Ink-jet printhead and manufacturing method thereof

• US 8,128,203 B2
• Filed: 04/28/2006
• Issued: 03/06/2012
• Est. Priority Date: 04/28/2006
• Status: Expired due to Fees

• Current Assignee: Sicpa Holding SA
• Original Assignee: Telecom Italia S.p.A.
• Inventors: Tori, Silvano, Arvat, Giancarlo, Manini, Enrico, Peaquin, Fabio, Pasqua, Claudio
• Primary Examiner(s): Nguyen, Lamson
• Application Number:
  US12/298,859
• Publication Number:
  US 20090195604A1
• Time in Patent Office: 2,139 Days
• Field of Search: 347/40, 347/43, 347/47
• US Class Current: 347/47
• CPC Class Codes: B41J 2/16 Production of nozzles
• CPC Class Codes: B41J 2/1623 bonding and adhesion
• CPC Class Codes: B41J 2/1632 machining
• CPC Class Codes: B41J 2/1635 dividing the wafer into individual chips
• CPC Class Codes: Y10T 29/49401 Fluid pattern dispersing device making, e.g., ink jet

Abstract

The present invention provides a process for manufacturing an ink-jet printhead comprising the steps of providing a print head wafer comprising a plurality of print head dice, each print head die comprising a nozzle plate bonded to a barrier layer formed on a substrate, wherein said plurality of print head dice are arranged on the substrate so as to define at least one first dividing channel comprising at least one first channel portion, said at least one first channel portion having a bottom portion comprised between the lateral sides of said barrier layer of at least two adjacent print head dice and an upper portion comprised between the lateral sides of said nozzle plate of said at least two adjacent print head dice, and applying an adhesive composition in an amount able to substantially fill the whole length of said at least one first channel portion.

Claims

1. A print head die comprising a nozzle plate bonded to a barrier layer formed on a silicon substrate, wherein said nozzle plate of said die comprises four lateral sides and said barrier layer of said die comprises four lateral sides, and wherein a strip of adhesive composition laterally bonds at least two opposite lateral sides of said nozzle plate and of said barrier layer to said silicon substrate.

2. The print head die of claim 1, wherein at least two opposite lateral sides of said nozzle plate and the surface of said barrier layer define a meatus, and wherein said strip of adhesive composition fills said meatus.

3. The print head die of claim 1, wherein said four lateral sides of said nozzle plate and the surface of said barrier layer define a meatus, and wherein said strip of adhesive composition fills said meatus.