Detection of arcing events in wafer plasma processing through monitoring of trace gas concentrations
First Claim
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1. A method of detecting substrate arcing in a semiconductor plasma processing apparatus, comprising:
- placing a substrate on a substrate support in a reaction chamber of a plasma processing apparatus;
introducing process gas into the reaction chamber;
generating a plasma from the process gas;
processing the substrate with the plasma;
monitoring intensities of real-time mass-spectrometry signals of selected gas species produced in the reaction chamber during plasma processing, wherein the selected gas species are generated by a substrate arcing event; and
detecting the arcing event when the intensities are above a threshold value.
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Abstract
A method of detecting substrate arcing in a semiconductor plasma processing apparatus is provided. A substrate is placed on a substrate support in a reaction chamber of a plasma processing apparatus. Process gas is introduced into the reaction chamber. A plasma is generated from the process gas and the substrate is processed with the plasma. Intensities of real-time spectrometry signals of selected gas species produced in the reaction chamber during plasma processing are monitored. The selected gas species are generated by a substrate arcing event. The arcing event is detected when the intensities are above a threshold value.
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13 Claims
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1. A method of detecting substrate arcing in a semiconductor plasma processing apparatus, comprising:
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placing a substrate on a substrate support in a reaction chamber of a plasma processing apparatus; introducing process gas into the reaction chamber; generating a plasma from the process gas; processing the substrate with the plasma; monitoring intensities of real-time mass-spectrometry signals of selected gas species produced in the reaction chamber during plasma processing, wherein the selected gas species are generated by a substrate arcing event; and detecting the arcing event when the intensities are above a threshold value. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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