Manufacturing method for magnetic sensor and lead frame therefor

• US 8,138,757 B2
• Filed: 08/31/2005
• Issued: 03/20/2012
• Est. Priority Date: 07/29/2002
• Status: Expired due to Fees

• Current Assignee: Yamaha Corporation
• Original Assignee: Yamaha Corporation
• Inventors: Adachi, Hiroshi, Saitoh, Hiroshi, Shirasaka, Kenichi, Sato, Hideki, Omura, Masayoshi
• Primary Examiner(s): Assouad, Patrick
• Assistant Examiner(s): Schindler, David M.
• Application Number:
  US11/214,986
• Publication Number:
  US 20060006863A1
• Time in Patent Office: 2,393 Days
• Field of Search: 324/207.21, 324/252, 324/247, 324/244, 324/249, 324/251, 333/55.R
• US Class Current: 324/247
• CPC Class Codes: G01C 17/30 Earth-inductor compasses
• CPC Class Codes: G01R 33/0206 Three-component magnetometers
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 2224/451 with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 23/49575 Assemblies of semiconductor devices on lead frames
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01019 Potassium [K]
• CPC Class Codes: H01L 2924/01021 Scandium [Sc]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01039 : Yttrium [Y]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01051 : Antimony [Sb]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: Y10T 29/49121 : Beam lead frame or beam lead device
• CPC Class Codes: Y10T 29/49169 : Assembling electrical component directly to terminal or elongated conductor
• CPC Class Codes: Y10T 29/49174 : Assembling terminal to elongated conductor

Abstract

A magnetic sensor is constituted using magnetic sensor chips mounted on stages supported by interconnecting members and a frame having leads in a lead frame. Herein, the stages are inclined upon plastic deformation of the interconnecting members. When the frame is held in a metal mold and the stages are pressed, the interconnecting members are elastically deformed, so that the magnetic sensor chips are bonded onto the stages placed substantially in the same plane and are then wired with the leads. Thereafter, the stages are released from pressure, so that the interconnecting members are restored from the elastically deformed states thereof. When the magnetic sensor chips are combined together to realize three sensing directions, it is possible to accurately measure three-dimensional bearings of magnetism, and the magnetic sensor can be reduced in dimensions and manufactured with a reduced cost thereof.

Claims

1. A magnetic sensor comprising:

a first magnetic sensor chip sensitive to components of magnetism in two sensing directions; and

a second magnetic sensor chip sensitive to components of magnetism in a single sensing direction, which crosses at an acute angle to a plane defined by the two sensing directions of the first magnetic sensor chip, wherein the magnetic sensor chips are arranged inside of a same package in such a way that one of the sensing directions is parallel to a bottom surface of the package, and the other sensing directions are inclined against the bottom surface of the package.

2. The magnetic sensor of claim 1, wherein the magnetic sensor includes a lead frame, and each magnetic sensor chip is mounted on the lead frame.

3. The magnetic sensor according to claim 1, wherein the magnetic sensor chips are encapsulated in a single package.

4. The magnetic sensor according to claim 2, wherein the lead frame has a plurality of stages for mounting the magnetic sensor chips, and wherein the stages are mutually interconnected together.