Laminating system

• US 8,123,896 B2
• Filed: 05/31/2005
• Issued: 02/28/2012
• Est. Priority Date: 06/02/2004
• Status: Expired due to Fees

• Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Original Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Inventors: Watanabe, Ryosuke, Takahashi, Hidekazu, Tsurume, Takuya
• Primary Examiner(s): Mazumdar, Sonya
• Application Number:
  US11/596,582
• Publication Number:
  US 20080044940A1
• Time in Patent Office: 2,464 Days
• Field of Search: 156/449, 156/555, 156/184, 156/289, 156/297, 156/300, 156/446, 156/543, 156/583.1, 156/230, 156/247, 156/249, 156/311, 156/582
• US Class Current: 156/300
• CPC Class Codes: B32B 2305/342 Chips
• CPC Class Codes: B32B 37/20 involving the assembly of continuous webs only
• CPC Class Codes: B42D 25/45 Associating two or more layers
• CPC Class Codes: G06K 19/07718 the record carrier being manufactured in a continuous process, e.g. using endless rolls
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/0775 arrangements for connecting the integrated circuit to the antenna
• CPC Class Codes: H01L 21/56 Encapsulations, e.g. encapsulation layers, coatings
• CPC Class Codes: H01L 21/67126 Apparatus for sealing, encapsulating, glassing, decapsulating or the like processes H01L23/02, H01L23/28
• CPC Class Codes: H01L 21/67132 Apparatus for placing on an insulating substrate, e.g. tape
• CPC Class Codes: H01L 21/67144 Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: H01L 2221/68318 Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
• CPC Class Codes: H01L 2221/68354 used to support diced chips prior to mounting
• CPC Class Codes: H01L 2221/68363 used in a transfer process involving transfer directly from an origin substrate to a target substrate without use of an intermediate handle substrate
• CPC Class Codes: H01L 27/1214 comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
• CPC Class Codes: H01L 27/1266 the substrate on which the devices are formed not being the final device substrate, e.g. using a temporary substrate
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: Y10T 156/1089 of discrete laminae to single face of additional lamina
• CPC Class Codes: Y10T 156/1093 with covering of discrete laminae with additional lamina
• CPC Class Codes: Y10T 156/1712 : Indefinite or running length work

Abstract

It is an object of the invention to improve the production efficiency in sealing a thin film integrated circuit and to prevent the damage and break. Further, it is another object of the invention to prevent a thin film integrated circuit from being damaged in shipment and to make it easier to handle the thin film integrated circuit. The invention provides a laminating system in which rollers are used for supplying a substrate for sealing, receiving IC chips, separating, and sealing. The separation, sealing, and reception of a plurality of thin film integrated circuits can be carried out continuously by rotating the rollers; thus, the production efficiency can be extremely improved. Further, the thin film integrated circuits can be easily sealed since a pair of rollers opposite to each other is used.

Claims

1. A laminating system comprising:

a first substrate provided with a thin film integrated circuit;

a first supplying roller on which a second substrate winds;

a peeling roller;

a second supplying roller on which a third substrate winds;

a first roller; and

a second roller,

wherein the first roller and the second roller are opposed to each other,

wherein the first supplying roller is configured to supply the second substrate to the first roller through the peeling roller,

wherein the peeling roller is configured to separate the thin film integrated circuit from the first substrate and attach a first surface of the thin film integrated circuit to the second substrate,

wherein the second supplying roller is configured to supply the third substrate to the second roller,

wherein a second surface of the thin film integrated circuit is opposed to the first surface of the thin film integrated circuit, and

wherein the first roller and the second roller are configured to seal the thin film integrated circuit between the second substrate and the third substrate by performing a pressure treatment and a heat treatment while the thin film integrated circuit passes between the first roller and the second roller.

9. The laminating system according to claim 1,

wherein at least one of the first roller and the second roller comprises a heating wire or oil.

10. The laminating system according to claim 1,

wherein at least one of the second substrate and the third substrate comprises a laminate film or a paper made of a fibrous material.

11. The laminating system according to claim 1,

wherein at least one of a surface of the second substrate and a surface of the third substrate has an adhesive surface.

12. The laminating system according to claim 1,

wherein the pressure treatment and the heat treatment are performed to the second substrate, the third substrate and the thin film integrated circuit.

2. A laminating system comprising:

a transfer means for transferring a first substrate provided with a thin film integrated circuit;

a first supplying roller on which a second substrate winds;

a peeling roller;

a second supplying roller on which a third substrate winds;

a first roller;

a second roller; and

a receiving roller,

wherein the transfer means and the peeling roller are opposed to each other,

wherein the first roller and the second roller are opposed to each other,

wherein the first supplying roller is configured to supply the second substrate to the first roller through the peeling roller,

wherein the peeling roller is configured to separate the thin film integrated circuit from the first substrate and attach a first surface of the thin film integrated circuit to the second substrate while transferring the first substrate using the transfer means,

wherein the second supplying roller is configured to supply the third substrate to the second roller,

wherein a second surface of the thin film integrated circuit is opposed to the first surface of the thin film integrated circuit,

wherein the first roller and the second roller are configured to seal the thin film integrated circuit between the second substrate and the third substrate by performing a pressure treatment and a heat treatment while the thin film integrated circuit passes between the first roller and the second roller, and

wherein the receiving roller is configured to wind the thin film integrated circuit sealed between the second substrate and the third substrate.

13. The laminating system according to claim 2,

wherein at least one of the first roller and the second roller comprises a heating wire or oil.

14. The laminating system according to claim 2,

wherein at least one of the second substrate and the third substrate comprises a laminate film or a paper made of a fibrous material.

15. The laminating system according to claim 2,

wherein at least one of a surface of the second substrate and a surface of the third substrate has an adhesive surface.

16. The laminating system according to claim 2,

wherein the pressure treatment and the heat treatment are performed to the second substrate, the third substrate and the thin film integrated circuit.

17. The laminating system according to claim 2,

wherein the transfer means comprises at least one of a conveyer belt, a plurality of rollers, and a robot arm.

3. A laminating system comprising:

a first substrate provided with a thin film integrated circuit;

a first supplying roller on which a second substrate winds;

a second supplying roller on which a third substrate winds;

a first roller; and

a second roller,

wherein the first roller and the second roller are opposed to each other,

wherein the first supplying roller is configured to supply the second substrate to the first roller,

wherein the second supplying roller is configured to supply the third substrate to the second roller,

wherein the first roller is configured to attach a first surface of the thin film integrated circuit over the first substrate to the second substrate, wherein a second surface of the thin film integrated circuit is opposed to the first surface of the thin film integrated circuit, and

wherein the first roller and the second roller are configured to seal the thin film integrated circuit between the second substrate and the third substrate by performing a pressure treatment and a heat treatment while the thin film integrated circuit passes between the first roller and the second roller.

18. The laminating system according to claim 3,

wherein at least one of the first roller and the second roller comprises a heating wire or oil.

19. The laminating system according to claim 3,

wherein at least one of the second substrate and the third substrate comprises a laminate film or a paper made of a fibrous material.

20. The laminating system according to claim 3,

wherein at least one of a surface of the second substrate and a surface of the third substrate has an adhesive surface.

21. The laminating system according to claim 3,

wherein the pressure treatment and the heat treatment are performed to the second substrate, the third substrate and the thin film integrated circuit.

4. A laminating system comprising:

a transfer means for transferring a first substrate provided with a thin film integrated circuit;

a first supplying roller on which a second substrate winds;

a second supplying roller on which a third substrate winds;

a first roller;

a second roller; and

a receiving roller,

wherein the transfer means and the first roller and the second roller are opposed to each other,

wherein the first roller and the second roller are opposed to each other,

wherein the first supplying roller is configured to supply the second substrate to the first roller,

wherein the second supplying roller is configured to supply the third substrate to the second roller,

wherein the first roller is configured to attach a first surface of the thin film integrated circuit over the first substrate to the second substrate while transferring the first substrate by using the transfer means,

wherein a second surface of the thin film integrated circuit is opposed to the first surface of the thin film integrated circuit,

wherein the first roller and the second roller are configured to seal the thin film integrated circuit between the second substrate and the third substrate by performing a pressure treatment and a heat treatment while the thin film integrated circuit passes between the first roller and the second roller, and

wherein the receiving roller is configured to wind the thin film integrated circuit sealed between the second substrate and the third substrate.

22. The laminating system according to claim 4,

wherein at least one of the first roller and the second roller comprises a heating wire or oil.

23. The laminating system according to claim 4,

wherein at least one of the second substrate and the third substrate comprises a laminate film or a paper made of a fibrous material.

24. The laminating system according to claim 4,

wherein at least one of a surface of the second substrate and a surface of the third substrate has an adhesive surface.

25. The laminating system according to claim 4,

wherein the pressure treatment and the heat treatment are performed to the second substrate, the third substrate and the thin film integrated circuit.

26. The laminating system according to claim 4,

wherein the transfer means comprises at least one of a conveyer belt, a plurality of rollers, and a robot arm.

5. A laminating system comprising:

a first substrate provided with a thin film integrated circuit;

a first substrate control means for fixing and moving the first substrate;

a transfer means for transferring the first substrate;

a first supplying roller on which a second substrate winds;

a second supplying roller on which a third substrate winds;

a first roller;

a second roller; and

a receiving roller,

wherein the first roller and the second roller are opposed to each other,

wherein the first supplying roller is configured to supply the second substrate to the first roller,

wherein the first roller is configured to attach a first surface of the thin film integrated circuit over the first substrate to the second substrate while transferring the first substrate by using the transfer means and the first substrate control means,

wherein the second supplying roller is configured to supply the third substrate to the second roller,

wherein a second surface of the thin film integrated circuit is opposed to the first surface of the thin film integrated circuit,

wherein the first roller and the second roller are configured to seal the thin film integrated circuit between the second substrate and the third substrate by performing a pressure treatment and a heat treatment while the thin film integrated circuit passes between the first roller and the second roller, and

wherein the receiving roller is configured to wind the thin film integrated circuit sealed between the second substrate and the third substrate.

27. The laminating system according to claim 5,

wherein at least one of the first roller and the second roller comprises a heating wire or oil.

28. The laminating system according to claim 5,

wherein at least one of the second substrate and the third substrate comprises a laminate film or a paper made of a fibrous material.

29. The laminating system according to claim 5,

wherein at least one of a surface of the second substrate and a surface of the third substrate has an adhesive surface.

30. The laminating system according to claim 5,

wherein the pressure treatment and the heat treatment are performed to the second substrate, the third substrate and the thin film integrated circuit.

31. The laminating system according to claim 5,

wherein the transfer means comprises at least one of a conveyer belt, a plurality of rollers, and a robot arm.

6. A method for manufacturing an IC chip comprising:

forming a release layer over a first substrate comprising an insulating surface;

forming at least one thin film integrated circuit over the release layer;

forming an opening at a boundary of the thin film integrated circuit, thereby exposing the release layer;

introducing an etchant to the opening, thereby removing the release layer;

rotating a peeling roller to attach a first surface of the thin film integrated circuit to a second substrate, thereby separating the thin film integrated circuit from the first substrate;

rotating a first roller and a second roller to attach a second surface of the thin film integrated circuit to a third substrate; and

sealing the thin film integrated circuit between the second substrate and the third substrate by performing a pressure treatment and a heat treatment while the thin film integrated circuit passes between the first roller and the second roller,

wherein the first surface and the second surface of the thin film integrated circuit are opposed to each other.

32. The method for manufacturing an IC chip according to claim 6,

wherein at least one of the first roller and the second roller comprises a heating wire or oil.

33. The method for manufacturing an IC chip according to claim 6,

wherein at least one of the second substrate and the third substrate comprises a laminate film or a paper made of a fibrous material.

34. The method for manufacturing an IC chip according to claim 6,

wherein at least one of a surface of the second substrate and a surface of the third substrate has an adhesive surface.

35. The method for manufacturing an IC chip according to claim 6,

wherein the pressure treatment and the heat treatment are performed to the second substrate, the third substrate and the thin film integrated circuit.

7. A method for manufacturing an IC chip comprising:

forming a release layer over a first substrate comprising an insulating surface;

forming at least one thin film integrated circuit over the release layer;

forming an opening at a boundary of the thin film integrated circuit, thereby exposing the release layer;

introducing an etchant to the opening, thereby removing the release layer;

rotating a peeling roller to attach a first surface of the thin film integrated circuit to a second substrate, thereby separating the thin film integrated circuit from the first substrate;

rotating a first roller and a second roller to attach a second surface of the thin film integrated circuit to a third substrate; and

sealing the thin film integrated circuit between the second substrate and the third substrate by performing a pressure treatment and a heat treatment while the thin film integrated circuit passes between the first roller and the second roller; and

winding the thin film integrated circuit which is sealed between the second substrate and the third substrate by rotating a receiving roller,

wherein the first surface and the second surface of the thin film integrated circuit are opposed to each other.

36. The method for manufacturing an IC chip according to claim 7,

wherein at least one of the first roller and the second roller comprises a heating wire or oil.

37. The method for manufacturing an IC chip according to claim 7,

wherein at least one of the second substrate and the third substrate comprises a laminate film or a paper made of a fibrous material.

38. The method for manufacturing an IC chip according to claim 7,

wherein at least one of a surface of the second substrate and a surface of the third substrate has an adhesive surface.

39. The method for manufacturing an IC chip according to claim 7,

wherein the pressure treatment and the heat treatment are performed to the second substrate, the third substrate and the thin film integrated circuit.

8. A method for manufacturing an IC chip comprising:

forming a release layer over a first substrate comprising an insulating surface;

forming at least one thin film integrated circuit over the release layer;

forming an opening at a boundary of the thin film integrated circuit, thereby exposing the release layer;

introducing an etchant to the opening, thereby removing the release layer;

rotating a peeling roller to attach a first surface of the thin film integrated circuit over the first substrate to a second substrate;

rotating a first roller and a second roller to attach a second surface of the thin film integrated circuit over the first substrate to a third substrate;

sealing the thin film integrated circuit between the second substrate and the third substrate by performing a pressure treatment and a heat treatment while the thin film integrated circuit passes between the first roller and the second roller; and

rotating a receiving roller to wind the thin film integrated circuit which is sealed with the second substrate and the third substrate,

wherein the first surface and the second surface are opposed to each other.

40. The method for manufacturing an IC chip according to claim 8,

wherein at least one of the first roller and the second roller comprises a heating wire or oil.

41. The method for manufacturing an IC chip according to claim 8,

wherein at least one of the second substrate and the third substrate comprises a laminate film or a paper made of a fibrous material.

42. The method for manufacturing an IC chip according to claim 8,

wherein at least one of a surface of the second substrate and a surface of the third substrate has an adhesive surface.

43. The method for manufacturing an IC chip according to claim 8,

wherein the pressure treatment and the heat treatment is performed to the second substrate, the third substrate and the thin film integrated circuit.