Increased capacity semiconductor package

• US 8,184,453 B1
• Filed: 07/31/2008
• Issued: 05/22/2012
• Est. Priority Date: 07/31/2008
• Status: Active Grant

• Current Assignee: Amkor Technology Singapore Holding Pte., Ltd. (Amkor Technology Incorporated)
• Original Assignee: Amkor Technology Incorporated
• Inventors: Kim, Jae Yoon, Kim, Gi Jeong, Moon, Myung Soo
• Primary Examiner(s): Semenenko, Yuriy
• Application Number:
  US12/183,979
• Time in Patent Office: 1,391 Days
• Field of Search: 174/520, 174/536, 174/537, 174/260, 174/261, 257/665, 257/666, 257/667, 257/668, 257/669, 257/692, 257/696, 257/713, 257/734, 361/813, 361/820, 361767-771
• US Class Current: 361/813
• CPC Class Codes: H01L 21/4828 Etching etching for cleaning without patterning H01L21/4835
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48245 the item being metallic
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/92247 the second connecting process involving a wire connector
• CPC Class Codes: H01L 23/3107 the device being completely enclosed
• CPC Class Codes: H01L 23/49541 Geometry of the lead-frame
• CPC Class Codes: H01L 23/49548 Cross section geometry H01L23/49562 takes precedence
• CPC Class Codes: H01L 23/49582 Metallic layers on lead frames
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/18301 being an anchoring portion, i.e. mechanical interlocking between the encapsulation resin and another package part
• CPC Class Codes: H01L 2924/207 : Diameter ranges

Abstract

Disclosed is a lead frame and a semiconductor device including the same. The lead frame is provided with a die pad, and first, second and third lands sequentially arranged on an outer circumferential edge. The lead frame can separate the first and second lands or the die pad and the first land using a plating layer formed on the lead frame as a mask, instead of using a separate mask by etching after the application of the encapsulant. As a result thereof, a plurality of lands can be formed at low cost, in comparison with a conventional method. Additionally, the first, second and third lands are exposed to the outside through a lower portion of an encapsulant, and can be surface mounted on an external device through the first, second and third lands. A plating layer formed on bottom surfaces of the first, second and third lands of the lead frame and a process for separately plating nickel (Ni)/gold (An), Ni/Pd/Au, or tin (Sn) can be omitted so as to easily surface mount the semiconductor device to the external device.

Claims

1. A lead frame, comprising:

a die pad;

a plurality of tie bars extending outwardly from the die pad;

a frame connecting the tie bars to each other;

a plurality of extended leads extending from the frame toward the die pad at a predetermined pitch, each of the extended leads being of a first length and including first and second lands spaced from the die pad at a predetermined distance, each of the extended leads further having opposed top and bottom surfaces and a half etched portion which is formed between the first and second lands only on the top surface thereof; and

a plurality of normal leads extending from the frame toward the die pad at a predetermined pitch, each of the normal leads being of a second length which is less than the first length and including a third land spaced from the die pad at a predetermined distance, each of the normal leads further having opposed top and bottom surfaces and a half etched portion which is formed between the third land and the frame only on the bottom surface thereof.

2. The lead frame of claim 1, wherein a plating layer is formed on the die pad, the first and second lands of the extended leads, the normal leads, the tie bars and the frame.

3. The lead frame of claim 2, wherein the plating layer covers the entirety of the die pad, each of the normal leads, and each of the tie bars.

4. The lead frame of claim 1, wherein each of the extended leads is positioned between a corresponding pair of the normal leads.

5. The lead frame of claim 2, wherein the plating layer covers the entirety of the first and second lands of each of the extended leads.

6. A lead frame, comprising:

a die pad;

a plurality of tie bars extending outwardly from the die pad;

a frame connecting the tie bars to each other;

a plurality of projection leads extending from the die pad at a predetermined pitch, each of the projection leads including a first land, opposed top and bottom surfaces and a half etched portion which is formed between the first land and the die pad only on the top surface thereof;

a plurality of second lands extending from the frame toward the die pad at a predetermined pitch, each of the second lands being of a first length; and

a plurality of normal leads extending from the frame toward the die pad at a predetermined pitch, each of the normal leads being of a second length which exceeds the first length and including a third land spaced from the die pad at a predetermined distance, each of the normal leads further having opposed top and bottom surfaces and a half etched portion which is formed between the third land and the frame only on the bottom surface thereof.

7. The lead frame of claim 6, wherein a plating layer is formed on the die pad, the first and second lands of the projection leads, the normal leads, the tie bars and the frame.

8. The lead frame of claim 7, wherein the plating layer covers the entirety of each of the normal leads, each of the second lands, and each of the tie bars.

9. The lead frame of claim 6, wherein the projection leads are linearly aligned with respective ones of the second lands.

10. The lead frame of claim 7, wherein the plating layer covers the entirety of the first land of each of the projection leads.

11. A lead frame, comprising:

a die pad;

a plurality of tie bars extending outwardly from the die pad;

a dambar connecting the tie bars to each other;

a land connection bar extending about the die pad in spaced relation thereto and connecting the tie bars to each other;

a plurality of first lands extending from the land connection bar toward the die pad at a predetermined pitch;

a plurality of extended leads extending from the land connection bar toward the dambar at a predetermined pitch, each of the extended leads including a second land;

a plurality of normal leads extending from the dambar toward the die pad at a predetermined pitch, the normal leads alternating with the extended leads; and

a plurality of external leads extending outwardly from the dambar at a constant length, each of the external leads being aligned with a respective one of the normal leads.

12. The lead frame of claim 11, wherein the land connection bar has top and bottom surfaces and a half etched portion which is formed on the top surface thereof.

13. The lead frame of claim 11, wherein a plating layer is formed on the die pad, the first lands, the extended leads, the normal leads, the tie bars, the dambar and the external leads.

14. The lead frame of claim 11, wherein a downset is formed in each of the tie bars, the extended leads and the normal leads.

15. The lead frame of claim 11, wherein each first land is linearly aligned with a respective one of the second lands.

16. A lead frame, comprising:

a die pad;

a plurality of tie bars extending outwardly from the die pad;

a dambar connecting the tie bars to each other;

a plurality of projection leads extending from the die pad toward the dambar at a predetermined pitch, each of the projection leads including a first land;

a land connection bar extending about the die pad in spaced relation thereto and connecting the tie bars to each other;

a plurality of extended leads extending from the land connection bar toward the dambar at a predetermined pitch, each of the extended leads being of a first length and including a second land;

a plurality of normal leads extending from the dambar toward the die pad at a predetermined pitch, each of the normal leads being of a second length which exceeds the first length, the normal leads further alternating with the extended leads; and

a plurality of external leads extending outwardly from the dambar at a constant length, each of the external leads being aligned with a respective one of the normal leads.

17. The lead frame of claim 16, wherein each of the projection leads has top and bottom surfaces and a half etched portion which is formed between the first land and the die pad on the top surface thereof.

18. The lead frame of claim 16, wherein a plating layer is formed on the die pad, the first land of each of the projection leads, the extended leads, the normal leads, the tie bars, the dambar and the external leads.

19. The lead frame of claim 16, wherein a downset is formed in each of the tie bars, the extended leads and the normal leads.

20. The lead frame of claim 16, wherein each first land is linearly aligned with a respective one of the second lands.