Optical semiconductor device having pre-molded leadframe with window and method therefor
First Claim
1. A method of making a semiconductor device, comprising:
- providing an optical semiconductor die having an optically active area that generates electrical signals in response to the optically active area reacting to light;
providing a leadframe having a dam bar and a plurality of contact pads formed as fingers that extend away from the dam bar;
disposing a light transmitting material around the fingers and between the dam bar, the light transmitting material including an elevated area vertically offset with respect to the leadframe;
attaching the optical semiconductor die to the leadframe so that the optically active area of the optical semiconductor die is aligned with the light transmitting material to provide a light transmission path to the optically active area; and
disposing an underfill material around the light transmission path and between the optical semiconductor die and leadframe such that the underfill material contacts a sidewall of the elevated area.
6 Assignments
0 Petitions
Accused Products
Abstract
A semiconductor device is made by providing a semiconductor die having an optically active area, providing a leadframe or pre-molded laminated substrate having a plurality of contact pads and a light transmitting material disposed between the contact pads, attaching the semiconductor die to the leadframe so that the optically active area is aligned with the light transmitting material to provide a light transmission path to the optically active area, and disposing an underfill material between the semiconductor die and leadframe. The light transmitting material includes an elevated area to prevent the underfill material from blocking the light transmission path. The elevated area includes a dam surrounding the light transmission path, an adhesive ring, or the light transmission path itself can be the elevated area. An adhesive ring can be disposed on the dam. A filler material can be disposed between the light transmitting material and contact pads.
84 Citations
31 Claims
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1. A method of making a semiconductor device, comprising:
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providing an optical semiconductor die having an optically active area that generates electrical signals in response to the optically active area reacting to light; providing a leadframe having a dam bar and a plurality of contact pads formed as fingers that extend away from the dam bar; disposing a light transmitting material around the fingers and between the dam bar, the light transmitting material including an elevated area vertically offset with respect to the leadframe; attaching the optical semiconductor die to the leadframe so that the optically active area of the optical semiconductor die is aligned with the light transmitting material to provide a light transmission path to the optically active area; and disposing an underfill material around the light transmission path and between the optical semiconductor die and leadframe such that the underfill material contacts a sidewall of the elevated area. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method of making a semiconductor device, comprising:
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providing an optical semiconductor die that generates electrical signals in response to light; providing a leadframe having a light transmitting window, a plurality of contact pads formed as fingers around the light transmitting window, and an elevated area vertically offset with respect to the fingers; attaching the optical semiconductor die to the leadframe so that the light transmitting window is aligned to an optically active area of the optical semiconductor die; and disposing an underfill material between the optical semiconductor die and leadframe such that the underfill material contacts a sidewall of the elevated area. - View Dependent Claims (9, 10, 11, 12, 13)
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14. A method of making a semiconductor package, comprising:
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providing an optical semiconductor die that generates electrical signals in response to light; providing a substrate having a plurality of contact pads; disposing a light transmitting material between the plurality of contact pads and the substrate, the light transmitting material including an elevated area vertically offset with respect to the substrate; and attaching the optical semiconductor die to the substrate so that the light transmitting material is aligned to an optically active area of the optical semiconductor die. - View Dependent Claims (15, 16, 17, 18)
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19. A method of making a semiconductor package, comprising:
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providing an optical semiconductor die; providing a substrate having a plurality of contact pads; disposing a light transmitting material between and substantially coplanar with the plurality of contact pads and the substrate; attaching the optical semiconductor die to the substrate so that the light transmitting material is aligned to an optically active area of the optical semiconductor die; forming a plurality of vias in the optical semiconductor die; and electrically connecting the plurality of vias to the substrate.
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20. A semiconductor package, comprising:
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an optical semiconductor die; and a substrate having a plurality of contact pads and a light transmitting material disposed between the contact pads such that a portion of the light transmitting material is vertically offset with respect to the contact pads, wherein the optical semiconductor die is attached to the substrate so that the light transmitting material is aligned to an optically active area of the optical semiconductor die. - View Dependent Claims (21, 22, 23, 24, 25)
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26. A method of making a semiconductor device, comprising:
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providing an optical semiconductor die that generates electrical signals in response to light; providing a leadframe having a plurality of contact pads and an elevated area disposed around a light transmitting window; attaching the optical semiconductor die to the plurality of contact pads so that the light transmitting window is aligned to an optically active area of the optical semiconductor die; and disposing an underfill material between the optical semiconductor die and leadframe such that the underfill material contacts a sidewall of the elevated area. - View Dependent Claims (27, 28, 29, 30, 31)
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Specification