Phosphor distribution in LED lamps using centrifugal force
First Claim
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1. A method of manufacturing an LED lamp comprising:
- admixing an uncured curable liquid resin and a phosphor to create an admixture;
dispensing the admixture on an LED chip; and
centrifuging the chip and the admixture such that a centrifugal force normal to a surface on which the LED chip is mounted causes the phosphor particles to settle at a desired position with respect to the LED chip.
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Abstract
A method of manufacturing an LED lamp is disclosed. The method includes admixing an uncured curable liquid resin and a phosphor, dispensing the uncured admixture on an LED chip, centrifuging the chip and the admixture to disperse the phosphor particles in the uncured resin, and curing the resin while the phosphor particles remain distributed.
167 Citations
23 Claims
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1. A method of manufacturing an LED lamp comprising:
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admixing an uncured curable liquid resin and a phosphor to create an admixture; dispensing the admixture on an LED chip; and centrifuging the chip and the admixture such that a centrifugal force normal to a surface on which the LED chip is mounted causes the phosphor particles to settle at a desired position with respect to the LED chip. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
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19. A method of manufacturing an LED lamp comprising:
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admixing an uncured polysiloxane resin and a phosphor that emits predominantly in the yellow portion of the spectrum when excited by frequencies from the blue portion of the visible spectrum to create an admixture; placing the uncured admixture and an LED chip formed from the Group III nitride material system and that emits in the blue portion of the visible spectrum into a reflector; centrifuging the reflector and the admixture such that a centrifugal force causes the phosphor particles to settle at a desired position proximate to the LED chip in the uncured polysiloxane resin; and curing the resin while the phosphor particles remain settled proximate to the LED chip. - View Dependent Claims (20, 21, 22, 23)
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Specification