High-power LED lamp

• US 8,159,152 B1
• Filed: 05/19/2009
• Issued: 04/17/2012
• Est. Priority Date: 05/20/2008
• Status: Active Grant

• Current Assignee: Nader Salessi
• Original Assignee: Nader Salessi
• Inventors: Salessi, Nader
• Primary Examiner(s): Owens, Douglas W
• Assistant Examiner(s): PHAM, THAI N
• Application Number:
  US12/454,532
• Time in Patent Office: 1,064 Days
• Field of Search: 315/113, 315/291, 315/309, 362/327, 362/362, 362/373, 362/547, 257/E33.059, 257/E25.02, 257/E23.082, 257/290
• US Class Current: 315/309
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: F21V 29/54 using thermoelectric means, e.g. Peltier elements
• CPC Class Codes: F21V 29/74 with fins or blades
• CPC Class Codes: F21W 2131/103 of streets or roads
• CPC Class Codes: F21W 2131/105 of arenas or the like
• CPC Class Codes: F21Y 2105/10 comprising a two-dimensional array of point-like light-generating elements
• CPC Class Codes: F21Y 2107/00 Light sources with three-dimensionally disposed light-generating elements
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 33/645 the elements being electrically controlled, e.g. Peltier elements
• CPC Class Codes: H05B 45/30 Driver circuits
• CPC Class Codes: H05B 45/395 Linear regulators

Abstract

A high-power light-emitting diode (LED) lamp has a plurality of units. Each unit includes an LED die and a thermo-electric cooling device coupled to the LED die. A power source supplies a fixed current to the thermo-electric cooling device wherein the fixed current is based on heat generated by the LED die in normal operation. Accordingly, the unit operates without a controller.

Claims

1. A unit for a high-power LED lamp, comprising:

an LED die;

a thermo-electric cooling device coupled to the LED die; and

a power source supplying a predetermined fixed current to the thermo-electric cooling device, wherein the predetermined fixed current is based on heat generated by the LED die in normal operation enabling the thermo-electric cooling device to operate without a controller;

wherein the predetermined fixed current is based on junction temperature of the LED die.

2. The unit of claim 1, wherein the thermo-electric cooling device is positioned at a hot-spot of the LED die.

3. The unit of claim 1, wherein the fixed current is set according to a predetermined value based on the heat generated by the LED die.

4. The unit of claim 1, wherein the fixed current is set to optimize energy consumption of LED lamp by enabling maximum light output from the LED lamp.

5. The unit of claim 1, wherein the thermo-electric cooling device is a thin film device.

6. The unit of claim 1, wherein the thermo-electric cooling device is a micro thermo-electric cooling device.

7. The unit of claim 1 further comprising:

a heat sink coupled to the thermo-electric cooling device; and

a thermo-electric generator coupled to the heat sink, the thermo-electric generator generating a current from heat from the heat sink, the current being provided to the thermo-electric cooling device.

8. A unit for a high-power LED lamp, comprising:

an LED die;

a thermo-electric cooling device coupled to the LED die; and

a means for supplying a predetermined fixed current to the thermo-electric cooling device, wherein the predetermined fixed current is based on heat generated by the LED die in normal operation enabling the thermo-electric cooling device to operate without a controller;

wherein the predetermined fixed current is based on junction temperature of the LED die.

9. A module for a high-power LED lamp, comprising:

a conductive substrate;

a plurality of LED units mounted on the conductive substrate wherein each LED unit of the plurality includes an LED die and a thermo-electric cooling device thermally coupled to the LED die; and

means for supplying each thermo-electric cooling device with a predetermined fixed current, wherein the predetermined fixed current is based on a typical usage factor of the module, the means enabling the thermo-electric cooling device to operate without a controller;

wherein the predetermined fixed current is based on junction temperature of the LED die.

10. The module of claim 9, wherein the substrate includes a conductive layer.

11. The module of claim 9, wherein the fixed current is based on a predetermined level of cooling.

12. The module of claim 11, wherein the level of cooling is determined by optimizing light output, energy use and lamp life.

13. The module of claim 9, wherein the thermo-electric cooling device is a nanotechnology cooling device.

14. The module of claim 9, wherein the thermo-electric cooling device is located at a hot spot on the LED die.

15. The module of claim 9, wherein the module is configured to mate with at least one other module to form a multi-module high power LED lamp.

16. The module of claim 9, wherein the module is configured to be located in and to operate in an array of modules forming a multi-module high power LED lamp, each module further configured to be replaceable.

17. A high power LED lamp, comprising:

a plurality of LED modules configured to operate together to provide light, each module configured to be removable and replaceable, each module including;

a conductive substrate;

a plurality of LED units mounted on the conductive substrate wherein each LED unit of the plurality includes an LED die and a thermo-electric cooling device thermally coupled to the LED die; and

means for supplying each thermo-electric cooling device with a predetermined fixed current, wherein the fixed current is based on a typical usage factor of the high power LED lamp, the means enabling the thermo-electric cooling device to operate without a controller;

wherein the predetermined fixed current is based on junction temperature of the LED die.

18. The high power LED lamp of claim 17, wherein the means for supplying each thermo-electric cooling unit with a fixed current includes a single power supply providing power to the plurality of LED modules.

19. The high-power LED lamp of claim 17, wherein the plurality of modules is configured and arranged in a non-planar arrangement.

20. The high-power LED lamp of claim 17, wherein the plurality of modules is configured and arranged to provide illumination according to a specific lighting purpose.

21. The high power LED lamp of claim 17, wherein the plurality of modules is configured and arranged to provide illumination as a light pattern specific to a particular application.