Wireless frequency tag and method for manufacturing wireless frequency tag

• US 8,172,149 B2
• Filed: 01/27/2010
• Issued: 05/08/2012
• Est. Priority Date: 08/13/2007
• Status: Active Grant

• Current Assignee: Fujitsu Limited
• Original Assignee: Fujitsu Limited
• Inventors: Yamagajo, Takashi, Maniwa, Toru, Kai, Manabu
• Primary Examiner(s): LEE, SEUNG H
• Application Number:
  US12/694,787
• Publication Number:
  US 20100127085A1
• Time in Patent Office: 832 Days
• Field of Search: 235/492, 235/380, 235/435
• US Class Current: 235/492
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/07786 the antenna being of the HF type, such as a dipole
• CPC Class Codes: H01Q 1/2225 used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
• CPC Class Codes: H01Q 1/40 Radiating elements coated with or embedded in protective material
• CPC Class Codes: H01Q 7/00 Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
• CPC Class Codes: Y10T 29/49018 with other electrical component
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing

Abstract

A wireless frequency tag includes a loop-shaped antenna pattern that is electrically connected to a chip connecting section, and a conducting member that electrically couples a part of the antenna pattern.

Claims

1. A wireless frequency tag comprising:

a flat substrate;

an antenna pattern, having a chip connecting section to be coupled to a chip, that is formed on at least three surfaces of the flat substrate wrapping around the flat substrate; and

a conducting member that couples a part of the antenna pattern formed on one surface with a part of the antenna pattern formed on other surface of the flat substrate, wherein

the antenna pattern is provided on a surface of a dielectric member,

the conducting member includes a through-hole that couples the antenna patterns on each surface of the dielectric member through the inside of the dielectric member,

a conductor plating is provided on a part of the inner wall of the through-hole, and wherein the area of the conductor plating is decreased as the radius of through-hole is increased.

2. A method for manufacturing a wireless frequency tag, the method comprising:

forming an antenna pattern, having a chip connecting section to be coupled to a chip, on at least three surfaces of a flat substrate wrapping around the flat substrate; and

forming a conducting member that couples a part of the antenna pattern formed on one surface with a part of the antenna pattern formed on other surface of the flat substrate, wherein

the antenna pattern is provided on a surface of a dielectric member,

the conducting member includes a through-hole that couples the antenna patterns on each surface of the dielectric member through the inside of the dielectric member,

a conductor plating is provided on a part of the inner wall of the through-hole, and wherein the area of the conductor plating is decreased as the radius of through-hole is increased.

3. The method for manufacturing a wireless frequency tag according to claim 2, wherein impedance matching with the chip is adjusted by changing a spacing between a plurality of conducting members.