparatus of claim 18 in which the material comprises grooves that cause discontinuities in the first finishing surface.

20. The apparatus of claim 19 in which the material comprises polishing pitch.

21. The apparatus of claim 19 in which the measuring tool comprises a measurement object that moves across the first finishing surface, the measurement object having a size that is larger than a maximum width of the grooves.

22. The apparatus of claim 21 in which the measuring tool comprises a stage to support a sensor that senses positions of the measurement object, the stage constraining movements of the measurement object.

23. The apparatus of claim 22 in which the stage constrains the movements of the measurement object such that the measurement object has a single degree of freedom.

24. The apparatus of claim 21 in which the measurement object has a smooth surface that contacts the first finishing surface, the smooth surface having a dimension that is larger than the maximum width of the grooves.

25. The apparatus of claim 19 in which the measuring tool comprises at least one of a linear variable displacement transducer to measure positions of the measurement object, a capacitive gauge to measure positions of the measurement object, an inductive gauge to measure positions of the measurement object, or a displacement measuring interferometer to measure positions of a mirror or a retro-reflector attached to the measurement object.

26. The apparatus of claim 18 in which the second finishing surface has a size that is smaller than a size of a surface of the work item.

27. The apparatus of claim 18 in which the second finishing surface has a diameter that is less than one-half of a diameter of a surface of the work item.

28. The apparatus of claim 18 in which the first finishing surface comprises a finishing surface of at least one of cast iron or granite.

29. The apparatus of claim 18 in which the first finishing surface has a diameter of at least 3 feet, and the measuring tool has a resolution of 10 microns or smaller.

30. The apparatus of claim 18, further comprising a controller to control processing of the work item by the first polishing surface in parallel to using the measuring tool to measure the contour of the first finishing surface and using the conditioning tool to process the first finishing surface.

31. The apparatus of claim 18, further comprising a positioning device to position the measuring tool.

32. The apparatus of claim 31 in which the positioning device comprises a precision slide mechanism.

33. The apparatus of claim 18, further comprising a positioning device to position the conditioning tool.

34. The apparatus of claim 33 in which the positioning device comprises a precision slide mechanism.

35. The apparatus of claim 18, further comprising a pressure control device to control a pressure applied by the second finishing surface to the first finishing surface.

36. An apparatus comprising:

a material having a finishing surface to process a work item, the material comprising grooves that cause discontinuities in the finishing surface;

a measuring device to measure a contour of the finishing surface, the measuring device comprising a measurement stage having a section having an opening, and a measurement object disposed in the opening and comprising a puck that follows the contour of the finishing surface as the measurement stage and the measurement object move across the finishing surface, the puck having a dimension larger than a maximum width of the grooves; and

a data processor to determine a contour of the finishing surface based on the measurements of positions of the measurement object.

37. The apparatus of claim 36 in which the material comprises polishing pitch.

38. The apparatus of claim 36 in which the material comprises a solid substrate.

39. The apparatus of claim 36 in which the measuring device comprises a measurement object that moves across the first finishing surface, the measurement object having a diameter that is larger than a maximum width of the grooves.

40. The apparatus of claim 39 in which the measuring device comprises a stage to support a sensor that senses positions of the measurement object, the stage constraining movements of the measurement object.

41. The apparatus of claim 40 in which the stage constrains the movements of the measurement object such that the measurement object has a single degree of freedom.

42. The apparatus of claim 36 in which the measuring device comprises at least one of a linear variable displacement transducer to measure the positions of the measurement object, a capacitive gauge to measure positions of the measurement object, an inductive gauge to measure positions of the measurement object, or a displacement measuring interferometer to measure positions of a mirror or retro-reflector attached to the measurement object.

43. The apparatus of claim 36 in which the second finishing surface has a diameter that is smaller than a diameter of a surface of the work item.