Apparatus for forming a wireless communication device

• US 8,136,223 B2
• Filed: 05/18/2010
• Issued: 03/20/2012
• Est. Priority Date: 04/24/2002
• Status: Expired due to Fees

• Current Assignee: Mineral Lassen LLC (Intellectual Ventures LLC)
• Original Assignee: Mineral Lassen LLC (Intellectual Ventures LLC)
• Inventors: Forster, Ian J., King, Patrick F.
• Primary Examiner(s): Banks, Derris
• Assistant Examiner(s): Nguyen, Tai
• Application Number:
  US12/782,554
• Publication Number:
  US 20100218371A1
• Time in Patent Office: 672 Days
• Field of Search: 296/00, 296/01, 295/641, 295/644, 298/32, 343/700.MS, 343/767, 343/873, 343/676, 343/795, 340/572.8, 340/568.1, 340/539, 156/47, 156/324
• US Class Current: 29/600
• CPC Class Codes: G06K 19/07718 the record carrier being manufactured in a continuous process, e.g. using endless rolls
• CPC Class Codes: G06K 19/07745 Mounting details of integrated circuit chips
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/07786 the antenna being of the HF type, such as a dipole
• CPC Class Codes: H01L 23/49855 for flat-cards, e.g. credit cards cards per se G06K19/00
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H01Q 9/285 Planar dipole H01Q9/065 takes precedence; patch antenna H01Q9/0407
• CPC Class Codes: H05K 1/182 associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
• CPC Class Codes: H05K 3/041 by using a die for cutting the conductive material
• CPC Class Codes: H05K 3/326 the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits H05K3/365 takes precedence
• CPC Class Codes: Y10T 156/1075 of plural laminae from single stock and assembling to each other or to additional lamina
• CPC Class Codes: Y10T 156/1097 Lamina is running length web
• CPC Class Codes: Y10T 29/49 Method of mechanical manufacture
• CPC Class Codes: Y10T 29/49002 Electrical device making
• CPC Class Codes: Y10T 29/49004 including measuring or testing of device or component part
• CPC Class Codes: Y10T 29/49016 Antenna or wave energy "plumbing" making
• CPC Class Codes: Y10T 29/49018 with other electrical component
• CPC Class Codes: Y10T 29/49121 Beam lead frame or beam lead device
• CPC Class Codes: Y10T 29/49124 : On flat or curved insulated base, e.g., printed circuit, etc.
• CPC Class Codes: Y10T 29/49126 : Assembling bases
• CPC Class Codes: Y10T 29/49128 : Assembling formed circuit to base
• CPC Class Codes: Y10T 29/4913 : Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49144 : by metal fusion
• CPC Class Codes: Y10T 29/49155 : Manufacturing circuit on or in base
• CPC Class Codes: Y10T 29/49751 : Scrap recovering or utilizing
• CPC Class Codes: Y10T 29/49755 : Separating one material from another
• CPC Class Codes: Y10T 29/5137 : including assembling or disassembling station
• CPC Class Codes: Y10T 29/5139 : and means to sever work prior to disassembling
• CPC Class Codes: Y10T 29/514 : comprising means to strip insulation from wire
• CPC Class Codes: Y10T 29/5313 : Means to assemble electrical device
• CPC Class Codes: Y10T 29/53165 : Magnetic memory device
• CPC Class Codes: Y10T 29/5317 : Laminated device
• CPC Class Codes: Y10T 29/53174 : Means to fasten electrical component to wiring board, base, or substrate
• CPC Class Codes: Y10T 29/53178 : Chip component
• CPC Class Codes: Y10T 29/532 : Conductor
• CPC Class Codes: Y10T 29/53265 : with work-holder for assembly
• CPC Class Codes: Y10T 83/7868 : Tool element selectively operative

Abstract

A method for manufacturing wireless communication devices for use in tracking or identifying items comprises cutting techniques that allow the size of antenna elements for the wireless communication device to be adjusted. Rollers cut tabs that form the antenna elements. In one embodiment, a plurality of rollers are used, each one effecting a different cut whose position may be adjusted so as to shorten or lengthen the antenna element. In another embodiment, the rollers are independently positionable to shorten or lengthen the antenna element. A radiator may be configured to assess a capacitance of the antenna elements prior to cutting to determine an appropriate size for the antenna elements.

Claims

1. An apparatus for forming a wireless communication device, the apparatus comprising:

a plurality of rollers configured to receive a production line, wherein the plurality of rollers includes three rollers, and wherein each roller is configured to make a cut on the production line to cut a pair of antenna elements;

means for cutting an antenna element from the production line; and

means for securing a wireless communication chip to both the antenna element and a substrate to form the wireless communication device.

2. The apparatus of claim 1, wherein the means for cutting an antenna element from the production line comprises means for cutting a hole through the backing, around the wireless communication chip, and through the antenna element.

3. The apparatus of claim 2, further comprising a radiator configured to assess a capacitance of the antenna element prior to cutting to determine an appropriate size for the antenna element that is cut by the means for cutting.

4. The apparatus of claim 1, wherein a first of the three rollers is configured to make a cut that forms an interior portion of the pair of antenna elements.

5. The apparatus of claim 4, wherein a second of the three rollers is configured to make a cut that forms an exterior portion of one of the pair of antenna elements.

6. The apparatus of claim 5, wherein a third of the three rollers is configured to make a cut that forms an exterior portion of the other of the pair of antenna elements.

7. The apparatus of claim 1, wherein a phase of one or more of the three rollers is adjustable to selectively vary the size of the antenna elements.

8. The apparatus of claim 1, wherein the means for securing a wireless communication chip comprises an adhesive.

9. The apparatus of claim 1, further comprising means for cutting fingers into the antenna element, wherein the means for securing a wireless communication chip comprises a hot gas jet configured to heat pins of the wireless communication chip prior to insertion of the chip into the substrate with the fingers of the antenna element in contact with the heated pins.

10. An apparatus for forming a wireless communication device, the apparatus comprising:

means for adjustably cutting a first tab for use as a first antenna element;

means for adjustably cutting a second tab for use as a second antenna element; and

means for securing the first and second tabs to both a wireless communication chip and a substrate, thereby forming the wireless communication device;

wherein the means for adjustably cutting the first and second tabs includes three rollers, and wherein each roller is configured to make a cut on a production line.

11. The apparatus of claim 10, wherein the means for adjustably cutting the first and second tabs comprises means for cutting the backing material around the chip and through the tabs.

12. The apparatus of claim 11, further comprising a radiator configured to assess the capacitance of the first and second tabs prior to cutting to determine an appropriate size for the cut made by the means for cutting.

13. The apparatus of claim 10, wherein a first of the three rollers is configured to make a cut that forms an interior portion of the first and second antenna elements.

14. The apparatus of claim 13, wherein a second of the three rollers is configured to make a cut that forms an exterior portion of one of the first and second antenna elements.

15. The apparatus of claim 14, wherein a third of the three rollers is configured to make a cut that forms an exterior potion of the other of the first and second antenna elements.

16. The apparatus of claim 10, wherein a phase of one or more of the three rollers is adjustable to selectively vary the size of the first and second antenna elements.

17. The apparatus of claim 10, wherein the means for securing the first and second tabs comprises an adhesive.

18. The apparatus of claim 10, wherein the means for securing the first and second tabs comprises a hot gas jet configured to heat pins of the wireless communication chip prior to coupling to fingers cut into the first and second tabs.

19. An apparatus for forming a wireless communication device, the apparatus comprising:

a plurality of rollers configured to receive a production line;

means for cutting an antenna element from the production line;

means for securing a wireless communication chip to both the antenna element and a substrate to form the wireless communication device; and

means for cutting fingers into the antenna element;

wherein the means for securing a wireless communication chip includes means for heating pins of the wireless communication chip prior to insertion of the chip into the substrate with the fingers of the antenna element in contact with the heated pins.

20. The apparatus of claim 19, wherein the plurality of rollers comprises two independently-positionable rollers.

21. The apparatus of claim 20, wherein the two independently-positionable rollers are configured to receive a production line comprising a backing material having the antenna element and the wireless communication chip disposed thereon.

22. An apparatus for forming a wireless communication device, the apparatus comprising:

means for adjustably cutting a first tab for use as a first antenna element;

means for adjustably cutting a second tab for use as a second antenna element; and

means for securing the first and second tabs to both wireless communication chip and a substrate, thereby forming the wireless communication device;

wherein the means for adjustably cutting the first and second tabs includes at least two independently-positionable rollers; and

wherein the means for adjustably cutting the first and second tabs comprises means for cutting the backing material around the chip and through the tabs.

23. The apparatus of claim 22, wherein the two independently-positionable rollers are configured to receive a production line comprising a backing material having the first and second tabs and the wireless communication chip disposed thereon.

24. An apparatus for forming a wireless communication device, the apparatus comprising:

means for adjustably cutting a first tab for use as a first antenna element;

means for adjustably cutting a second tab for use as a second antenna element; and

means for securing the first and second tabs to both a wireless communication chip and a substrate, thereby forming the wireless communication device;

wherein the means for securing the first and second tabs includes means for heating pins of the wireless communication chip prior to coupling to fingers cut into the first and second tabs.

25. The apparatus of claim 24, wherein the means for adjustably cutting the first and second tabs comprises at least two independently-positionable rollers.