Reinforced chip package structure

• US 8,158,999 B2
• Filed: 03/11/2009
• Issued: 04/17/2012
• Est. Priority Date: 03/14/2008
• Status: Expired due to Fees

• Current Assignee: Sung Jung Minute Industry Co., Ltd.
• Original Assignee: Sung Jung Minute Industry Co., Ltd.
• Inventors: Huang, Wen-Huo
• Primary Examiner(s): Sefer, A.
• Assistant Examiner(s): YUSHIN, NIKOLAY K
• Application Number:
  US12/401,626
• Publication Number:
  US 20090230423A1
• Time in Patent Office: 1,133 Days
• Field of Search: 257/79, 257/81, 257/99, 257/100, 257/E33.057, 257/666, 257/676, 257/731, 362/257, 362/294, 362/800
• US Class Current: 257/99
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/483 Containers
• CPC Class Codes: H01L 33/54 having a particular shape

Abstract

A reinforced chip package structure includes a light emitting element, a base, and a package member. The base has a base deck and a jutting bearing deck on the base deck to hold the light emitting element. The base deck and the bearing deck are interposed by an elevation difference section. On the elevation difference section, there is an annular retaining structure. The package member is located on the base and covers at least the bearing deck and the retaining structure. The package member has an anchor structure corresponding to the retaining structure. The retaining structure and the anchor structure are coupled together to harness the base and the package member from moving against each other. Thus the base and package member form a reinforced bonding between them without separating from each other when subject to external forces, therefore provide improved protection for the light emitting element.

Claims

1. A reinforced chip package structure, comprising:

a light emitting element;

a base which has a base deck and a jutting bearing deck on the base deck to hold the light emitting element, the base deck and the bearing deck being interposed by an elevation difference section, the elevation difference section integrally forming an annular retaining structure on the vertical surface thereof, and

a package member which is located on the base and encompasses the bearing deck and the retaining structure and has an anchor structure corresponding to and latching the retaining structure to harness the base and the package member from moving relative to each other.

2. The reinforced chip package structure of claim 1, wherein the retaining structure has an annular groove formed around the elevation difference section.

3. The reinforced chip package structure of claim 1, wherein the bearing deck has a holding trough to hold the light emitting element.

4. The reinforced chip package structure of claim 1, wherein the package member has a lens portion corresponding to the light emitting element.

5. The reinforced chip package structure of claim 1, wherein the retaining structure has an annular ridge formed around the elevation difference section.

6. The reinforced chip package structure of claim 5, wherein the annular ridge has a lower edge directing towards the base deck and an upper edge directing towards the bearing deck, the upper edge having a greater cross section area than the lower edge.

7. The reinforced chip package structure of claim 1, wherein the retaining structure includes at least two wedge members which are separated and located at different levels.

8. The reinforced chip package structure of claim 7, wherein the wedge members have distal ends located on the same vertical surface.

9. The reinforced chip package structure of claim 7, wherein each of the wedge members is an arched groove.

10. The reinforced chip package structure of claim 7, wherein the bearing deck has a holding trough to hold the light emitting element.

11. The reinforced chip package structure of claim 7, wherein the package member has a lens portion corresponding to the light emitting element.

12. The reinforced chip package structure of claim 7, wherein each of the wedge members is formed in an arched shape extending outwards.

13. The reinforced chip package structure of claim 12, wherein each of the wedge members has a lower edge directing towards the base deck and an upper edge directing towards the bearing deck, the upper edge having a greater cross section area than the lower edge.

14. The reinforced chip package structure of claim 1, wherein the retaining structure has at least two retaining planes and two retaining members located between the retaining planes, two neighboring retaining plane and retaining member are being interposed by the elevation difference section formed in an alternate manner.

15. The reinforced chip package structure of claim 14, wherein the retaining member is formed of an arched groove.

16. The reinforced chip package structure of claim 14, wherein the bearing deck has a holding trough to hold the light emitting element.

17. The reinforced chip package structure of claim 14, wherein the package member has a lens portion corresponding to the light emitting element.

18. The reinforced chip package structure of claim 14, wherein the base deck is formed in a square shape and has arched corners.

19. The reinforced chip package structure of claim 14, wherein the retaining member is formed in an arched shape extending outwards.

20. The reinforced chip package structure of claim 19, wherein the retaining member has a lower edge directing towards the base deck and an upper edge directing towards the bearing deck, the upper edge having a greater cross section area than the lower edge.