Semiconductor device

• US 8,159,043 B2
• Filed: 03/09/2005
• Issued: 04/17/2012
• Est. Priority Date: 03/12/2004
• Status: Active Grant

• Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Original Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Inventors: Yamazaki, Shunpei, Arao, Tatsuya
• Primary Examiner(s): SMITH, BRADLEY
• Application Number:
  US10/583,365
• Publication Number:
  US 20070120681A1
• Time in Patent Office: 2,596 Days
• Field of Search: 257/531
• US Class Current: 257/531
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/07775 the antenna being on-chip
• CPC Class Codes: G06K 19/07779 the inductive antenna being a coil
• CPC Class Codes: H01L 27/12 the substrate being other than a semiconductor body, e.g. an insulating body
• CPC Class Codes: H01L 27/1214 comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
• CPC Class Codes: H01L 27/1266 the substrate on which the devices are formed not being the final device substrate, e.g. using a temporary substrate
• CPC Class Codes: H01L 27/13 combined with thin-film or thick-film passive components
• CPC Class Codes: H01Q 1/2208 associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems methods or arrangements for sensing record carriers, e.g. for reading patterns G06K7/00; record carrier for use with machines and with at least a part designed to carry digital markings G06K19/00
• CPC Class Codes: H01Q 1/2283 mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 23/00 Antennas with active circuits or circuit elements integrated within them or attached to them

Abstract

A semiconductor device such as an ID chip of the present invention includes an integrated circuit using a semiconductor element formed by using a thin semiconductor film, and an antenna connected to the integrated circuit. It is preferable that the antenna is formed integrally with the integrated circuit, since the mechanical strength of an ID chip can be enhanced. Note that the antenna used in the present invention also includes a conducting wire that is wound round circularly or spirally and fine particles of a soft magnetic material are arranged between the conducting wires. Specifically, an insulating layer in which fine particles of a soft magnetic material are arranged between the conducting wires. Specifically, an insulating layer in which fine particles of a soft magnetic material are included is arranged between the conducting wires.

Claims

1. A semiconductor device comprising:

a substrate,

an integrated circuit including a thin film transistor,

an antenna having a conducting wire comprising a first portion and a second portion defining a gap therebetween, and

an insulating film comprising at least one selected from the group of polyimide, epoxy, acryl and polyamide over the conducting wire and the integrated circuit to fill the gap between the first portion and the second portion,

wherein the integrated circuit and the antenna are formed over the substrate to be electrically connected to each other, and

particles comprising a soft magnetic material are included in the insulating film.

10. The semiconductor device according to any one of claims 1 to 9, wherein the integrated circuit and the antenna are formed over a flexible substrate.

11. The semiconductor device according to any one of claims 1 to 9, wherein the conducting wire is formed by an electroplating method, an electroless plating method, a printing method, or a droplet discharging method.

12. The semiconductor device according to any one of claims 1 to 9, wherein the conducting wire includes a first conductor and a second conductor covering the first conductor.

13. The semiconductor device according to claim 12, wherein the second conductor is formed by an electroplating method, an electroless plating method, or a droplet discharging method.

14. The semiconductor device according to claims 1 to 9, wherein the soft magnetic material is Fe;

Co;

Ni;

an alloy including at least one of Fe, Co, and Ni;

3Y₂O₃.5Fe₂O₃ (YIG);

Fe₂O₃;

Fe—

Si—

Al alloy;

Fe—

Cr alloy;

FeP alloy;

a permalloy in which Ni or Ni—

Fe alloy is added with at least one of Mo, Cu, Cr, and Nb;

or a soft ferrite.

15. The semiconductor device according to claim 1, wherein the antenna is provided over the integrated circuit.

2. A semiconductor device comprising:

a substrate,

an integrated circuit including a thin film transistor,

an antenna having a conducting wire comprising a first portion and a second portion defining a gap therebetween, and

a resin film comprising at least one selected from the group of polyimide, epoxy, acryl and polyamide over the conducting wire and the integrated circuit to fill the gap between the first portion and the second portion,

wherein the integrated circuit and the antenna are formed over the substrate to be electrically connected to each other, and

particles comprising a soft magnetic material are included in the resin film.

16. The semiconductor device according to claim 2, wherein the antenna is provided over the integrated circuit.

3. A semiconductor device comprising:

a substrate,

an integrated circuit including a thin film transistor,

an antenna having a conducting wire,

a first insulating film over the substrate, the first insulating film covering the conducting wire and the thin film transistor, and

a second insulating film comprising at least one selected from the group of polyimide, epoxy, acryl and polyamide over the first insulating film covering the conducting wire and the integrated circuit,

wherein the integrated circuit and the antenna are formed over the substrate to be electrically connected to each other, and

particles comprising a soft magnetic material are included in the second insulating film.

17. The semiconductor device according to claim 3, wherein the antenna is provided over the integrated circuit.

4. A semiconductor device comprising:

a substrate,

an integrated circuit including a thin film transistor,

an antenna having a conducting wire,

an insulating film over the substrate, the insulating film covering the conducting wire and the thin film transistor, and

a resin film comprising at least one selected from the group of polyimide, epoxy, acryl and polyamide over the insulating film covering the conducting wire and the integrated circuit,

wherein the integrated circuit and the antenna are formed over the substrate to be electrically connected to each other, and

particles comprising a soft magnetic material are included in the resin film.

18. The semiconductor device according to claim 4, wherein the antenna is provided over the integrated circuit.

5. A semiconductor device comprising:

a substrate,

an integrated circuit including a thin film transistor,

an antenna having a conducting wire,

a first insulating film covering the thin film transistor,

a second insulating film over the first insulating film,

the conducting wire over the second insulating film, and

a third insulating film over the conducting wire,

wherein the integrated circuit and the antenna are formed over the substrate to be electrically connected to each other, and

fine particles of a soft magnetic material are included in the second insulating film and the third insulating film.

6. A semiconductor device comprising:

a substrate,

an integrated circuit including a thin film transistor,

an antenna having a conducting wire,

a first insulating film covering the thin film transistor,

a second insulating film over the first insulating film,

the conducting wire over the second insulating film,

a third insulating film over the conducting wire, and

a fourth insulating film over the third insulating film,

wherein the integrated circuit and the antenna are formed over the substrate to be electrically connected to each other, and

fine particles of a soft magnetic material are included in the second insulating film and the fourth insulating film.

7. A semiconductor device comprising:

a substrate,

an integrated circuit including a thin film transistor,

an antenna having a conducting wire,

a first insulating film at least covering the conducting wire, and

a second insulating film covering the first insulating film and the thin film transistor,

wherein the integrated circuit and the antenna are formed over the substrate to be electrically connected to each other,

the conducting wire is formed from a same material as a gate electrode of the thin film transistor, and is formed on a same layer, and

fine particles of a soft magnetic material are included in the first insulating film.

8. A semiconductor device comprising:

a substrate,

an integrated circuit including a thin film transistor,

an antenna having a conducting wire,

a first insulating film covering the conducting wire and the thin film transistor, and

a second insulating film comprising at least one selected from the group of polyimide, epoxy, acryl and polyamide over the integrated circuit and at least adjacent to a side of the conducting wire by interposing the first insulating film therebetween,

wherein the integrated circuit and the antenna are formed over the substrate to be electrically connected to each other, and

particles comprising a soft magnetic material are included in the second insulating film.

19. The semiconductor device according to claim 8, wherein the antenna is provided over the integrated circuit.

21. The semiconductor device according to claim 8, wherein the substrate is a first substrate, and

wherein a second substrate is formed over the second insulating film.

9. A semiconductor device comprising:

a substrate,

an integrated circuit including a thin film transistor,

an antenna having a conducting wire,

an insulating film covering the conducting wire and the thin film transistor, and

a resin film comprising at least one selected from the group of polyimide, epoxy, acryl and polyamide over the integrated circuit and at least adjacent to a side of the conducting wire by interposing the insulating film therebetween,

wherein the integrated circuit and the antenna are formed over the substrate to be electrically connected to each other, and

particles comprising a soft magnetic material are included in the resin film.

20. The semiconductor device according to claim 9, wherein the antenna is provided over the integrated circuit.

22. The semiconductor device according to claim 9, wherein the substrate is a first substrate, and

wherein a second substrate is formed over the insulating film.