Integrated circuit package including miniature antenna

• US 8,203,488 B2
• Filed: 09/29/2008
• Issued: 06/19/2012
• Est. Priority Date: 11/07/2002
• Status: Active Grant

• Current Assignee: Fractus SA
• Original Assignee: Fractus SA
• Inventors: Soler Castany, Jordi, Anguera Pros, Jaume, Puente Baliarda, Carles, Borja Borau, Carmen
• Primary Examiner(s): Choi, Jacob Y
• Assistant Examiner(s): BUCHANAN, SHAWN M
• Application Number:
  US12/240,088
• Publication Number:
  US 20090085810A1
• Time in Patent Office: 1,359 Days
• Field of Search: 343/700.MS, 343/741, 343/767, 343/793, 343/895, 343/702, 343/720, 343/803, 343/804, 343/806, 343/809
• US Class Current: 343/700.0MS
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device antennas per se H01Q
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48265 the item being a discrete passive component
• CPC Class Codes: H01L 2224/48464 the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/85203 Thermocompression bonding
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 25/165 Containers
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01004 : Beryllium [Be]
• CPC Class Codes: H01L 2924/01019 : Potassium [K]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/09701 : Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/1423 : Monolithic Microwave Integrated Circuit [MMIC]
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: H01L 2924/30107 : Inductance
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: H01L 2924/30111 : matching
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H01Q 1/22 : by structural association with other equipment or articles
• CPC Class Codes: H01Q 1/2283 : mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
• CPC Class Codes: H01Q 1/36 : Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewithH01Q1/08, H01Q1/14 take precedence
• CPC Class Codes: H01Q 1/38 : formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 1/40 : Radiating elements coated with or embedded in protective material
• CPC Class Codes: H01Q 13/10 : Resonant slot antennas
• CPC Class Codes: H01Q 9/045 : with particular feeding means for circular polarisation H01Q9/0428
• CPC Class Codes: H01Q 9/26 : with folded element or elements, the folded parts being spaced apart a small fraction of operating wavelength resonant loop antennas H01Q7/00
• CPC Class Codes: H01Q 9/30 : with feed to end of elongated active element, e.g. unipole H01Q9/44 takes precedence
• CPC Class Codes: H01Q 9/40 : Element having extended radiating surface
• CPC Class Codes: H01Q 9/42 : with folded element, the folded parts being spaced apart a small fraction of the operating wavelength

Abstract

The present invention relates to an integrated circuit package comprising at least one substrate, each substrate including at least one layer, at least one semiconductor die, at least one terminal, and an antenna located in the integrated circuit package, but not on said at least one semiconductor die. The conducting pattern comprises a curve having at least five sections or segments, at least three of the sections or segments being shorter than one-tenth of the longest free-space operating wavelength of the antenna, each of the five sections or segments forming a pair of angles with each adjacent segment or section, wherein the smaller angle of each of the four pairs of angles between sections or segments is less than 180° (i.e., no pair of sections or segments define a longer straight segment), wherein at least two of the angles are less than 115°, wherein at least two of the angles are not equal, and wherein the curve fits inside a rectangular area the longest edge of which is shorter than one-fifth of the longest free-space operating wavelength of the antenna.

Claims

1. An integrated circuit package comprising:

a package housing having a major surface;

a semiconductor die disposed in a first area of the package housing; and

an antenna disposed in a second area of the package housing separate from the first area and coupled to the semiconductor die, the antenna comprising a plurality of conducting segments that form a curve, the segments connected to each other at their ends forming angles different than 180 degrees,

wherein at least two connections have angles less than 115 degrees, and

wherein the curve comprises a first pair of segments forming a turn in a clockwise direction and a second pair of segments forming a turn in a counter-clockwise direction.

2. The integrated circuit package of claim 1, wherein the segments are shorter than one-tenth of a longest free-space operating wavelength of the antenna.

3. The integrated circuit package of claim 1, wherein the second area is a rectangular area having a longest side shorter than one-fifth of a longest free-space operating wavelength of the antenna.

4. The integrated circuit package of claim 1, wherein the antenna is a monopole antenna.

5. The integrated circuit package of claim 1, wherein the antenna is a dipole antenna.

6. The integrated circuit package of claim 5, wherein the dipole antenna comprises a close proximity region where a minimum distance between conducting segments is less than one-tenth of a longest free-space operating wavelength of the antenna.

7. The integrated circuit package of claim 1, wherein the antenna is a slot antenna.

8. The integrated circuit package of claim 1, wherein the antenna is an aperture antenna.

9. The integrated circuit package of claim 1, wherein the antenna is a multi-branch antenna.

10. The integrated circuit package of claim 1, wherein the antenna is a loop antenna.

11. The integrated circuit package of claim 1, wherein the antenna is an inverted F antenna.

12. The integrated circuit package of claim 1, further comprises a second antenna disposed in the second area of the package housing.

13. The integrated circuit package of claim 1, wherein the curve is a space filling curve.

14. The integrated circuit package of claim 1, wherein at least one connection forms a 90 degree angle.

15. The integrated circuit package of claim 14, wherein all connections form 90 degree angles.

16. An integrated circuit package comprising:

a substrate having first and second side opposed sides; and

an antenna pattern formed on the first side of the substrate, the antenna pattern comprising a plurality of conducting segments that form a curve, the segments connected to each other at their ends where any two adjacent connected segments do not form a longer segment,

wherein at least two connections have angles less than 115 degrees, and a first angle smaller than 115 degrees and a second angle smaller than 115 degrees are defined on opposite sides of the curve, and

wherein the second side of the substrate has non-conducting material for at least 50% of an area below the antenna pattern.

17. The integrated circuit package of claim 16, wherein the segments are shorter than one-tenth of a longest free-space operating wavelength of the antenna.

18. The integrated circuit package of claim 16, wherein the antenna is disposed in a rectangular area having a longest side shorter than one-fifth of a longest free-space operating wavelength of the antenna.

19. The integrated circuit package of claim 16, further comprises a second substrate coupled to the substrate, the second substrate comprising at least one electrical component.

20. The integrated circuit package of claim 19, wherein the second substrate has non-conducting material for at least 50% of an area overlapping the antenna pattern on the first substrate.

21. The integrated circuit package of claim 19, wherein the second substrate has no conducting material on an area overlapping the antenna pattern on the first substrate.

22. The integrated circuit package of claim 16, further comprises a semiconductor die disposed on the first side of the substrate, the semiconductor die being separate from the antenna pattern.

23. The integrated circuit package of claim 22, further comprises at least one electrical connector coupling the semiconductor die and at least one package terminal.

24. The integrated circuit package of claim 23, wherein the at least one package terminal is disposed on the second side of the substrate in the area below the antenna pattern.

25. The integrated circuit package of claim 23, wherein the at least one package terminal is disposed on the second side of the substrate in an area not below the antenna pattern.

26. The integrated circuit package of claim 23, wherein the at least one electrical connector is a wire bond.

27. The integrated circuit of package claim 23, wherein the at least one electrical connector is a metal strip.

28. The integrated circuit package of claim 16, wherein the second side of the substrate has no conducting material in the area below the antenna pattern.

29. The integrated circuit package of claim 16, further comprises package terminals disposed on the second side of the substrate.

30. The integrated circuit package of claim 29, wherein the package terminals are dispersed in both the area below the antenna pattern and an area not below the antenna pattern.

31. The integrated circuit package of claim 29, wherein the package terminals are dispersed in an area not below the antenna pattern.

32. The integrated circuit package of claim 29, wherein at least one connection forms a 90 degree angle.

33. The integrated circuit package of claim 32, wherein all connections form 90 degree angles.

34. An integrated circuit package comprising:

a package housing having a plurality of package terminals provided on an exterior surface thereof; and

an antenna fully enclosed in said package, the antenna comprising a plurality of conducting segments that form a curve, the segments connected to each other at their ends, wherein each connection forms two different angles, wherein at least two connections have angles less than 115 degrees; and

a semiconductor chip provided within the package housing, the chip having a first terminal electrically coupled to the antenna and a second terminal coupled to the package terminals via wirebond connections.

35. The integrated circuit package of claim 34, wherein the segments are shorter than one-tenth of a longest free-space operating wavelength of the antenna.

36. The integrated circuit package of claim 34, wherein the antenna is disposed in a rectangular area having a longest side shorter than one-fifth of a longest free-space operating wavelength of the antenna.

37. The integrated circuit package of claim 34, wherein the package terminals cover less than 50% of an area below the antenna.

38. The integrated circuit package of claim 34, wherein at least one connection forms a 90 degree angle.

39. The integrated circuit package of claim 38, wherein all connections form 90 degree angles.

40. An integrated circuit package comprising:

a package housing having a plurality of package terminals provided on an exterior surface thereof; and

an antenna fully enclosed in said package, the antenna comprising a plurality of conducting segments that form a curve, the segments connected to each other at their ends, wherein each connection forms two different angles, wherein all connections form 90 degree angles; and

a semiconductor chip provided within the package housing, the chip having a first terminal electrically coupled to the antenna and a second terminal coupled to the package terminals via wirebond connections.