Semiconductor chip assembly with post/base/cap heat spreader
First Claim
1. A semiconductor chip assembly, comprising:
- a semiconductor device;
an adhesive that includes an opening;
a heat spreader that includes a post, a base and a cap, wherein the post is adjacent to the base and extends above the base in an upward direction and thermally connects the base and the cap, the base extends below the post in a downward direction opposite the upward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions, and the cap extends above and is adjacent to and covers in the upward direction and extends laterally from a top of the post; and
a conductive trace that includes a pad and a terminal;
wherein the semiconductor device is mounted on the cap, overlaps the post, is electrically connected to the pad and thereby electrically connected to the terminal, and is thermally connected to the cap and thereby thermally connected to the base;
wherein the adhesive is mounted on and extends above the base, extends into a gap between the post and the pad, extends laterally from the post to or beyond the terminal and is sandwiched between the base and the pad;
wherein the pad is mounted on the adhesive and extends above the base; and
wherein the post extends into the opening, the cap overlaps the adhesive, the cap is thinner than the pad where the cap is adjacent to the top of the post, the cap is above a bottom surface of the pad where the cap is adjacent to the top of the post, the cap is below a top surface of the pad where the cap is adjacent to the top of the post and the base extends below the semiconductor device, the adhesive and the pad.
1 Assignment
0 Petitions
Accused Products
Abstract
A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The semiconductor device is electrically connected to the conductive trace and thermally connected to the heat spreader. The heat spreader includes a post, a base and a cap. The post extends upwardly from the base into an opening in the adhesive, the base extends below and laterally from the post, and the cap extends above and laterally from the post. The adhesive extends between the post and the conductive trace and between the base and the conductive trace. The conductive trace provides signal routing between a pad and a terminal and the heat spreader provides thermal dissipation between the cap and the base.
66 Citations
75 Claims
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1. A semiconductor chip assembly, comprising:
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a semiconductor device; an adhesive that includes an opening; a heat spreader that includes a post, a base and a cap, wherein the post is adjacent to the base and extends above the base in an upward direction and thermally connects the base and the cap, the base extends below the post in a downward direction opposite the upward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions, and the cap extends above and is adjacent to and covers in the upward direction and extends laterally from a top of the post; and a conductive trace that includes a pad and a terminal; wherein the semiconductor device is mounted on the cap, overlaps the post, is electrically connected to the pad and thereby electrically connected to the terminal, and is thermally connected to the cap and thereby thermally connected to the base; wherein the adhesive is mounted on and extends above the base, extends into a gap between the post and the pad, extends laterally from the post to or beyond the terminal and is sandwiched between the base and the pad; wherein the pad is mounted on the adhesive and extends above the base; and wherein the post extends into the opening, the cap overlaps the adhesive, the cap is thinner than the pad where the cap is adjacent to the top of the post, the cap is above a bottom surface of the pad where the cap is adjacent to the top of the post, the cap is below a top surface of the pad where the cap is adjacent to the top of the post and the base extends below the semiconductor device, the adhesive and the pad. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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21. A semiconductor chip assembly, comprising:
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a semiconductor device that includes a thermal contact surface; an adhesive that includes an opening; a heat spreader that includes a post, a base and a cap, wherein the post is adjacent to and integral with the base, extends above the base in an upward direction and thermally connects the base and the cap, the base extends below the post in a downward direction opposite the upward direction, covers the post in the downward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions, and the cap extends above and is adjacent to and covers in the upward direction and extends laterally from a top of the post; and a conductive trace that includes a pad, a terminal and a routing line, wherein an electrically conductive path between the pad and the terminal includes the routing line; wherein the semiconductor device is mounted on the cap, overlaps the post, is electrically connected to the pad and thereby electrically connected to the terminal, and is thermally connected to the cap and thereby thermally connected to the base; wherein the thermal contact surface is aligned with and faces towards the cap; wherein the adhesive is mounted on and extends above the base, extends into a gap between the post and the pad, is sandwiched between the base and the terminal outside the gap, surrounds the post in the lateral directions, extends laterally from the post to or beyond the terminal and extends to peripheral edges of the assembly; wherein the conductive trace is mounted on the adhesive and extends above the base, and the pad, the terminal and the routing line contact and overlap the adhesive; wherein the post extends into the opening and the top of the post has a circular shape; wherein the base contacts the adhesive, extends below the semiconductor device, the adhesive and the conductive trace, covers the post, the cap, the adhesive and the conductive trace in the downward direction and extends to peripheral edges of the assembly; and wherein the cap contacts and overlaps the adhesive and is coplanar with the pad and has a top surface with a square or rectangular shape that is sized and shaped to accommodate the thermal contact surface, the cap is thinner than the pad where the cap is adjacent to the top of the post, the cap is above a bottom surface of the pad where the cap is adjacent to the top of the post and the cap is below a top surface of the pad where the cap is adjacent to the top of the post. - View Dependent Claims (22, 23, 24, 25)
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26. A semiconductor chip assembly, comprising:
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a semiconductor device; an adhesive that includes an opening; a heat spreader that includes a post, a base and a cap, wherein the post is adjacent to and integral with the base and extends above the base in an upward direction and thermally connects the base and the cap, the base extends below the post in a downward direction opposite the upward direction, covers the post in the downward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions, and the cap extends above and is adjacent to and covers in the upward direction and extends laterally from a top of the post; a substrate that includes a pad and a dielectric layer, wherein an aperture extends through the substrate; and a terminal; wherein the semiconductor device is mounted on the cap, overlaps the post, is electrically connected to the pad and thereby electrically connected to the terminal, and is thermally connected to the cap and thereby thermally connected to the base; wherein the adhesive is mounted on and extends above the base, extends into a gap in the aperture between the post and the substrate, extends across the dielectric layer in the gap, extends laterally from the post to or beyond the terminal and is sandwiched between the post and the dielectric layer and between the base and the substrate; wherein the substrate is mounted on the adhesive and extends above the base; and wherein the post extends into the opening and the aperture and above and below the dielectric layer, the cap overlaps the adhesive and is coplanar with the pad, the cap is thinner than the pad where the cap is adjacent to the top of the post, the cap is above a bottom surface of the pad where the cap is adjacent to the top of the post, the cap is below a top surface of the pad where the cap is adjacent to the top of the post and the base extends below the semiconductor device, the adhesive and the substrate. - View Dependent Claims (27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45)
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46. A semiconductor chip assembly, comprising:
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a semiconductor device that includes a thermal contact surface; an adhesive that includes an opening; a heat spreader that includes a post, a base and a cap, wherein the post is adjacent to and integral with the base, extends above the base in an upward direction and thermally connects the base and the cap, the base extends below the post in a downward direction opposite the upward direction, covers the post in the downward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions, and the cap extends above and is adjacent to and covers in the upward direction and extends laterally from a top of the post; and a substrate that includes a pad, a terminal, a routing line and a dielectric layer, wherein the pad, the terminal and the routing line contact and extend above the dielectric layer, an electrically conductive path between the pad and the terminal includes the routing line, and an aperture extends through the substrate; wherein the semiconductor device is mounted on the cap, overlaps the post, is electrically connected to the pad and thereby electrically connected to the terminal, and is thermally connected to the cap and thereby thermally connected to the base; wherein the thermal contact surface is aligned with and faces towards the cap; wherein the adhesive is mounted on and extends above the base, extends into a gap in the aperture between the post and the substrate, extends across the dielectric layer in the gap, is sandwiched between the post and the dielectric layer in the gap, is sandwiched between the base and the substrate outside the gap, surrounds the post in the lateral directions, is overlapped by the pad, the terminal and the routing line, extends laterally from the post to or beyond the terminal and extends to peripheral edges of the assembly; wherein the substrate is mounted on the adhesive and extends above the base; wherein the post extends into the opening and the aperture and above and below the dielectric layer and the top of the post has a circular shape; wherein the base extends below the semiconductor device, the adhesive and the substrate, covers the post, the cap, the adhesive and the substrate in the downward direction and extends to peripheral edges of the assembly; and wherein the cap contacts and overlaps the adhesive and is coplanar with the pad and has a top surface with a square or rectangular shape that is sized and shaped to accommodate the thermal contact surface, the cap is thinner than the pad where the cap is adjacent to the top of the post, the cap is above a bottom surface of the pad where the cap is adjacent to the top of the post and the cap is below a top surface of the pad where the cap is adjacent to the top of the post. - View Dependent Claims (47, 48, 49, 50)
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51. A semiconductor chip assembly, comprising:
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a semiconductor device; an adhesive that includes an opening; a heat spreader that includes a post, a base and a cap, wherein the post is adjacent to and integral with the base and extends above the base in an upward direction, is metallurgically bonded to the cap and thermally connects the base and the cap, the base extends below the post in a downward direction opposite the upward direction, covers the post in the downward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions, and the cap extends above and is adjacent to and covers in the upward direction and extends laterally from a top of the post; and a conductive trace that includes a pad and a terminal; wherein the semiconductor device is mounted on the cap, overlaps the post, is electrically connected to the pad and thereby electrically connected to the terminal, and is thermally connected to the cap and thereby thermally connected to the base; wherein the adhesive is mounted on and extends above the base, contacts the post, the base and the cap, is sandwiched between the base and the pad and extends laterally from the post to or beyond the terminal; wherein the pad is mounted on and extends above the adhesive; and wherein the post extends into the opening, the cap overlaps the adhesive, the cap is thinner than the pad where the cap is adjacent to the top of the post, the cap is above a bottom surface of the pad where the cap is adjacent to the top of the post, the cap is below a top surface of the pad where the cap is adjacent to the top of the post and the base extends below the semiconductor device and the pad. - View Dependent Claims (52, 53, 54, 55)
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56. A semiconductor chip assembly, comprising:
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a semiconductor device; an adhesive that includes an opening; a heat spreader that includes a post, a base and a cap, wherein the post is adjacent to and integral with the base and extends above the base in an upward direction, is metallurgically bonded to the cap and thermally connects the base and the cap, the base extends below the post in a downward direction opposite the upward direction, covers the post in the downward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions, and the cap extends above and is adjacent to and covers in the upward direction and extends laterally from a top of the post; a substrate that includes a dielectric layer, wherein an aperture extends through the substrate; and a conductive trace that includes a pad and a terminal; wherein the semiconductor device is mounted on the cap, overlaps the post, is electrically connected to the pad and thereby electrically connected to the terminal, and is thermally connected to the cap and thereby thermally connected to the base; wherein the adhesive is mounted on and extends above the base, extends into a gap in the aperture between the post and the substrate, contacts the cap, contacts and is sandwiched between the post and the dielectric layer in the gap and between the base and the dielectric layer outside the gap, is sandwiched between the base and the pad, extends laterally from the post to or beyond the terminal and extends to peripheral edges of the assembly; wherein the dielectric layer is mounted on the adhesive, extends above the base and is spaced from the post and the base; wherein the pad is mounted on and extends above the dielectric layer; and wherein the post extends into the opening and the aperture and above and below the dielectric layer, the cap overlaps the adhesive and is coplanar with the pad, the cap is thinner than the pad where the cap is adjacent to the top of the post, the cap is above a bottom surface of the pad where the cap is adjacent to the top of the post, the cap is below a top surface of the pad where the cap is adjacent to the top of the post and the base extends below the semiconductor device and the pad. - View Dependent Claims (57, 58, 59, 60)
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61. A semiconductor chip assembly, comprising:
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a semiconductor device; an adhesive that includes an opening; a heat spreader that includes a post, a base and a cap, wherein the post is adjacent to and integral with the base and extends above the base in an upward direction, is metallurgically bonded to the cap and thermally connects the base and the cap, the base extends below the post in a downward direction opposite the upward direction, covers the post in the downward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions, and the cap extends above and is adjacent to and covers in the upward direction and extends laterally from a top of the post; and a conductive trace that includes a pad and a terminal; wherein the semiconductor device is mounted on the cap, overlaps the post, is electrically connected to the pad and thereby electrically connected to the terminal, and is thermally connected to the cap and thereby thermally connected to the base; wherein the adhesive is mounted on and extends above the base, contacts the post, the base and the cap, is sandwiched between the base and the pad, extends laterally from the post to or beyond the terminal and extends to peripheral edges of the assembly; wherein the pad is mounted on and extends above the adhesive; and wherein the post extends into the opening, the cap overlaps the adhesive and is coplanar with the pad, the cap is thinner than the pad where the cap is adjacent to the top of the post, the cap is above a bottom surface of the pad where the cap is adjacent to the top of the post, the cap is below a top surface of the pad where the cap is adjacent to the top of the post and the base, the cap, the pad and the terminal are primarily copper. - View Dependent Claims (62, 63, 64, 65)
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66. A semiconductor chip assembly, comprising:
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a semiconductor device; an adhesive that includes an opening; a heat spreader that includes a post, a base and a cap, wherein the post is adjacent to and integral with the base and extends above the base in an upward direction, is metallurgically bonded to the cap and thermally connects the base and the cap, the base extends below the post in a downward direction opposite the upward direction, covers the post in the downward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions, and the cap extends above and is adjacent to and covers in the upward direction and extends laterally from a top of the post; and a conductive trace that includes a pad and a terminal; wherein the semiconductor device is mounted on the cap, overlaps the post, is electrically connected to the pad and thereby electrically connected to the terminal, and is thermally connected to the cap and thereby thermally connected to the base; wherein the adhesive is mounted on and extends above the base, contacts the post, the base and the cap, is sandwiched between the base and the pad and between the base and the cap, extends laterally from the post to or beyond the terminal and extends to peripheral edges of the assembly; wherein the pad is mounted on and extends above the adhesive; wherein the post extends into the opening, the cap overlaps the adhesive and covers the opening in the upward direction and the base extends below the semiconductor device and the pad; and wherein the pad and the cap have the same thickness where closest to one another, have different thickness where the cap is adjacent to the post and are coplanar with one another above the adhesive at a surface that faces in the upward direction. - View Dependent Claims (67, 68, 69, 70)
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71. A semiconductor chip assembly, comprising:
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a semiconductor device; an adhesive that includes an opening; a heat spreader that includes a post, a base and a cap, wherein the post is adjacent to and integral with the base and extends above the base in an upward direction, is metallurgically bonded to the cap and thermally connects the base and the cap, the base extends below the post in a downward direction opposite the upward direction, covers the post in the downward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions, and the cap extends above and is adjacent to and covers in the upward direction and extends laterally from a top of the post; a substrate that includes a dielectric layer, wherein an aperture extends through the dielectric layer; and a conductive trace that includes a pad and a terminal; wherein the semiconductor device is mounted on the cap, overlaps the post, is electrically connected to the pad and thereby electrically connected to the terminal, and is thermally connected to the cap and thereby thermally connected to the base; wherein the adhesive is mounted on and extends above the base, extends into a gap in the aperture between the post and the dielectric layer, contacts and is sandwiched between the post and the dielectric layer in the gap and between the base and the dielectric layer outside the gap, is sandwiched between the base and the pad and between the base and the cap, extends laterally from the post to or beyond the terminal and extends to peripheral edges of the assembly; wherein the dielectric layer is mounted on the adhesive, extends above the base and is spaced from the post and the base; wherein the pad is mounted on and extends above the dielectric layer; wherein the post extends into the opening and the aperture and above and below the dielectric layer, the cap contacts and overlaps the adhesive and the dielectric layer and covers the opening and the aperture in the upward direction and the base extends below the semiconductor device and the pad; and wherein the pad and the cap have the same thickness where closest to one another, have different thickness where the cap is adjacent to the post and are coplanar with one another above the adhesive and the dielectric layer at a surface that faces in the upward direction. - View Dependent Claims (72, 73, 74, 75)
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Specification